FEATURES APPLICATIONS

• 150 μJ/pulse for processing of high ablation threshold

materials

• 150 W average power for high throughput

• <400 fs standard pulsewidth for low HAZ machining

• Variable pulsewidth from 10 ps for process

tailoring

• Repetition rate to 50 MHz for fast processing with

polygon scanners

• >450 μJ seeder burst mode for glass processing

• Compact single box design for ease of integration

• HALT-designed and HASS-verified to ensure quality

and reliability

• Glass Cutting and Welding

• Thin Film/Foil Cutting

• IC Package Cutting

• Medical Device Manufacturing

• OPA Pumping for Optogenetics