包装：袋 描述：CONN BACKNUT 3 BLACK 连接器，互连器件 圆形连接器配件

连接器附件

Wire Bondable Thin Film Resistor Arrays

FEATURES • Wire bondable • Up to 12 equal value resistors • For case see Part Dimensions table • Resistance range: 20 Ω to 1 MΩ • Excellent TCR tracking • Resistor material: tantalum nitride, self-passivating • Oxidized silicon substrate for good power dissipation • Custom values and pad

Wire Bondable Thin Film Resistor Arrays

FEATURES • Wire bondable • Up to 12 equal value resistors • For case see Part Dimensions table • Resistance range: 20 Ω to 1 MΩ • Excellent TCR tracking • Resistor material: tantalum nitride, self-passivating • Oxidized silicon substrate for good power dissipation • Custom values and pad

Wire Bondable Thin Film Resistor Arrays

FEATURES • Wire bondable • Up to 12 equal value resistors • For case see Part Dimensions table • Resistance range: 20 Ω to 1 MΩ • Excellent TCR tracking • Resistor material: tantalum nitride, self-passivating • Oxidized silicon substrate for good power dissipation • Custom values and pad

Wire Bondable Thin Film Resistor Arrays

FEATURES • Wire bondable • Up to 12 equal value resistors • For case see Part Dimensions table • Resistance range: 20 Ω to 1 MΩ • Excellent TCR tracking • Resistor material: tantalum nitride, self-passivating • Oxidized silicon substrate for good power dissipation • Custom values and pad

Wire Bondable Thin Film Resistor Arrays

FEATURES • Wire bondable • Up to 12 equal value resistors • For case see Part Dimensions table • Resistance range: 20 Ω to 1 MΩ • Excellent TCR tracking • Resistor material: tantalum nitride, self-passivating • Oxidized silicon substrate for good power dissipation • Custom values and pad