封装/外壳：300-BBGA 包装：卷带（TR） 描述：IC TELECOM INTERFACE 300BGA 集成电路（IC） 电信

4 X 3 Twelve Channel T1 Framer

MULTI-CHIP MODULE (MCM) DESCRIPTION The Four x Four and Four x Three MCMs offer a high density packaging arrangement for the DS21Q42 T1 Enhanced Quad Framer. Either three (DS21FT42) or four (DS21FF42) silicon die of these devices is packaged in a Multi-Chip Module (MCM) with the electrical connec

4 x 3 12-Channel T1 Framer 4 x 4 16-Channel T1 Framer

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