Kingston DDR3/3L DRAM for embedded applications

KEY FEATURES • Double Data Rate (DDR) architecture: two data transfers per clock cycle • High-speed data transfer is realized by 8 bits prefetch pipelined architecture • Bi-directional differential data strobe (DOS and /DQS) is transmitted/received with data for capturing data at the receiver

DDR3/3L DRAM for embedded applications

Kingston i-Temp DDR3/3L DRAM for embedded applications

KEY FEATURES • Double Data Rate architecture: two data transfers per clock cycle • High-speed data transfer is realized by 8 bits prefetch pipelined architecture • Bi-directional differential data strobe (DOS and /DQS) is transmitted/received with data for capturing data at the receiver • DOS

DRAM Components

THM TEST POINTS

(THM)THRU HOLE MOUNT TEST POINTS-COLOR KEYED •Color keyed for visibility and quick identification •Economical choice for PC test point terminations •Snap-fit mounting provides positive retention for wave soldering •Wire form loop for safe, non-sliptesting •Space saving, ultra low

THRU HOLE MOUNT TEST POINTS - COLOR KEYED

• Color keyed for visibility and quick identification • Economical choice for PC test point terminations • Snap-fit mounting provides positive retention for wave soldering • Wire form loop for safe, non-slip testing • Space saving, ultra low and low profile designs • High profile design for d

(THM) THRU HOLE MOUNT TEST POINTS - COLOR KEYED

• Color keyed for visibility and quick identification • Economical choice for PC test point terminations • Snap-fit mounting provides positive retention for wave soldering • Wire form loop for safe, non-slip testing • Space saving, ultra low and low profile designs • High profile design for d

(THM) THRU HOLE MOUNT TEST POINTS - COLOR KEYED

• Color keyed for visibility and quick identification • Economical choice for PC test point terminations • Snap-fit mounting provides positive retention for wave soldering • Wire form loop for safe, non-slip testing • Space saving, ultra low and low profile designs • High profile design for d

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