料位传感器

DX SERIES HIGH-DENSITY I/O CONNECTORS

General DX series high-density I/O connector with bellow contacts are perfect for tomorrows miniaturized electronic devices. This new 1.27 mm (0.050) interconnect design enusres positive locking, effortless coupling, terminal protection and EMI reduction in a miniaturized and rugged package. App

DX SERIES HIGH-DENSITY I/O CONNECTORS

General DX series high-density I/O connector with bellow contacts are perfect for tomorrows miniaturized electronic devices. This new 1.27 mm (0.050) interconnect design enusres positive locking, effortless coupling, terminal protection and EMI reduction in a miniaturized and rugged package. App

DX SERIES HIGH-DENSITY I/O CONNECTORS

General DX series high-density I/O connector with bellow contacts are perfect for tomorrows miniaturized electronic devices. This new 1.27 mm (0.050) interconnect design enusres positive locking, effortless coupling, terminal protection and EMI reduction in a miniaturized and rugged package. App

DX SERIES HIGH-DENSITY I/O CONNECTORS

General DX series high-density I/O connector with bellow contacts are perfect for tomorrows miniaturized electronic devices. This new 1.27 mm (0.050) interconnect design enusres positive locking, effortless coupling, terminal protection and EMI reduction in a miniaturized and rugged package. App

DX SERIES HIGH-DENSITY I/O CONNECTORS

General DX series high-density I/O connector with bellow contacts are perfect for tomorrows miniaturized electronic devices. This new 1.27 mm (0.050) interconnect design enusres positive locking, effortless coupling, terminal protection and EMI reduction in a miniaturized and rugged package. App

DX SERIES HIGH-DENSITY I/O CONNECTORS

General DX series high-density I/O connector with bellow contacts are perfect for tomorrows miniaturized electronic devices. This new 1.27 mm (0.050) interconnect design enusres positive locking, effortless coupling, terminal protection and EMI reduction in a miniaturized and rugged package. App

DX SERIES HIGH-DENSITY I/O CONNECTORS

General DX series high-density I/O connector with bellow contacts are perfect for tomorrows miniaturized electronic devices. This new 1.27 mm (0.050) interconnect design enusres positive locking, effortless coupling, terminal protection and EMI reduction in a miniaturized and rugged package. App

DX SERIES HIGH-DENSITY I/O CONNECTORS

General DX series high-density I/O connector with bellow contacts are perfect for tomorrows miniaturized electronic devices. This new 1.27 mm (0.050) interconnect design enusres positive locking, effortless coupling, terminal protection and EMI reduction in a miniaturized and rugged package. App

DX SERIES HIGH-DENSITY I/O CONNECTORS

General DX series high-density I/O connector with bellow contacts are perfect for tomorrows miniaturized electronic devices. This new 1.27 mm (0.050) interconnect design enusres positive locking, effortless coupling, terminal protection and EMI reduction in a miniaturized and rugged package. App

DX SERIES HIGH-DENSITY I/O CONNECTORS

General DX series high-density I/O connector with bellow contacts are perfect for tomorrows miniaturized electronic devices. This new 1.27 mm (0.050) interconnect design enusres positive locking, effortless coupling, terminal protection and EMI reduction in a miniaturized and rugged package. App

DX SERIES HIGH-DENSITY I/O CONNECTORS

General DX series high-density I/O connector with bellow contacts are perfect for tomorrows miniaturized electronic devices. This new 1.27 mm (0.050) interconnect design enusres positive locking, effortless coupling, terminal protection and EMI reduction in a miniaturized and rugged package. App

DX SERIES HIGH-DENSITY I/O CONNECTORS

General DX series high-density I/O connector with bellow contacts are perfect for tomorrows miniaturized electronic devices. This new 1.27 mm (0.050) interconnect design enusres positive locking, effortless coupling, terminal protection and EMI reduction in a miniaturized and rugged package. App

DX SERIES HIGH-DENSITY I/O CONNECTORS

General DX series high-density I/O connector with bellow contacts are perfect for tomorrows miniaturized electronic devices. This new 1.27 mm (0.050) interconnect design enusres positive locking, effortless coupling, terminal protection and EMI reduction in a miniaturized and rugged package. App

DX SERIES HIGH-DENSITY I/O CONNECTORS

General DX series high-density I/O connector with bellow contacts are perfect for tomorrows miniaturized electronic devices. This new 1.27 mm (0.050) interconnect design enusres positive locking, effortless coupling, terminal protection and EMI reduction in a miniaturized and rugged package. App

DX SERIES HIGH-DENSITY I/O CONNECTORS

General DX series high-density I/O connector with bellow contacts are perfect for tomorrows miniaturized electronic devices. This new 1.27 mm (0.050) interconnect design enusres positive locking, effortless coupling, terminal protection and EMI reduction in a miniaturized and rugged package. App

DX SERIES HIGH-DENSITY I/O CONNECTORS

General DX series high-density I/O connector with bellow contacts are perfect for tomorrows miniaturized electronic devices. This new 1.27 mm (0.050) interconnect design enusres positive locking, effortless coupling, terminal protection and EMI reduction in a miniaturized and rugged package. App

DX SERIES HIGH-DENSITY I/O CONNECTORS

General DX series high-density I/O connector with bellow contacts are perfect for tomorrows miniaturized electronic devices. This new 1.27 mm (0.050) interconnect design enusres positive locking, effortless coupling, terminal protection and EMI reduction in a miniaturized and rugged package. App

Rectifier Diodes & FRED

文件：765.32 Kbytes Page：22 Pages

Wirewound Resistors, Military/Established Reliability

文件：160.27 Kbytes Page：2 Pages

1.0 AMP FAST RECOVERY RECTIFIERS

文件：62.28 Kbytes Page：2 Pages

Non-Isolated DC/DC Converters

文件：752.33 Kbytes Page：7 Pages

UNIVERSAL INPUT AC-DC PCB OPEN FRAME SINGLE AND DUAL OUTPUT 10 WATTS INTERNAL SWITCHING POWER SUPPLIES TPVI10 SERIES

文件：317.65 Kbytes Page：2 Pages