位置：首页 > IC中文资料 > CSD97396Q4M
| 型号 | 功能描述 | 生产厂家 企业 | LOGO | 操作 |
|---|---|---|---|---|
CSD97396Q4M | CSD97396Q4M Synchronous Buck NexFET™ Power Stage 1 Features 1• Over 93% System Efficiency at 15 A • Max Rated Continuous Current 30 A, Peak 65 A • High Frequency Operation (up to 2 MHz) • High Density – SON 3.5 mm × 4.5 mm Footprint • Ultra-Low Inductance Package • System-Optimized PCB Footprint • Ultra-Low Quiescent (ULQ) Current Mod | TI 德州仪器 |   | |
CSD97396Q4M | CSD97396Q4M Synchronous Buck NexFET™ Power Stage 1 Features 1• Over 93% System Efficiency at 15 A • Max Rated Continuous Current 30 A, Peak 65 A • High Frequency Operation (up to 2 MHz) • High Density – SON 3.5 mm × 4.5 mm Footprint • Ultra-Low Inductance Package • System-Optimized PCB Footprint • Ultra-Low Quiescent (ULQ) Current Mod | TI 德州仪器 | | |
CSD97396Q4M | Synchronous Buck NexFET Power Stage 文件：497.26 Kbytes Page：20 Pages | TI 德州仪器 | | |
CSD97396Q4M | 封装/外壳：8-PowerVFDFN 包装：托盘 描述：IC NEXFET SYNC BUCK 8VSON 集成电路（IC） 全半桥驱动器 | TI 德州仪器 | | |
CSD97396Q4M | 30A 同步降压 NexFET 功率级 | TI 德州仪器 | | |
CSD97396Q4M Synchronous Buck NexFET™ Power Stage 1 Features 1• Over 93% System Efficiency at 15 A • Max Rated Continuous Current 30 A, Peak 65 A • High Frequency Operation (up to 2 MHz) • High Density – SON 3.5 mm × 4.5 mm Footprint • Ultra-Low Inductance Package • System-Optimized PCB Footprint • Ultra-Low Quiescent (ULQ) Current Mod | TI 德州仪器 | | ||
CSD97396Q4M Synchronous Buck NexFET™ Power Stage 1 Features 1• Over 93% System Efficiency at 15 A • Max Rated Continuous Current 30 A, Peak 65 A • High Frequency Operation (up to 2 MHz) • High Density – SON 3.5 mm × 4.5 mm Footprint • Ultra-Low Inductance Package • System-Optimized PCB Footprint • Ultra-Low Quiescent (ULQ) Current Mod | TI 德州仪器 | | ||
CSD97396Q4M Synchronous Buck NexFET™ Power Stage 1 Features 1• Over 93% System Efficiency at 15 A • Max Rated Continuous Current 30 A, Peak 65 A • High Frequency Operation (up to 2 MHz) • High Density – SON 3.5 mm × 4.5 mm Footprint • Ultra-Low Inductance Package • System-Optimized PCB Footprint • Ultra-Low Quiescent (ULQ) Current Mod | TI 德州仪器 | | ||
CSD97396Q4M Synchronous Buck NexFET™ Power Stage 1 Features 1• Over 93% System Efficiency at 15 A • Max Rated Continuous Current 30 A, Peak 65 A • High Frequency Operation (up to 2 MHz) • High Density – SON 3.5 mm × 4.5 mm Footprint • Ultra-Low Inductance Package • System-Optimized PCB Footprint • Ultra-Low Quiescent (ULQ) Current Mod | TI 德州仪器 | | ||
CSD97396Q4M Synchronous Buck NexFET™ Power Stage 1 Features 1• Over 93% System Efficiency at 15 A • Max Rated Continuous Current 30 A, Peak 65 A • High Frequency Operation (up to 2 MHz) • High Density – SON 3.5 mm × 4.5 mm Footprint • Ultra-Low Inductance Package • System-Optimized PCB Footprint • Ultra-Low Quiescent (ULQ) Current Mod | TI 德州仪器 | | ||
CSD97396Q4M Synchronous Buck NexFET™ Power Stage 1 Features 1• Over 93% System Efficiency at 15 A • Max Rated Continuous Current 30 A, Peak 65 A • High Frequency Operation (up to 2 MHz) • High Density – SON 3.5 mm × 4.5 mm Footprint • Ultra-Low Inductance Package • System-Optimized PCB Footprint • Ultra-Low Quiescent (ULQ) Current Mod | TI 德州仪器 | | ||
CSD97396Q4M Synchronous Buck NexFET™ Power Stage 1 Features 1• Over 93% System Efficiency at 15 A • Max Rated Continuous Current 30 A, Peak 65 A • High Frequency Operation (up to 2 MHz) • High Density – SON 3.5 mm × 4.5 mm Footprint • Ultra-Low Inductance Package • System-Optimized PCB Footprint • Ultra-Low Quiescent (ULQ) Current Mod | TI 德州仪器 | | ||
CSD97396Q4M Synchronous Buck NexFET™ Power Stage 1 Features 1• Over 93% System Efficiency at 15 A • Max Rated Continuous Current 30 A, Peak 65 A • High Frequency Operation (up to 2 MHz) • High Density – SON 3.5 mm × 4.5 mm Footprint • Ultra-Low Inductance Package • System-Optimized PCB Footprint • Ultra-Low Quiescent (ULQ) Current Mod | TI 德州仪器 | | ||
CSD97396Q4M Synchronous Buck NexFET™ Power Stage 1 Features 1• Over 93% System Efficiency at 15 A • Max Rated Continuous Current 30 A, Peak 65 A • High Frequency Operation (up to 2 MHz) • High Density – SON 3.5 mm × 4.5 mm Footprint • Ultra-Low Inductance Package • System-Optimized PCB Footprint • Ultra-Low Quiescent (ULQ) Current Mod | TI 德州仪器 | | ||
CSD97396Q4M Synchronous Buck NexFET™ Power Stage 1 Features 1• Over 93% System Efficiency at 15 A • Max Rated Continuous Current 30 A, Peak 65 A • High Frequency Operation (up to 2 MHz) • High Density – SON 3.5 mm × 4.5 mm Footprint • Ultra-Low Inductance Package • System-Optimized PCB Footprint • Ultra-Low Quiescent (ULQ) Current Mod | TI 德州仪器 | | ||
封装/外壳：8-PowerVFDFN 包装：托盘 描述：IC NEXFET SYNC BUCK 8VSON 集成电路（IC） 全半桥驱动器 | TI 德州仪器 | | ||
Synchronous Buck NexFET Power Stage 文件：497.26 Kbytes Page：20 Pages | TI 德州仪器 | |
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
TI(德州仪器) |
24+ |
NA/ |
8735 |
原厂直销,现货供应,账期支持! |
|||
TI(德州仪器) |
24+ |
WSON-8 |
8798 |
原厂可订货,技术支持,直接渠道。可签保供合同 |
|||
TI |
20+ |
VSOP8 |
53650 |
TI原装主营-可开原型号增税票 |
|||
TI(德州仪器) |
24+/25+ |
10000 |
原装正品现货库存价优 |
||||
TI/德州仪器 |
17+ |
VSON8 |
433 |
原装现货 |
|||
TI |
2024+ |
N/A |
70000 |
柒号只做原装 现货价秒杀全网 |
|||
TI |
23+ |
NA |
20000 |
||||
TI/德州仪器 |
2223+ |
VSON-8 |
26800 |
只做原装正品假一赔十为客户做到零风险 |
|||
NA |
23+ |
NA |
26094 |
10年以上分销经验原装进口正品,做服务型企业 |
|||
TI(德州仪器) |
23+ |
VSON-8(3.5x4.5) |
13650 |
公司只做原装正品,假一赔十 |
CSD97396Q4M芯片相关品牌
CSD97396Q4M规格书下载地址
CSD97396Q4M参数引脚图相关
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CSD97396Q4M数据表相关新闻
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DdatasheetPDF页码索引
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