Multi Layer Ceramic Capacitor

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Chip Resistor Networks High speed mounting using conventional placing machine

■ Features ● High density placing for digital signal circuits · Bussed 8 or 15 resistors for pull up/down circuits EXBD: 3.2 mm × 1.6 mm × 0.55 mm, 0.635 mm pitch EXBE: 4.0 mm × 2.1 mm × 0.55 mm, 0.8 mm pitch EXBA: 6.4 mm × 3.1 mm × 0.55 mm, 1.27 mm pitch EXBQ: 3.8 mm × 1.6 mm ×

Chip Resistor Networks High speed mounting using conventional placing machine

■ Features ● High density placing for digital signal circuits · Bussed 8 or 15 resistors for pull up/down circuits EXBD: 3.2 mm × 1.6 mm × 0.55 mm, 0.635 mm pitch EXBE: 4.0 mm × 2.1 mm × 0.55 mm, 0.8 mm pitch EXBA: 6.4 mm × 3.1 mm × 0.55 mm, 1.27 mm pitch EXBQ: 3.8 mm × 1.6 mm ×

Chip Resistor Networks High speed mounting using conventional placing machine

■ Features ● High density placing for digital signal circuits · Bussed 8 or 15 resistors for pull up/down circuits EXBD: 3.2 mm × 1.6 mm × 0.55 mm, 0.635 mm pitch EXBE: 4.0 mm × 2.1 mm × 0.55 mm, 0.8 mm pitch EXBA: 6.4 mm × 3.1 mm × 0.55 mm, 1.27 mm pitch EXBQ: 3.8 mm × 1.6 mm ×

Chip Resistor Networks High speed mounting using conventional placing machine

■ Features ● High density placing for digital signal circuits · Bussed 8 or 15 resistors for pull up/down circuits EXBD: 3.2 mm × 1.6 mm × 0.55 mm, 0.635 mm pitch EXBE: 4.0 mm × 2.1 mm × 0.55 mm, 0.8 mm pitch EXBA: 6.4 mm × 3.1 mm × 0.55 mm, 1.27 mm pitch EXBQ: 3.8 mm × 1.6 mm ×

Chip Resistor Networks

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