CHFP6KE100资料使用说明书原装现货专卖-IC资料网

您好,欢迎来到114ic资料网！

114ic电子网登录注册

芯片资料

数据手册
丝印反查
库存查询
行业新闻
生产厂家
替换型号
晶体管

精确

型号	功能描述	生产厂家企业	LOGO
CHFP6KE10	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	Microsemi 美高森美	Microsemi
CHFP6KE100	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	Microsemi 美高森美	Microsemi
CHFP6KE100A	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	Microsemi 美高森美	Microsemi
CHFP6KE10A	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	Microsemi 美高森美	Microsemi
CHFP6KE11	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	Microsemi 美高森美	Microsemi
CHFP6KE110	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	Microsemi 美高森美	Microsemi
CHFP6KE110A	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	Microsemi 美高森美	Microsemi
CHFP6KE11A	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	Microsemi 美高森美	Microsemi
CHFP6KE12	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	Microsemi 美高森美	Microsemi
CHFP6KE120	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	Microsemi 美高森美	Microsemi
CHFP6KE120A	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	Microsemi 美高森美	Microsemi
CHFP6KE12A	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	Microsemi 美高森美	Microsemi
CHFP6KE13	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	Microsemi 美高森美	Microsemi
CHFP6KE130	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	Microsemi 美高森美	Microsemi
CHFP6KE130A	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	Microsemi 美高森美	Microsemi
CHFP6KE13A	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	Microsemi 美高森美	Microsemi
CHFP6KE14	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	Microsemi 美高森美	Microsemi
CHFP6KE14A	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	Microsemi 美高森美	Microsemi
CHFP6KE15	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	Microsemi 美高森美	Microsemi
CHFP6KE150	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	Microsemi 美高森美	Microsemi
CHFP6KE150A	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	Microsemi 美高森美	Microsemi
CHFP6KE15A	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	Microsemi 美高森美	Microsemi
CHFP6KE16	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	Microsemi 美高森美	Microsemi
CHFP6KE160	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	Microsemi 美高森美	Microsemi
CHFP6KE160A	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	Microsemi 美高森美	Microsemi
CHFP6KE16A	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	Microsemi 美高森美	Microsemi
CHFP6KE17	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	Microsemi 美高森美	Microsemi
CHFP6KE17A	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	Microsemi 美高森美	Microsemi
CHFP6KE18	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	Microsemi 美高森美	Microsemi
CHFP6KE18A	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	Microsemi 美高森美	Microsemi
CHFP6KE20	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	Microsemi 美高森美	Microsemi
CHFP6KE20A	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	Microsemi 美高森美	Microsemi
CHFP6KE22	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	Microsemi 美高森美	Microsemi
CHFP6KE22A	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	Microsemi 美高森美	Microsemi
CHFP6KE24	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	Microsemi 美高森美	Microsemi
CHFP6KE24A	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	Microsemi 美高森美	Microsemi
CHFP6KE26	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	Microsemi 美高森美	Microsemi
CHFP6KE26A	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	Microsemi 美高森美	Microsemi
CHFP6KE28	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	Microsemi 美高森美	Microsemi
CHFP6KE28A	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	Microsemi 美高森美	Microsemi
CHFP6KE30	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	Microsemi 美高森美	Microsemi
CHFP6KE30A	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	Microsemi 美高森美	Microsemi
CHFP6KE33	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	Microsemi 美高森美	Microsemi
CHFP6KE33A	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	Microsemi 美高森美	Microsemi
CHFP6KE36	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	Microsemi 美高森美	Microsemi
CHFP6KE36A	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	Microsemi 美高森美	Microsemi
CHFP6KE40	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	Microsemi 美高森美	Microsemi
CHFP6KE40A	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	Microsemi 美高森美	Microsemi
CHFP6KE43	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	Microsemi 美高森美	Microsemi
CHFP6KE43A	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	Microsemi 美高森美	Microsemi
CHFP6KE45	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	Microsemi 美高森美	Microsemi
CHFP6KE45A	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	Microsemi 美高森美	Microsemi
CHFP6KE48	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	Microsemi 美高森美	Microsemi
CHFP6KE48A	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	Microsemi 美高森美	Microsemi
CHFP6KE50	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	Microsemi 美高森美	Microsemi
CHFP6KE50A	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	Microsemi 美高森美	Microsemi
CHFP6KE51	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	Microsemi 美高森美	Microsemi
CHFP6KE51A	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	Microsemi 美高森美	Microsemi
CHFP6KE54	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	Microsemi 美高森美	Microsemi
CHFP6KE54A	Patented Flip-Chip Series FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 ms) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot	Microsemi 美高森美	Microsemi

CHFP产品属性

类型
描述
型号
CHFP
制造商
Eaton Corporation
功能描述
3/4" Filler Plates for Branch Breakers Slot in CH Loadcenter

CHFP供应商更多...

更新时间：2025-12-25 11:02:00

IC供应商	芯片型号	品牌	批号	封装	库存	备注	价格
深圳市明嘉莱科技有限公司	CHF-V-112DA2/25A	CHUROD/中汇瑞德	25+	DIP	880000	明嘉莱只做原装正品现货	询价
深圳市安富世纪电子有限公司	CHG-0512P	TDK	23+	DIP68	1723	专注配单,只做原装进口现货	询价
深圳市华斯顿科技有限公司	CHG-0505N	JRC	25+23+	DIP	29990	绝对原装正品全新进口深圳现货	询价
深圳市中远芯科技有限公司	CHF-V-112DA2/25A	CHUROD/中汇瑞德	23+	DIP	350	原装现货	询价
深圳市科芯源微电子有限公司	CHF-V-112DA2/25A	CHUROD/中汇瑞德	25+	原厂原封可拆样	54648	百分百原装现货实单必成	询价
现代芯城（深圳）科技有限公司	CHF-S-112DA2		24+	N/A	73000	一级代理-主营优势-实惠价格-不悔选择	询价
深圳市力拓辉电子有限公司	CHF-S-112DA2	中汇瑞德	21+	30.1mm15.7mm23.3mm	20	只做原装鄙视假货15118075546	询价
上海市鑫鸿达电子	CHG-1002-001010-KCP	3M	2022+		1	全新原装货期两周	询价
深圳市科恒伟业电子有限公司	CHG-0505NC	TDK/东电化	2450+	DIP7	6540	只做原厂原装正品终端客户免费申请样品	询价
深圳市益百分电子有限公司	CHG-0505HC	TDK		模块	2360	全新原装进口自己库存优势	询价

CHFP芯片相关品牌

CHFP规格书下载地址

CHFP参数引脚图相关

CHFP数据表相关新闻

CHA3666-QAG/20优势代购正品
型号CHA3666-QAG
2025-4-1
CHA2069-99F 优势供应
CHA2069-99F
2025-4-1
CHIPI-X10 USB数据线
CHIPI-X10 USB数据线/IEEE 1394数据线 USB TO DB9 MALE RS232 10CM CABLE
2023-5-17
ChatGPT需要怎样的芯片？
ChatGPT需要怎样的芯片？
2023-2-14
CHILISIN/奇力新AMRU000606308R2MA1车规功率电感18138231376
CHILISIN/奇力新AMRU000606308R2MA1车规功率电感18138231376
2020-11-7
CHO-MASKIIEMI箔带CMT-HT-108-0500
Parker Chomerics 的 CHO-MASK II 比电镀和涂覆方法更具成本效益和环境友好性
2019-11-21

DdatasheetPDF页码索引

P1
P2
P3
P4
P5
P6
P7
P8
P9
P10
P11
P12
P13
P14
P15
P16
P17
P18
P19
P20
P21
P22
P23
P24
P25
P26
P27
P28
P29
P30
P31
P32
P33
P34
P35
P36
P37
P38
P39
P40
P41
P42
P43
P44
P45
P46
P47
P48
P49
P50
P51
P52
P53
P54
P55
P56
P57
P58
P59
P60
P61
P62
P63
P64
P65
P66
P67
P68
P69
P70
P71
P72
P73
P74
P75
P76
P77
P78
P79
P80
P81
P82
P83
P84
P85
P86
P87
P88
P89
P90
P91
P92
P93
P94
P95
P96
P97
P98
P99
P100
P101
P102
P103
P104
P105
P106
P107

您好,欢迎来到114ic资料网！

CHFP产品属性

CHFP供应商更多...

CHFP芯片相关品牌

CHFP规格书下载地址

CHFP参数引脚图相关

CHFP数据表相关新闻

CHA3666-QAG/20优势代购正品

CHA2069-99F 优势供应

CHIPI-X10 USB数据线

ChatGPT需要怎样的芯片？

CHILISIN/奇力新AMRU000606308R2MA1车规功率电感18138231376

CHO-MASKIIEMI箔带CMT-HT-108-0500

DdatasheetPDF页码索引