Power Transistor PNP - High Current Transistor Chip

PROCESS DETAILS ​​​​​​​ Die Size 48.8 x 48.8 MILS Die Thickness 7.1 MILS Base Bonding Pad Area 7.9 x 7.9 MILS Emitter Bonding Pad Area 9.1 x 18.1 MILS Top Side Metalization Al - 30,000Å Back Side Metalization Ti/Ni/Ag - 2,000Å/3,000Å/20,000Å

PNP - High Current Transistor Die 4.0 Amp, 140 Volt

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Dual Universal Precision Op Amp Evaluation Board

INTRODUCTION The EVAL-PRAOPAMP-2RZ, EVAL-PRAOPAMP-2RMZ, and EVAL-PRAOPAMP-2CPZ are universal precision evaluation boards that accommodate dual op amps in 8-pin SOIC, MSOP, and LFCSP packages, respectively. For the exposed pad connection for the LFCSP package, see the appropriate product data shee

AXC763 Netgear Compatible Direct Attach Copper Twinax Cable 10G SFP Cu (3m, Passive)

Features ATGBICS AXC763 compatible 10GBase-CU SFP+ to SFP+ direct attach cable operates over passive copper with a cable length of 3m. It is suitable for short reach connection between two SFP+ ports in 10G interconnecting networking applications.  Our product meets the specification of Netgear

12 A SPDT MINIATURE POWER RELAY

FEATURES • Dielectric strength 5000 Vrms • Low height: 15.7 mm • Epoxy sealed version available • 12 Amp switching • AC and DC coils • Isolation spacing greater than 10 mm • Proof tracking index (PTI/CTI) 250 • Reinforced insulation, EN 60730-1 (VDE 0631, part 1) EN 60335-1

Intel짰 LGA775 Core??2 Duo/Pentium짰 4/ATX with VGA, 4 COM, SW RAID, and Dual LAN

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Dual Universal Precision Op Amp Evaluation Board

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