封装/外壳：2010（5025 公制） 包装：卷带（TR） 描述：RES 0.1 OHM 1% 1W 2010 电阻器 片式电阻器 - 表面贴装

封装/外壳：2010（5025 公制） 包装：卷带（TR） 描述：RES 0.1 OHM 1% 1W 2010 电阻器 片式电阻器 - 表面贴装

MetalPlateCurrentSensingChipResistor

Features: •Metalelementcurrentsensingresistor •Highpowercurrentsenseresistor •TCRof±50ppm/C •Resistancesdownto0.0005(1/2mΩ) •Currenthandlingupto63amps •Non-standardresistancevaluesavailable •100RoHScompliantandleadfreewithoutexemption •Halogenfree •

FoilonCeramicCurrentSensingChipResistor

Features: •Highpowerrating •Wideresistancerange •Currenthandlingupto26amps •TCRdownto±50ppm/C •Otherresistancevaluesmaybeavailable •100RoHScompliantandleadfreewithoutexemption •Halogenfree •REACHcompliant

GeneralPurposeThickFilmStandardPowerandHigh-PowerChipResistor

Features: •RMCF–standardpowerratings •RMCP–highpowerratings •Nickelbarrierterminationsstandard •Powerderatingfrom100at70ºCtozeroat+155ºC •AEC-Q200compliant(exceptRMCP0201) •RoHScompliantandhalogenfree •REACHcompliant •Forultrahighpower,seeRMCP-UPSe