Small Signal Transistors PNP - High Current Transistor Chip

PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 66 x 66 MILS Die Thickness 7.1 MILS Base Bonding Pad Area 7.9 x 7.9 MILS Emitter 1 Bonding Pad Area 7.9 x 9.5 MILS Emitter 2 Bonding Pad Area 7.9 x 9.5 MILS Top Side Metalization Al-Si - 30,000Å Back Side Metalizatio

Small Signal Transistors PNP - High Current Transistor Chip

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PNP - High Current Transistor Die 5.0 Amp, 100 Volt

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Chip Form: High Current Transistor

Chip Form: High Current Transistor

PNP - High Current Transistor Die 5.0 Amp, 25 Volt

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CMOS LOW COST 10-BIT MULTIPLYING DAC

GENERAL DESCRIPTION The AD7533 is a low cost, 10-bit, 4-quadrant multiplying DAC manufactured using an advanced thin-film-on-monolithic CMOS wafer fabrication process. Pin and function equivalent to the AD7520 industry standard, the AD7533 is recommended as a lower cost alternative for old AD752

ZENER DIODE CHIPS

• 1N746A THRU 1N759A AVAILABLE IN JANHC AND JANKC PER MIL-PRF-19500/127 • 1N4370A THRU 1N4372A AVAILABLE IN JANHC AND JANKC PER MIL-PRF-19500/127 • ZENER DIODE CHIPS • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF S

LEADLESS PACKAGE FOR SURFACE MOUNT

• 1N746AUR-1 THRU 1N759AUR-1 AVAILABLE IN JAN, JANTX AND JANTXV PER MIL-PRF-19500/127 • 1N4370AUR-1 THRU 1N4372AUR-1 AVAILABLE IN JAN, JANTX AND JANTXV PER MIL-PRF-19500/127 • LEADLESS PACKAGE FOR SURFACE MOUNT • METALLURGICALLY BONDED

PNP SILICON PLANAR MEDIUM POWER TRANSISTORS

FEATURES * 100 Volt VCEO * 2 Amp continuous current * Low saturation voltage * Ptot=1 Watt

PNP DUAL TRANSISTOR IN A HERMETICALLY SEALED CERAMIC SURFACE MOUNT PACKAGE FOR HIGH RELIABILITY APPLICATIONS

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