Small Signal Transistor NPN - High Current Transistor Chip

PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 31 x 31 MILS Die Thickness 9.0 MILS Base Bonding Pad Area 5.9 x 11.8 MILS Emitter Bonding Pad Area 6.5 x 13.8 MILS Top Side Metalization Al - 30,000Å Back Side Metalization Au - 18,000Å

Small Signal Transistor NPN - High Current Transistor Chip

NPN - High Current Transistor Die

PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 31 x 31 MILS Die Thickness 9.0 MILS Base Bonding Pad Area 5.9 x 11.8 MILS Emitter Bonding Pad Area 6.5 x 13.8 MILS Top Side Metalization Al - 30,000Å Back Side Metalization Au - 18,000Å

Small Signal Transistor NPN - High Current Transistor Chip

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4 WAY FACEPLATE

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4 WAY FACEPLATE

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Chip Form: High Current Transistor

封装/外壳：模具 包装：散装 描述：TRANS NPN 80V 1A DIE 1=400 分立半导体产品 晶体管 - 双极性晶体管（BJT）- 单个

封装/外壳：模具 包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 描述：TRANS NPN 80V 1A DIE 1=20PCS 分立半导体产品 晶体管 - 双极性晶体管（BJT）- 单个

Chip Form: High Current Transistor

P-Channel JFET Die

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PNP - High Voltage Transistor Die

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NPN - Small Signal Transistor Die 45 Volt

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NPN - Small Signal Transistor Die 50 Volt

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NPN - Small Signal Transistor Die 80 Volt

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NPN - Small Signal Transistor Die 0.8 Amp, 45 Volt

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NPN - Small Signal Transistor Die 0.5 Amp, 45 Volt

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NPN - Small Signal Transistor Die 0.8 Amp, 45 Volt

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NPN - Small Signal Transistor Die 1.0 Amp, 60 Volt

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NPN - High Current Transistor Die

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Card Edge Connectors 0.156” (3.96mm) Pitch

Features: • 0.156” (3.96mm) contact spacing x 0.140” (3.56mm) row spacing • Accepts 0.062” (1.57mm) nominal thickness P.C. board • Low profile insulator body, 0.470” (11.94mm) • Contact termination options include P.C. tail, wire hole, extender board bends • Dual row configuration • Large va

Precision Vise Combinations

Model 201 Features: > The easy-to-use single knob controls head movement through 3-planes: 210° Tilt, 360° Turn & 360° Rotation > Fine/coarse adjusting knob controls jaw pressure for delicate work > Grooved jaws are excellent for holding small objects and are made of reinforced thermal compos

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