型号 功能描述 生产厂家&企业 LOGO 操作

Patented Flip-Chip Series

FEATURES •UnidirectionalandBidirectional •Fullyglasspassivated •600watt(10/1000ms) •Eliminateswirebonding •NONInductiveInsertion •Novoltageovershoot

MicrosemiMicrosemi Corporation

美高森美美高森美公司

Microsemi

Patented Flip-Chip Series

FEATURES •UnidirectionalandBidirectional •Fullyglasspassivated •600watt(10/1000ms) •Eliminateswirebonding •NONInductiveInsertion •Novoltageovershoot

MicrosemiMicrosemi Corporation

美高森美美高森美公司

Microsemi

Patented Flip-Chip Series

FEATURES •UnidirectionalandBidirectional •Fullyglasspassivated •600watt(10/1000ms) •Eliminateswirebonding •NONInductiveInsertion •Novoltageovershoot

MicrosemiMicrosemi Corporation

美高森美美高森美公司

Microsemi

Patented Flip-Chip Series

FEATURES •UnidirectionalandBidirectional •Fullyglasspassivated •600watt(10/1000ms) •Eliminateswirebonding •NONInductiveInsertion •Novoltageovershoot

MicrosemiMicrosemi Corporation

美高森美美高森美公司

Microsemi

Patented Flip-Chip Series

FEATURES •UnidirectionalandBidirectional •Fullyglasspassivated •600watt(10/1000ms) •Eliminateswirebonding •NONInductiveInsertion •Novoltageovershoot

MicrosemiMicrosemi Corporation

美高森美美高森美公司

Microsemi

Patented Flip-Chip Series

FEATURES •UnidirectionalandBidirectional •Fullyglasspassivated •600watt(10/1000ms) •Eliminateswirebonding •NONInductiveInsertion •Novoltageovershoot

MicrosemiMicrosemi Corporation

美高森美美高森美公司

Microsemi

Patented Flip-Chip Series

FEATURES •UnidirectionalandBidirectional •Fullyglasspassivated •600watt(10/1000ms) •Eliminateswirebonding •NONInductiveInsertion •Novoltageovershoot

MicrosemiMicrosemi Corporation

美高森美美高森美公司

Microsemi

Patented Flip-Chip Series

FEATURES •UnidirectionalandBidirectional •Fullyglasspassivated •600watt(10/1000ms) •Eliminateswirebonding •NONInductiveInsertion •Novoltageovershoot

MicrosemiMicrosemi Corporation

美高森美美高森美公司

Microsemi

Patented Flip-Chip Series

FEATURES •UnidirectionalandBidirectional •Fullyglasspassivated •600watt(10/1000ms) •Eliminateswirebonding •NONInductiveInsertion •Novoltageovershoot

MicrosemiMicrosemi Corporation

美高森美美高森美公司

Microsemi

Patented Flip-Chip Series

FEATURES •UnidirectionalandBidirectional •Fullyglasspassivated •600watt(10/1000ms) •Eliminateswirebonding •NONInductiveInsertion •Novoltageovershoot

MicrosemiMicrosemi Corporation

美高森美美高森美公司

Microsemi

Patented Flip-Chip Series

FEATURES •UnidirectionalandBidirectional •Fullyglasspassivated •600watt(10/1000ms) •Eliminateswirebonding •NONInductiveInsertion •Novoltageovershoot

MicrosemiMicrosemi Corporation

美高森美美高森美公司

Microsemi

Patented Flip-Chip Series

FEATURES •UnidirectionalandBidirectional •Fullyglasspassivated •600watt(10/1000ms) •Eliminateswirebonding •NONInductiveInsertion •Novoltageovershoot

MicrosemiMicrosemi Corporation

美高森美美高森美公司

Microsemi

Patented Flip-Chip Series

FEATURES •UnidirectionalandBidirectional •Fullyglasspassivated •600watt(10/1000ms) •Eliminateswirebonding •NONInductiveInsertion •Novoltageovershoot

MicrosemiMicrosemi Corporation

美高森美美高森美公司

Microsemi

Patented Flip-Chip Series

FEATURES •UnidirectionalandBidirectional •Fullyglasspassivated •600watt(10/1000ms) •Eliminateswirebonding •NONInductiveInsertion •Novoltageovershoot

MicrosemiMicrosemi Corporation

美高森美美高森美公司

Microsemi

Patented Flip-Chip Series

FEATURES •UnidirectionalandBidirectional •Fullyglasspassivated •600watt(10/1000ms) •Eliminateswirebonding •NONInductiveInsertion •Novoltageovershoot

MicrosemiMicrosemi Corporation

美高森美美高森美公司

Microsemi

Patented Flip-Chip Series

FEATURES •UnidirectionalandBidirectional •Fullyglasspassivated •600watt(10/1000ms) •Eliminateswirebonding •NONInductiveInsertion •Novoltageovershoot

MicrosemiMicrosemi Corporation

美高森美美高森美公司

Microsemi

Patented Flip-Chip Series

FEATURES •UnidirectionalandBidirectional •Fullyglasspassivated •600watt(10/1000ms) •Eliminateswirebonding •NONInductiveInsertion •Novoltageovershoot

MicrosemiMicrosemi Corporation

美高森美美高森美公司

Microsemi

Patented Flip-Chip Series

FEATURES •UnidirectionalandBidirectional •Fullyglasspassivated •600watt(10/1000ms) •Eliminateswirebonding •NONInductiveInsertion •Novoltageovershoot

MicrosemiMicrosemi Corporation

美高森美美高森美公司

Microsemi

Patented Flip-Chip Series

FEATURES •UnidirectionalandBidirectional •Fullyglasspassivated •600watt(10/1000ms) •Eliminateswirebonding •NONInductiveInsertion •Novoltageovershoot

MicrosemiMicrosemi Corporation

美高森美美高森美公司

Microsemi

Patented Flip-Chip Series

FEATURES •UnidirectionalandBidirectional •Fullyglasspassivated •600watt(10/1000ms) •Eliminateswirebonding •NONInductiveInsertion •Novoltageovershoot

MicrosemiMicrosemi Corporation

美高森美美高森美公司

Microsemi

Patented Flip-Chip Series

FEATURES •UnidirectionalandBidirectional •Fullyglasspassivated •600watt(10/1000ms) •Eliminateswirebonding •NONInductiveInsertion •Novoltageovershoot

MicrosemiMicrosemi Corporation

美高森美美高森美公司

Microsemi

Patented Flip-Chip Series

FEATURES •UnidirectionalandBidirectional •Fullyglasspassivated •600watt(10/1000ms) •Eliminateswirebonding •NONInductiveInsertion •Novoltageovershoot

MicrosemiMicrosemi Corporation

美高森美美高森美公司

Microsemi

Patented Flip-Chip Series

FEATURES •UnidirectionalandBidirectional •Fullyglasspassivated •600watt(10/1000ms) •Eliminateswirebonding •NONInductiveInsertion •Novoltageovershoot

MicrosemiMicrosemi Corporation

美高森美美高森美公司

Microsemi

Patented Flip-Chip Series

FEATURES •UnidirectionalandBidirectional •Fullyglasspassivated •600watt(10/1000ms) •Eliminateswirebonding •NONInductiveInsertion •Novoltageovershoot

MicrosemiMicrosemi Corporation

美高森美美高森美公司

Microsemi

Patented Flip-Chip Series

FEATURES •UnidirectionalandBidirectional •Fullyglasspassivated •600watt(10/1000ms) •Eliminateswirebonding •NONInductiveInsertion •Novoltageovershoot

MicrosemiMicrosemi Corporation

美高森美美高森美公司

Microsemi

Patented Flip-Chip Series

FEATURES •UnidirectionalandBidirectional •Fullyglasspassivated •600watt(10/1000ms) •Eliminateswirebonding •NONInductiveInsertion •Novoltageovershoot

MicrosemiMicrosemi Corporation

美高森美美高森美公司

Microsemi

Patented Flip-Chip Series

FEATURES •UnidirectionalandBidirectional •Fullyglasspassivated •600watt(10/1000ms) •Eliminateswirebonding •NONInductiveInsertion •Novoltageovershoot

MicrosemiMicrosemi Corporation

美高森美美高森美公司

Microsemi

Patented Flip-Chip Series

FEATURES •UnidirectionalandBidirectional •Fullyglasspassivated •600watt(10/1000ms) •Eliminateswirebonding •NONInductiveInsertion •Novoltageovershoot

MicrosemiMicrosemi Corporation

美高森美美高森美公司

Microsemi

Patented Flip-Chip Series

FEATURES •UnidirectionalandBidirectional •Fullyglasspassivated •600watt(10/1000ms) •Eliminateswirebonding •NONInductiveInsertion •Novoltageovershoot

MicrosemiMicrosemi Corporation

美高森美美高森美公司

Microsemi

Patented Flip-Chip Series

FEATURES •UnidirectionalandBidirectional •Fullyglasspassivated •600watt(10/1000ms) •Eliminateswirebonding •NONInductiveInsertion •Novoltageovershoot

MicrosemiMicrosemi Corporation

美高森美美高森美公司

Microsemi

Patented Flip-Chip Series

FEATURES •UnidirectionalandBidirectional •Fullyglasspassivated •600watt(10/1000ms) •Eliminateswirebonding •NONInductiveInsertion •Novoltageovershoot

MicrosemiMicrosemi Corporation

美高森美美高森美公司

Microsemi

Patented Flip-Chip Series

FEATURES •UnidirectionalandBidirectional •Fullyglasspassivated •600watt(10/1000ms) •Eliminateswirebonding •NONInductiveInsertion •Novoltageovershoot

MicrosemiMicrosemi Corporation

美高森美美高森美公司

Microsemi

Patented Flip-Chip Series

FEATURES •UnidirectionalandBidirectional •Fullyglasspassivated •600watt(10/1000ms) •Eliminateswirebonding •NONInductiveInsertion •Novoltageovershoot

MicrosemiMicrosemi Corporation

美高森美美高森美公司

Microsemi

Patented Flip-Chip Series

FEATURES •UnidirectionalandBidirectional •Fullyglasspassivated •600watt(10/1000ms) •Eliminateswirebonding •NONInductiveInsertion •Novoltageovershoot

MicrosemiMicrosemi Corporation

美高森美美高森美公司

Microsemi

Patented Flip-Chip Series

FEATURES •UnidirectionalandBidirectional •Fullyglasspassivated •600watt(10/1000ms) •Eliminateswirebonding •NONInductiveInsertion •Novoltageovershoot

MicrosemiMicrosemi Corporation

美高森美美高森美公司

Microsemi

Patented Flip-Chip Series

FEATURES •UnidirectionalandBidirectional •Fullyglasspassivated •600watt(10/1000ms) •Eliminateswirebonding •NONInductiveInsertion •Novoltageovershoot

MicrosemiMicrosemi Corporation

美高森美美高森美公司

Microsemi

Patented Flip-Chip Series

FEATURES •UnidirectionalandBidirectional •Fullyglasspassivated •600watt(10/1000ms) •Eliminateswirebonding •NONInductiveInsertion •Novoltageovershoot

MicrosemiMicrosemi Corporation

美高森美美高森美公司

Microsemi

Patented Flip-Chip Series

FEATURES •UnidirectionalandBidirectional •Fullyglasspassivated •600watt(10/1000ms) •Eliminateswirebonding •NONInductiveInsertion •Novoltageovershoot

MicrosemiMicrosemi Corporation

美高森美美高森美公司

Microsemi

Patented Flip-Chip Series

FEATURES •UnidirectionalandBidirectional •Fullyglasspassivated •600watt(10/1000ms) •Eliminateswirebonding •NONInductiveInsertion •Novoltageovershoot

MicrosemiMicrosemi Corporation

美高森美美高森美公司

Microsemi

Patented Flip-Chip Series

FEATURES •UnidirectionalandBidirectional •Fullyglasspassivated •600watt(10/1000ms) •Eliminateswirebonding •NONInductiveInsertion •Novoltageovershoot

MicrosemiMicrosemi Corporation

美高森美美高森美公司

Microsemi

Patented Flip-Chip Series

FEATURES •UnidirectionalandBidirectional •Fullyglasspassivated •600watt(10/1000ms) •Eliminateswirebonding •NONInductiveInsertion •Novoltageovershoot

MicrosemiMicrosemi Corporation

美高森美美高森美公司

Microsemi

Patented Flip-Chip Series

FEATURES •UnidirectionalandBidirectional •Fullyglasspassivated •600watt(10/1000ms) •Eliminateswirebonding •NONInductiveInsertion •Novoltageovershoot

MicrosemiMicrosemi Corporation

美高森美美高森美公司

Microsemi

Patented Flip-Chip Series

FEATURES •UnidirectionalandBidirectional •Fullyglasspassivated •600watt(10/1000ms) •Eliminateswirebonding •NONInductiveInsertion •Novoltageovershoot

MicrosemiMicrosemi Corporation

美高森美美高森美公司

Microsemi

Patented Flip-Chip Series

FEATURES •UnidirectionalandBidirectional •Fullyglasspassivated •600watt(10/1000ms) •Eliminateswirebonding •NONInductiveInsertion •Novoltageovershoot

MicrosemiMicrosemi Corporation

美高森美美高森美公司

Microsemi

Patented Flip-Chip Series

FEATURES •UnidirectionalandBidirectional •Fullyglasspassivated •600watt(10/1000ms) •Eliminateswirebonding •NONInductiveInsertion •Novoltageovershoot

MicrosemiMicrosemi Corporation

美高森美美高森美公司

Microsemi

Patented Flip-Chip Series

FEATURES •UnidirectionalandBidirectional •Fullyglasspassivated •600watt(10/1000ms) •Eliminateswirebonding •NONInductiveInsertion •Novoltageovershoot

MicrosemiMicrosemi Corporation

美高森美美高森美公司

Microsemi

Patented Flip-Chip Series

FEATURES •UnidirectionalandBidirectional •Fullyglasspassivated •600watt(10/1000ms) •Eliminateswirebonding •NONInductiveInsertion •Novoltageovershoot

MicrosemiMicrosemi Corporation

美高森美美高森美公司

Microsemi

Patented Flip-Chip Series

FEATURES •UnidirectionalandBidirectional •Fullyglasspassivated •600watt(10/1000ms) •Eliminateswirebonding •NONInductiveInsertion •Novoltageovershoot

MicrosemiMicrosemi Corporation

美高森美美高森美公司

Microsemi

Patented Flip-Chip Series

FEATURES •UnidirectionalandBidirectional •Fullyglasspassivated •600watt(10/1000ms) •Eliminateswirebonding •NONInductiveInsertion •Novoltageovershoot

MicrosemiMicrosemi Corporation

美高森美美高森美公司

Microsemi

Patented Flip-Chip Series

FEATURES •UnidirectionalandBidirectional •Fullyglasspassivated •600watt(10/1000ms) •Eliminateswirebonding •NONInductiveInsertion •Novoltageovershoot

MicrosemiMicrosemi Corporation

美高森美美高森美公司

Microsemi

Patented Flip-Chip Series

FEATURES •UnidirectionalandBidirectional •Fullyglasspassivated •600watt(10/1000ms) •Eliminateswirebonding •NONInductiveInsertion •Novoltageovershoot

MicrosemiMicrosemi Corporation

美高森美美高森美公司

Microsemi

Patented Flip-Chip Series

FEATURES •UnidirectionalandBidirectional •Fullyglasspassivated •600watt(10/1000ms) •Eliminateswirebonding •NONInductiveInsertion •Novoltageovershoot

MicrosemiMicrosemi Corporation

美高森美美高森美公司

Microsemi

Patented Flip-Chip Series

FEATURES •UnidirectionalandBidirectional •Fullyglasspassivated •600watt(10/1000ms) •Eliminateswirebonding •NONInductiveInsertion •Novoltageovershoot

MicrosemiMicrosemi Corporation

美高森美美高森美公司

Microsemi

Patented Flip-Chip Series

FEATURES •UnidirectionalandBidirectional •Fullyglasspassivated •600watt(10/1000ms) •Eliminateswirebonding •NONInductiveInsertion •Novoltageovershoot

MicrosemiMicrosemi Corporation

美高森美美高森美公司

Microsemi

Patented Flip-Chip Series

FEATURES •UnidirectionalandBidirectional •Fullyglasspassivated •600watt(10/1000ms) •Eliminateswirebonding •NONInductiveInsertion •Novoltageovershoot

MicrosemiMicrosemi Corporation

美高森美美高森美公司

Microsemi

Patented Flip-Chip Series

FEATURES •UnidirectionalandBidirectional •Fullyglasspassivated •600watt(10/1000ms) •Eliminateswirebonding •NONInductiveInsertion •Novoltageovershoot

MicrosemiMicrosemi Corporation

美高森美美高森美公司

Microsemi

Patented Flip-Chip Series

FEATURES •UnidirectionalandBidirectional •Fullyglasspassivated •600watt(10/1000ms) •Eliminateswirebonding •NONInductiveInsertion •Novoltageovershoot

MicrosemiMicrosemi Corporation

美高森美美高森美公司

Microsemi

Patented Flip-Chip Series

FEATURES •UnidirectionalandBidirectional •Fullyglasspassivated •600watt(10/1000ms) •Eliminateswirebonding •NONInductiveInsertion •Novoltageovershoot

MicrosemiMicrosemi Corporation

美高森美美高森美公司

Microsemi

Patented Flip-Chip Series

FEATURES •UnidirectionalandBidirectional •Fullyglasspassivated •600watt(10/1000ms) •Eliminateswirebonding •NONInductiveInsertion •Novoltageovershoot

MicrosemiMicrosemi Corporation

美高森美美高森美公司

Microsemi

Patented Flip-Chip Series

FEATURES •UnidirectionalandBidirectional •Fullyglasspassivated •600watt(10/1000ms) •Eliminateswirebonding •NONInductiveInsertion •Novoltageovershoot

MicrosemiMicrosemi Corporation

美高森美美高森美公司

Microsemi

CHFP产品属性

  • 类型

    描述

  • 型号

    CHFP

  • 制造商

    Eaton Corporation

  • 功能描述

    3/4" Filler Plates for Branch Breakers Slot in CH Loadcenter

更新时间:2024-6-9 14:56:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
TDK
DIP
68900
原包原标签100%进口原装常备现货!
3M
2308+
293284
一级代理,原装正品,公司现货!
CHENMKO-力勤
24+25+/26+27+
SC-70-5
78800
一一有问必回一特殊渠道一有长期订货一备货HK仓库
CHENMKO
23+
SC-70
63000
原装正品现货
23+
N/A
88000
一级代理放心采购
3M
2021+
1
285000
专供连接器,军工合格供应商!
Churod Electronics
21+
2204
正规渠道原装正品现货
21+ROHS
10000
原厂授权一级代理,专业海外优势订货,价格优势、品种
23+
N/A
58600
一级代理放心采购
CHENMKO
23+
12000

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