FEATURES & BENEFITS

• >320 μJ/pulse for cutting 0.1 mm

to >2 mm thick materials

• >150 kHz seeder burst mode to enable

>1 m/s cutting speeds

• Femtosecond performance for filament

and ablative cutting in a single laser

• Femtosecond operation to yield low

HAZ in complex, layered materials

• Variable pulsewidth from <300 fs to

>10 ps for process tailoring

• Compact single box design for ease

of integration

• HALT-designed/HASS-verified for superior

quality and reliability

APPLICATIONS

• Structured Glass Cutting

• Coated Transparent Material Cutting

• Structured Sapphire Cutting

• OLED Stack Cutting

• LCD Cutting and Tailoring

• Display Glass Cutting