Miniature Low Power Transformers

文件：1.04022 Mbytes Page：3 Pages

Signals PC low power transformers are designed to operate between 50 Hz and 500 Hz without any degradation in output voltage.

文件：275.05 Kbytes Page：2 Pages

包装：盒 描述：PWR XFMR LAMINATED 1.2VA TH 变压器 电源变压器

包装：卷带（TR） 描述：PWR XFMR LAMINATED 1.2VA TH 变压器 电源变压器

电源变压器

Low Frequency, Open-Style Laminated Concentric Vertical Profile, PC Plug-In Series

文件：162.25 Kbytes Page：1 Pages

Low Frequency, Open-Style Laminated, Concentric Vertical Profile, PC Plug-In Series

文件：105.07 Kbytes Page：1 Pages

DX SERIES HIGH-DENSITY I/O CONNECTORS

General DX series high-density I/O connector with bellow contacts are perfect for tomorrows miniaturized electronic devices. This new 1.27 mm (0.050) interconnect design enusres positive locking, effortless coupling, terminal protection and EMI reduction in a miniaturized and rugged package. App

DX SERIES HIGH-DENSITY I/O CONNECTORS

General DX series high-density I/O connector with bellow contacts are perfect for tomorrows miniaturized electronic devices. This new 1.27 mm (0.050) interconnect design enusres positive locking, effortless coupling, terminal protection and EMI reduction in a miniaturized and rugged package. App

DX SERIES HIGH-DENSITY I/O CONNECTORS

General DX series high-density I/O connector with bellow contacts are perfect for tomorrows miniaturized electronic devices. This new 1.27 mm (0.050) interconnect design enusres positive locking, effortless coupling, terminal protection and EMI reduction in a miniaturized and rugged package. App

DX SERIES HIGH-DENSITY I/O CONNECTORS

General DX series high-density I/O connector with bellow contacts are perfect for tomorrows miniaturized electronic devices. This new 1.27 mm (0.050) interconnect design enusres positive locking, effortless coupling, terminal protection and EMI reduction in a miniaturized and rugged package. App

DX SERIES HIGH-DENSITY I/O CONNECTORS

General DX series high-density I/O connector with bellow contacts are perfect for tomorrows miniaturized electronic devices. This new 1.27 mm (0.050) interconnect design enusres positive locking, effortless coupling, terminal protection and EMI reduction in a miniaturized and rugged package. App