ADSP-BF506F EZ-KIT Lite짰 Evaluation System Manual

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封装/外壳：0603（1608 公制） 包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 描述：RES SMD 330 OHM 5% 1/10W 0603 电阻器 片式电阻器 - 表面贴装

封装/外壳：0603（1608 公制） 包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 描述：RES SMD 330 OHM 5% 1/10W 0603 电阻器 片式电阻器 - 表面贴装

Standard Thick Film Chip Resistors

Pulse Proof, High Power Thick Film Chip Resistors

Pulse Proof Thick Film Chip Resistors

Single-channel isolated gate driver IC with adjustable DESAT and soft-off

Features • 600 V, 650 V, 900 V, and 1200 V IGBTs, SiC and Si MOSFETs • 40 V absolute maximum output supply voltage • ±3 A, ±6 A, and ±9 A typical sinking and sourcing peak output current • Separate source and sink outputs for hard switching and with active Miller clamp/clamp driver • Adjustme

SMD POWER INDUCTORS

GENERAL SPECIFICATION : e) Resistance to solder heat : 260°C.10 secs d) Operating temp. : -40°C to +85°C c) Storage temp. : -40°C to +125°C b) Rated current : Base on temp. rise & ǻL/L0A = 10 Max. a) Temp. rise : 40°C Max.

SMD POWER INDUCTORS

SMD POWER INDUCTORS GENERAL SPECIFICATION : a) Irms : Temp. rise 40°C Max. b) Isat : ǻL/L0A=30 Max. c) Storage temp. : -40°C to +125°C d) Operating temp. : -40°C to +85°C e) Resistance to solder heat : 260°C.10 secs

Low DCR, small package

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