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型号	功能描述	生产厂家企业	LOGO
CHFP6KE10	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	MICROSEMI 美高森美	MICROSEMI
CHFP6KE100	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	MICROSEMI 美高森美	MICROSEMI
CHFP6KE100A	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	MICROSEMI 美高森美	MICROSEMI
CHFP6KE10A	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	MICROSEMI 美高森美	MICROSEMI
CHFP6KE11	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	MICROSEMI 美高森美	MICROSEMI
CHFP6KE110	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	MICROSEMI 美高森美	MICROSEMI
CHFP6KE110A	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	MICROSEMI 美高森美	MICROSEMI
CHFP6KE11A	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	MICROSEMI 美高森美	MICROSEMI
CHFP6KE12	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	MICROSEMI 美高森美	MICROSEMI
CHFP6KE120	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	MICROSEMI 美高森美	MICROSEMI
CHFP6KE120A	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	MICROSEMI 美高森美	MICROSEMI
CHFP6KE12A	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	MICROSEMI 美高森美	MICROSEMI
CHFP6KE13	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	MICROSEMI 美高森美	MICROSEMI
CHFP6KE130	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	MICROSEMI 美高森美	MICROSEMI
CHFP6KE130A	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	MICROSEMI 美高森美	MICROSEMI
CHFP6KE13A	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	MICROSEMI 美高森美	MICROSEMI
CHFP6KE14	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	MICROSEMI 美高森美	MICROSEMI
CHFP6KE14A	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	MICROSEMI 美高森美	MICROSEMI
CHFP6KE15	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	MICROSEMI 美高森美	MICROSEMI
CHFP6KE150	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	MICROSEMI 美高森美	MICROSEMI
CHFP6KE150A	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	MICROSEMI 美高森美	MICROSEMI
CHFP6KE15A	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	MICROSEMI 美高森美	MICROSEMI
CHFP6KE16	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	MICROSEMI 美高森美	MICROSEMI
CHFP6KE160	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	MICROSEMI 美高森美	MICROSEMI
CHFP6KE160A	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	MICROSEMI 美高森美	MICROSEMI
CHFP6KE16A	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	MICROSEMI 美高森美	MICROSEMI
CHFP6KE17	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	MICROSEMI 美高森美	MICROSEMI
CHFP6KE17A	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	MICROSEMI 美高森美	MICROSEMI
CHFP6KE18	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	MICROSEMI 美高森美	MICROSEMI
CHFP6KE18A	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	MICROSEMI 美高森美	MICROSEMI
CHFP6KE20	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	MICROSEMI 美高森美	MICROSEMI
CHFP6KE20A	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	MICROSEMI 美高森美	MICROSEMI
CHFP6KE22	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	MICROSEMI 美高森美	MICROSEMI
CHFP6KE22A	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	MICROSEMI 美高森美	MICROSEMI
CHFP6KE24	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	MICROSEMI 美高森美	MICROSEMI
CHFP6KE24A	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	MICROSEMI 美高森美	MICROSEMI
CHFP6KE26	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	MICROSEMI 美高森美	MICROSEMI
CHFP6KE26A	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	MICROSEMI 美高森美	MICROSEMI
CHFP6KE28	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	MICROSEMI 美高森美	MICROSEMI
CHFP6KE28A	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	MICROSEMI 美高森美	MICROSEMI
CHFP6KE30	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	MICROSEMI 美高森美	MICROSEMI
CHFP6KE30A	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	MICROSEMI 美高森美	MICROSEMI
CHFP6KE33	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	MICROSEMI 美高森美	MICROSEMI
CHFP6KE33A	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	MICROSEMI 美高森美	MICROSEMI
CHFP6KE36	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	MICROSEMI 美高森美	MICROSEMI
CHFP6KE36A	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	MICROSEMI 美高森美	MICROSEMI
CHFP6KE40	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	MICROSEMI 美高森美	MICROSEMI
CHFP6KE40A	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	MICROSEMI 美高森美	MICROSEMI
CHFP6KE43	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	MICROSEMI 美高森美	MICROSEMI
CHFP6KE43A	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	MICROSEMI 美高森美	MICROSEMI
CHFP6KE45	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	MICROSEMI 美高森美	MICROSEMI
CHFP6KE45A	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	MICROSEMI 美高森美	MICROSEMI
CHFP6KE48	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	MICROSEMI 美高森美	MICROSEMI
CHFP6KE48A	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	MICROSEMI 美高森美	MICROSEMI
CHFP6KE50	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	MICROSEMI 美高森美	MICROSEMI
CHFP6KE50A	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	MICROSEMI 美高森美	MICROSEMI
CHFP6KE51	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	MICROSEMI 美高森美	MICROSEMI
CHFP6KE51A	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	MICROSEMI 美高森美	MICROSEMI
CHFP6KE54	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	MICROSEMI 美高森美	MICROSEMI
CHFP6KE54A	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	MICROSEMI 美高森美	MICROSEMI

CHFP产品属性

类型
描述
型号
CHFP
制造商
Eaton Corporation
功能描述
3/4" Filler Plates for Branch Breakers Slot in CH Loadcenter

CHFP供应商更多...

更新时间：2026-8-1 23:01:00

IC供应商	芯片型号	品牌	批号	封装	库存	备注	价格
深圳市得捷芯城科技有限公司	CHF11050CBF500L	Bourns Inc.	25+	-	7786	正规渠道,免费送样。支持账期,BOM一站式配齐	询价
深圳市高捷芯城科技有限公司	CHF11050CBF500L	Bourns Inc.	25+	-	7734	样件支持,可原厂排单订货!	询价
千层芯半导体(深圳)有限公司	CHF-101	M/A-COM	24+	SMD	12800		询价
深圳市一线半导体有限公司	CHF1/10-0680E-TAP	TRW/IRC	24+		10026		询价
标准国际(香港)有限公司	CHF1/8-01-2611F	IRC	25+		5000	公司优势库存热卖中!!	询价
深圳市宇集芯电子有限公司	CHF12	EXXELIA	25+	N/A	6500	原厂正规渠道、保证进口原装正品假一罚十	询价
深圳市瑞祥辉半导体有限公司	CHF-101	SYNERGY	2308+	原装正品	4285	十年专业专注优势渠道商正品保证	询价
贸泽芯城（深圳）电子科技有限公司	CHF-102	SYNERGY	23+	NA	10000	原厂授权一级代理,专业海外优势订货,价格优势、品种	询价
上海市鑫鸿达电子	CHF1206CNT500LW	Bourns	2022+		206	全新原装货期两周	询价
深圳市湘达电子科技有限公司	CHF-101	SYNERGY	22+	NA	10000	只做原装,价格优惠,长期供货。	询价

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找IC，尽在114IC

CHFP产品属性

CHFP供应商更多...

CHFP芯片相关品牌

CHFP规格书下载地址

CHFP参数引脚图相关

CHFP数据表相关新闻

CHA3666-QAG/20优势代购正品

CHA2069-99F 优势供应

CHIPI-X10 USB数据线

ChatGPT需要怎样的芯片？

CHILISIN/奇力新AMRU000606308R2MA1车规功率电感18138231376

CHO-MASKIIEMI箔带CMT-HT-108-0500

DdatasheetPDF页码索引