3U CompactPCI Subsystem with 8-slot Backplane and 1 1 CompactPCI ETT Redundant Power Modules

文件：542.32 Kbytes Page：1 Pages

3U CompactPCI Subsystem with 8-slot Backplane

文件：278.41 Kbytes Page：2 Pages

3U CompactPCI Subsystem with 8-slot Backplane and 1 1 CompactPCI ETT Redundant Power Modules

文件：564.59 Kbytes Page：1 Pages

3U CompactPCI Subsystem with 8-slot Backplane

文件：278.41 Kbytes Page：2 Pages

3U CompactPCI Subsystem with 8-slot Backplane and 1 1 CompactPCI ETT Redundant Power Modules

文件：542.32 Kbytes Page：1 Pages

3U CompactPCI Subsystem with 8-slot Backplane and 1 1 CompactPCI ETT Redundant Power Modules

文件：564.59 Kbytes Page：1 Pages

Customer Specification

Construction 1) Component 1 1 X 1 HOOKUP a) Conductor 32 (SOLID) AWG 10 Nickel Plated Copper 0.008 b) Insulation 0.006 Wall, Nom. FLUOROPLASTIC 0.020+/- 0.002 (1) Tint Color(s) WHITE, BLACK, RED, GREEN, YELLOW, BLUE, BROWN ORANGE

AM263x Sitara™ Microcontrollers

1 Features Processor Cores: • Single, dual, and quad-core Arm® Cortex®-R5F MCU with each core running up to 400 MHz – 16KB I-cache with 64-bit ECC per CPU core – 16KB D-cache with 32-bit ECC per CPU core – 64KB Tightly-Coupled Memory (TCM) with 32- bit ECC per CPU core – Lockstep or Dual-c

AM263x Sitara™ Microcontrollers

1 Features Processor Cores: • Single, dual, and quad-core Arm® Cortex®-R5F MCU with each core running up to 400 MHz – 16KB I-cache with 64-bit ECC per CPU core – 16KB D-cache with 32-bit ECC per CPU core – 64KB Tightly-Coupled Memory (TCM) with 32- bit ECC per CPU core – Lockstep or Dual-c

Wireless Temperature & Humidity Sensor Node

文件：1.09436 Mbytes Page：1 Pages

Wireless Temperature & Humidity Sensor Node

文件：1.09437 Mbytes Page：1 Pages