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PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 66 x 66 MILS Die Thickness 7.1 MILS Base Bonding Pad Area 7.9 x 7.9 MILS Emitter 1 Bonding Pad Area 7.9 x 9.5 MILS Emitter 2 Bonding Pad Area 7.9 x 9.5 MILS Top Side Metalization Al-Si - 30,000Å Back Side Metalizatio

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[MendaPump] To Our Customers The MENDA® brand name has been synonymous with innovation and quality since 1947. MENDA is famous for its high performance line of dish type liquid dispenser pumps and bottles. These pumps and bottles are now widely used in industrial electronics assembly, cleanroom,

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