Small Signal Transistors NPN - Low VCE(SAT) Transistor Chip

PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 18 x 18 MILS Die Thickness 7.1 MILS Base Bonding Pad Area 3.8 x 3.8 MILS Emitter Bonding Pad Area 3.8 x 3.8 MILS Top Side Metalization Al/Si - 30,000Å Back Side Metalization Au - 12,000Å

Small Signal Transistors NPN - Low VCE(SAT) Transistor Chip

Small Signal Transistors NPN - Low VCE(SAT) Transistor Chip

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Chip Form: Low VCE(sat) Transistor

Redline VDE Pliers

Range Description A range of VDE approved Professional Electricians Pliers and cutters Range Features  Certified & approved by the world renowned VDE institute of Germany  Each tool is tested to 10,000v for the complete assurance of safety when working on live equipment up to 1000v AC  G

WASHERS AND NUTS

[KEYSTONE] FIBRE SHOULDER WASHERS HEX MACHINE NUTS NYLON SHOULDER WASHER/BUSHINGS BLIND CAPTIVE NUTS - PRESS FIT METRIC MACHINE NUTS

Card Edge Connector | Green | 0.100 (2.54mm) Pitch | 0.140 (3.56mm) Row Spacing | 0.437 (11.10mm) Insulator Height

Features .100 (2.54mm) Contact Spacing x .140 (3.56mm) Row Spacing Accepts .062 (1.57mm) Nominal Thickness P.C. Board Low Profile Insulator Body, .437 (11.10mm) Contact Termination Options include P.C. Tail, Wire Hole and Extender Board Bends Single or Dual Row Configurations Varie

3.0 Amp Output Current IGBT Gate Drive Optocoupler with Rail-to-Rail

Description The ACPL-P341/W341 contains an AlGaAs LED, which is optically coupled to an integrated circuit with a power output stage. This optocoupler is ideally suited for driving power IGBTs and MOSFETs used in motor control inverter applications. Features • 3.0 A maximum peak output

TREK 341B

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