MoldedMetalPlateSensingResistor

Features: •Highpowermetalalloycurrentsenseresistor •Moldedpackageforsuperiorheatdissipation •Typicalinductance

封装/外壳：2512（6432 公制） 包装：卷带（TR） 描述：RES SHUNT, 2512, 0.1 OHM, 1%, 3W 电阻器 片式电阻器 - 表面贴装

封装/外壳：2512（6432 公制） 包装：卷带（TR） 描述：RES SHUNT, 2512, 0.1 OHM, 1%, 3W 电阻器 片式电阻器 - 表面贴装

MetalPlateCurrentSensingChipResistor

Features: •Metalelementcurrentsensingresistor •Highpowercurrentsenseresistor •TCRof±50ppm/C •Resistancesdownto0.0005(1/2mΩ) •Currenthandlingupto63amps •Non-standardresistancevaluesavailable •100RoHScompliantandleadfreewithoutexemption •Halogenfree •

FoilonCeramicCurrentSensingChipResistor

Features: •Highpowerrating •Wideresistancerange •Currenthandlingupto26amps •TCRdownto±50ppm/C •Otherresistancevaluesmaybeavailable •100RoHScompliantandleadfreewithoutexemption •Halogenfree •REACHcompliant

HighPowerThickFilmChipResistor

Features: •Handles2Wofpower •Resistancesfrom0.1Ωto1MΩ •TCRof±100ppm/ºC •1and5tolerances •Runssignificantlycoolerthanstandardthickfilm2512chip •RoHScompliantandhalogenfree •REACHcompliant

GeneralPurposeThickFilmStandardPowerandHigh-PowerChipResistor

Features: •RMCF–standardpowerratings •RMCP–highpowerratings •Nickelbarrierterminationsstandard •Powerderatingfrom100at70ºCtozeroat+155ºC •AEC-Q200compliant(exceptRMCP0201) •RoHScompliantandhalogenfree •REACHcompliant •Forultrahighpower,seeRMCP-UPSe