Low Power MicroMonitor Chip

DESCRIPTION The DS1232LP/LPS Low Power MicroMonitor Chip monitors three vital conditions for a microprocessor: power supply, software execution, and external over-ride. First, a precision temperaturecompensated reference and comparator circuit monitors the status of VCC. FEATURES ■ Super-low po

Low Power MicroMonitor Chip

DESCRIPTION The DS1232LP/LPS Low Power MicroMonitor Chip monitors three vital conditions for a microprocessor: power supply, software execution, and external over-ride. First, a precision temperaturecompensated reference and comparator circuit monitors the status of VCC. FEATURES ■ Super-low po

Low Power MicroMonitor Chip

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封装/外壳：16-SOIC（0.295"，7.50mm 宽） 包装：散装 描述：IC SUPERVISOR 1 CHANNEL 16SOIC 集成电路（IC） 监控器

封装/外壳：16-SOIC（0.295"，7.50mm 宽） 包装：散装 描述：IC SUPERVISOR 1 CHANNEL 16SOIC 集成电路（IC） 监控器

Customer Specification

Construction 1) Conductor a) Material Tinned Copper, per ASTM B-33 and CID-A-A-59551, latest revision b) Stranding Solid 2) Braid Data a) Nominal Dimensions .375 x .030 Inches b) AWG of Ends 36 c) Number of Carriers 48 d) Nominal Percent Coverage N/A e) Total Number of Ends 288 f) Approx

Precision Capacitance Measurement System

Features Power: 105 to 125 V and 210 to 250 V, 50 to 400 Hz, 22 W for oscillator. Dimensions: Bench: 48.3 cm H x 50.2 cm W x 28.0 cm D (19 x 19.75 x 11) Weight: 27 kg (59 lb.) net, 44 kg (96 lb.) shipping

Variable RF Inductor

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Original Strain Relief Bushings

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SCREW TERMINALS

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