Power Transistors NPN - High Current Transistor Chip

PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 40 x 40 MILS Die Thickness 7.1 MILS Base Bonding Pad Area 7.9 x 8.7 MILS Emitter Bonding Pad Area 9.0 x 14 MILS Top Side Metalization Al - 30,000Å Back Side Metalization Au - 12,000Å

Power Transistors NPN - High Current Transistor Chip

Power Transistors NPN - High Current Transistor Chip

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Chip Form: High Current Transistor

Card Edge Connectors 0.156” (3.96mm) Pitch

Features: • 0.156” (3.96mm) contact spacing x 0.140” (3.56mm) row spacing • Accepts 0.062” (1.57mm) nominal thickness P.C. board • Low profile insulator body, 0.470” (11.94mm) • Contact termination options include P.C. tail, wire hole, extender board bends • Dual row configuration • Large va

310, 315 All-Welded “Mini” Diaphragm Seal

FEATURES No gaskets or bolts Available with 1⁄8 NPT flushing connection Designed for use with transducers and 31/2˝ or smaller gauges

ROD SEALS

DESCRIPTION The BECA 315 profile is a single acting buffer rod seal composed of a profiled polyurethane triple lip seal and a POM back-up ring on the back. APPLICATIONS Agriculture Mobile machinery Injection presses Hydraulic cylinders

IEC60309 PIN & SLEEVE DEVICES • LIGHT & STAGE DEVICES

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IEC60309 PIN & SLEEVE DEVICES • LIGHT & STAGE DEVICES

文件：401.49 Kbytes Page：2 Pages