Features

• Epitaxial Planar Die Construction

• Ultra-Small Leadless Surface Mount Package

• Ideally Suited for Automated Assembly Processes

• Totally Lead Free & Fully RoHS Compliant (Notes 1 & 2)

• Halogen and Antimony Free Green Device (Note 3)

• Qualified to AEC-Q101 Standards for High Reliability

Mechanical Data

• Case: X1-DFN1006-3

• Case Material: Molded Plastic, Green Molding Compound.

UL Flammability Classification Rating 94V-0

• Moisture Sensitivity: Level 1 per J-STD-020

• Terminals: Finish — NiPdAu.

Solderable per MIL-STD-202, Method 208 e4

• Weight: 0.0009 grams (Approximate)