Small Signal Transistor PNP - Amp/Switch Transistor Chip

PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 12 x 20 MILS Die Thickness 9.0 MILS Base Bonding Pad Area 3.6 X 3.6 MILS Emitter Bonding Pad Area 3.6 X 3.6 MILS Top Side Metalization Al

Small Signal Transistor PNP - Amp/Switch Transistor Chip

Small Signal Transistors PNP - Amp/Switch Transistor Chip

PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 12 x 20 MILS Die Thickness 7.1 MILS Base Bonding Pad Area 3.6 X 3.6 MILS Emitter Bonding Pad Area 3.6 X 3.6 MILS Top Side Metalization Al

Chip Form: Amplifier/Switch Transistor

PNP - High Voltage Transistor Die

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P-Channel JFET Die

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P-Channel JFET Die

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PNP - High Voltage Transistor Die

文件：530.8 Kbytes Page：9 Pages

Chip Form: Amplifier/Switch Transistor

PNP - High Voltage Transistor Die

文件：530.8 Kbytes Page：9 Pages

P-Channel JFET Die

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Solid Tantalum Chip Capacitors TANTAMOUNT, Low Profile, Conformal Coated, Maximum CV

FEATURES • New robust ratings for pulsed applications • 1.0 mm to 2.5 mm height • Terminations: 100 matte tin (2) standard, tin / lead available • Mounting: surface mount • 8 mm, 12 mm tape and reel packaging available per EIA 481 and reeling per IEC 60286-3     7 [178 mm] standard    

Low Cost, Precision IC Temperature Transducer

PRODUCT DESCRIPTION The AD592 is a two terminal monolithic integrated circuit temperature transducer that provides an output current proportional to absolute temperature. For a wide range of supply voltages the transducer acts as a high impedance temperature dependent current source of 1 µA/K. Im

Solid Tantalum Chip Capacitors TANTAMOUNT® , Low Profile, Conformal Coated, Maximum CV

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Solid Tantalum Chip Capacitors

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Solid Tantalum Chip Capacitors

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