型号 功能描述 生产厂家 企业 LOGO 操作

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

• No interface material is needed • Copper with matte tin plating for improved solderability and assembly • Both the component and the heat sink are installed on the PC-board utilizing standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats • EIA standards and ESD protection are s

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更新时间:2025-11-4 13:00:01
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
TI/德州仪器
SOP8
6698
TE/泰科
2024+
SMD
25
原厂全新正品供应商
TOSHIBA
16+
TQFP
2500
进口原装现货/价格优势!
TE/泰科
24+
塑壳
5000
原厂原装,价格优势,欢迎洽谈!
Molex
50000
TE
21+
USB-mini B 2.0
3
原装现货17377264928微信同号
TE Connectivity(泰科电子)
24+
NA
860000
全网最低/原装现货
ADI/亚德诺
2511
原封装
66900
电子元器件采购降本30%!原厂直采,砍掉中间差价
TE Connectivity
23+
TO-18
12800
原装正品代理商最优惠价格 现货或订货
WAKEFIELDENGINEERING
21+
NA
12820
只做原装,质量保证

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