Low Power MicroMonitor Chip

DESCRIPTION The DS1232LP/LPS Low Power MicroMonitor Chip monitors three vital conditions for a microprocessor: power supply, software execution, and external over-ride. First, a precision temperaturecompensated reference and comparator circuit monitors the status of VCC. FEATURES ■ Super-low po

Low Power MicroMonitor Chip

DESCRIPTION The DS1232LP/LPS Low Power MicroMonitor Chip monitors three vital conditions for a microprocessor: power supply, software execution, and external over-ride. First, a precision temperaturecompensated reference and comparator circuit monitors the status of VCC. FEATURES ■ Super-low po

封装/外壳：16-SOIC（0.295"，7.50mm 宽） 包装：散装 描述：IC SUPERVISOR 1 CHANNEL 16SOIC 集成电路（IC） 监控器

Low Power MicroMonitor Chip

文件：104.69 Kbytes Page：7 Pages

封装/外壳：16-SOIC（0.295"，7.50mm 宽） 包装：散装 描述：IC SUPERVISOR 1 CHANNEL 16SOIC 集成电路（IC） 监控器

Customer Specification

Construction 1) Conductor a) Material Tinned Copper, per ASTM B-33 and CID-A-A-59551, latest revision b) Stranding Solid 2) Braid Data a) Nominal Dimensions .375 x .030 Inches b) AWG of Ends 36 c) Number of Carriers 48 d) Nominal Percent Coverage N/A e) Total Number of Ends 288 f) Approx

Original Strain Relief Bushings

文件：129.02 Kbytes Page：1 Pages

Socket Outlets

文件：1.57505 Mbytes Page：4 Pages

Variable RF Inductor

文件：324.96 Kbytes Page：2 Pages

SCREW TERMINALS

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