封装/外壳：0603（1608 公制） 包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 描述：RES 22K OHM 5% 1/10W 0603 电阻器 片式电阻器 - 表面贴装

封装/外壳：0603（1608 公制） 包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 描述：RES 22K OHM 5% 1/10W 0603 电阻器 片式电阻器 - 表面贴装

Standard Thick Film Chip Resistors

FEATURES • Stability R/R = 1 for 1000 h at 70 ° C • 2 mm pitch packaging option for 0603 size • Pure tin solder contacts on Ni barrier layer provides compatibility with lead (Pb)-free and lead containing soldering processes • Metal glaze on high quality ceramic • AEC-Q200 qualified • Mater

Standard Thick Film Chip Resistors

FEATURES • Stability R/R = 1 for 1000 h at 70 ° C • 2 mm pitch packaging option for 0603 size • Pure tin solder contacts on Ni barrier layer provides compatibility with lead (Pb)-free and lead containing soldering processes • Metal glaze on high quality ceramic • AEC-Q200 qualified • Mater

Standard Thick Film Chip Resistors

FEATURES • Stability R/R = 1 for 1000 h at 70 ° C • 2 mm pitch packaging option for 0603 size • Pure tin solder contacts on Ni barrier layer provides compatibility with lead (Pb)-free and lead containing soldering processes • Metal glaze on high quality ceramic • AEC-Q200 qualified • Mater

Standard Thick Film Chip Resistors

FEATURES • Stability R/R = 1 for 1000 h at 70 ° C • 2 mm pitch packaging option for 0603 size • Pure tin solder contacts on Ni barrier layer provides compatibility with lead (Pb)-free and lead containing soldering processes • Metal glaze on high quality ceramic • AEC-Q200 qualified • Mater

Standard Thick Film Chip Resistors

FEATURES • Stability R/R = 1 for 1000 h at 70 ° C • 2 mm pitch packaging option for 0603 size • Pure tin solder contacts on Ni barrier layer provides compatibility with lead (Pb)-free and lead containing soldering processes • Metal glaze on high quality ceramic • AEC-Q200 qualified • Mater