位置：首页 > IC中文资料 > DF4-19MR20W3M1HF_B11
| 型号 | 功能描述 | 生产厂家 企业 | LOGO | 操作 |
|---|---|---|---|---|
DF4-19MR20W3M1HF_B11 | EasyPACK™ module with CoolSiC™ Trench MOSFET and PressFIT / NTC Features • Electrical features - VDSS = 2000 V - IDN = 60 A / IDRM = 120 A - High current density - Low inductive design • Mechanical features - Rugged mounting due to integrated mounting clamps - PressFIT contact technology - Integrated NTC temperature sensor | INFINEON 英飞凌 |   | |
DF4-19MR20W3M1HF_B11 | 2000 V、60 A 升压 EasyPACK ™ 3B CoolSiC ™ MOSFET 模块 | INFINEON 英飞凌 | |
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
HIROSE/广濑 |
2450+ |
NA |
9850 |
只做原厂原装正品现货或订货假一赔十! |
|||
HRS/广濑 |
25+ |
NA |
880000 |
明嘉莱只做原装正品现货 |
|||
HIROSE/广濑 |
2508+ |
/ |
129991 |
一级代理，原装现货 |
|||
HRS/广濑 |
2407+ |
30098 |
全新原装!仓库现货,大胆开价! |
||||
HRS/广濑 |
23+ |
NA/原装 |
9390 |
代理-优势-原装-正品-现货*期货 |
|||
HIROSEELECTRIC |
2447 |
SMD |
100500 |
一级代理专营品牌!原装正品,优势现货,长期排单到货 |
|||
HIROSE |
24+ |
con |
10000 |
查现货到京北通宇商城 |
|||
Infineon |
23+ |
标准封装 |
2000 |
全新原装正品现货直销 |
|||
HRS/广濑 |
23+ |
10000 |
原厂授权一级代理,专业海外优势订货,价格优势、品种 |
||||
24+ |
N/A |
51000 |
一级代理-主营优势-实惠价格-不悔选择 |
DF4-19MR20W3M1HF_B11芯片相关品牌
DF4-19MR20W3M1HF_B11规格书下载地址
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DF4-19MR20W3M1HF_B11数据表相关新闻
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XF2U-1115-3A 54819-0519 BM05B-XASS-TF 046499840921846+ 53307-1671 MOLEX/莫仕 connector 2019+ 49730 55460-0672 MOLEX/莫仕 connector 2019+ 42300 54167-0408 MOLEX/莫仕 connector 2019+ 33800 52921-0874 MOLEX/莫仕 connector 2019+ 42300 52893-3090 MOLEX/莫仕 connector 2019+ 39760 DF9-41S
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2020-6-28
DdatasheetPDF页码索引
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