DIP REED RELAY

Features Molded epoxy body DIP type construction with the same terminal pitch as ICs or TTLs simplifies PC board designing. In addition, the high sensitivity allows direct driving by TTL, etc. •Automatic insertion compatible Sealed construction permits automatic flow soldering and clean

DIP REED RELAY

Molded epoxy body\nDIP type construction with the same terminal pitch as\n  ICs or TTLs simplifies PC board designing.  In addition,\n  the high sensitivity allows direct driving by TTL, etc.\n•Automatic insertion compatible\nSealed construction permits automatic flow soldering and cleaning \nMagnet;

Dual Inline Pack Reed Relay

FEATURES Solid Epoxy Body Industry standard DIP spacing Completely sealed, Immersion cleanable Automatic insertion compatible Magnetic shield available Diode accross the coil available UL recognized and certified for Canada

REED RELAY

Features 1. Molded epoxy body. 2. Dip type construction with the same terminal pitch as ICs or TTLs simplifies PC board designing. In addition, the high sensitivity allows direct driving by TTL, etc. 3. Automatic insertion compatible. 4. Sealed construction permits automatic flow solde

磁簧继电器(Reed Relay)

Connector for CompactFlash

文件：395.99 Kbytes Page：5 Pages

Connector for W-SIM

文件：334.49 Kbytes Page：6 Pages