COM Express Type 6 Basic Module with Intel® Xeon® E3/7th Gen Intel® Core™ i7/i5/i3 Processors and Intel® CM238/QM175/HM175

Features ● Intel® Xeon® E3 and 7th gen Intel® Core™ i7/i5/i3 processors (Kaby Lake-H) ● Intel® CM238/QM175/HM175 chipset ● 2 DDR4-2133 SO-DIMM slots, up to 32GB ECC or non-ECC ● 1 PCIe x16 and 8 PCIe x1 (Gen3) ● 4 SATA-600 with RAID 0/1/5/10 ● 4 USB 3.0 and 8 USB 2.0 ● Intel® AMT 11.0 and T

COM Express Type 6 Compact Module with 7th Gen Intel® Core™ & Celeron® Processor

Features ● 7th gen Intel® Core™ i7/i5/i3 and Celeron® processors (Kaby Lake-U) ● 2 DDR4-2133 SO-DIMM for up to 32GB of memory ● Max. up to 6 lanes of PCI Express ● 3 SATA-600 ● 4 USB 3.0 and 8 USB 2.0 ● TPM 1.2 supported ● AXView 2.0 intelligent remote management software

COM Express Type 6 Compact Module with 8th Gen Intel® Core™ & Celeron® Processor

Features ● 8th gen Intel® Core™ i7/i5/i3 and Celeron® processors (Whiskey Lake-U) ● 2 dual-channel DDR4-2400 SO-DIMM for up to 64GB ● Max. up to 8 lanes of PCI Express ● 3 SATA Gen3 ● 4 USB 3.0 and 8 USB 2.0 ● Supports eMMC for up to 64G (optional) ● TPM 2.0 supported ● AMS.AXView intellig

COM Express Type 6 Basic Module with Intel® Xeon® or 9th/8th Gen Intel® Core™ Processor and Intel® CM246/QM370

Features ● Intel® Xeon® or 9th/8th gen Intel® Core™ processor ● Intel® CM246/QM370 chipset ● Dual channel DDR4-2666 SO-DIMM for up to 64GB of memory ● 1 PCIe x16 and 8 PCIe x1 Gen3 ● 4 SATA Gen3 with RAID 0/1/5/10 ● 4 USB 3.2 and 8 USB 2.0 ● Supports TPM 2.0

COM Express Type 6 Compact Module with 13th/12th Gen Intel® Core™ or Celeron® Processor

Features ● 13th/12th gen Intel® Core™ i7/i5/i3 or Celeron® processor (Raptor Lake U/Alder Lake U) ● Dual channel DDR4-3200 SO-DIMM for up to 64GB memory ● Up to 12 lanes of PCI Express ● 2 SATA Gen3 ● 4 USB 3.2 and 8 USB 2.0 ● Supports NVMe for up to 512GB ● Supports TPM 2.0

COM Express Type 6 Compact Module with AMD Ryzen™ Embedded V1000 Processor

Features ● AMD Ryzen™ Embedded V1000 processors ● 2 DDR-2400/3200 SO-DIMM for up to 64GB of memory ● Max. up to 7 lanes of PCI Express ● 2 SATA-600 ● 3 USB 3.0 and 8 USB 2.0 ● TPM 2.0 supported ● Wide voltage input from +8V to +20V

COM Express Type 6 Compact Module with 6th Gen Intel® Core™ i7/i5/i3 and Celeron® Processor

Features ● 6th gen Intel® Core™ i7/i5/i3 and Celeron® processors (Skylake-U) ● 2 DDR4-2133 SO-DIMM, up to 32GB ● Max. up to 6 lanes of PCI Express ● 3 SATA-600 ● 4 USB 3.0 and 8 USB 2.0 ● AXView 2.0 intelligent remote management software ● TPM 1.2 supported

COM Express Type 6 Compact Module with Intel® Atom® x5 and x7 Processor

Features ● Intel® Atom® x5 and x7 processors (Apollo Lake) ● 2 DDR3L-1600 SO-DIMM for up to 8GB of memory ● Max. up to 4 lanes of PCI Express ● 2 SATA-600 ● 4 USB 3.0 and 8 USB 2.0 ● AXView 2.0 intelligent remote management software ● TPM 1.2 supported (optional)

COM Express Type 6 Compact Module with Intel® Pentium® Processor N4200 & Celeron® Processor N3350

Features ● Intel® Pentium® processor N4200 & Celeron® processor N3350 (Apollo Lake) ● 2 DDR3L-1600 SO-DIMM, up to 8GB ● Max. up to 4 lanes of PCIe ● 2 SATA-600 ● 4 USB 3.0 and 8 USB 2.0 ● AXView 2.0 intelligent remote management software for industrial IoT applications ● TPM 1.2 supported (

COM Express Type 6 Compact Module with Intel® Pentium®/Celeron® or Atom® x6000 Series Processors

Features ● Intel® Pentium®/Celeron® or Atom® x6000 series processors ● Dual-channel DDR4-3200 SO-DIMM, up to 32GB ● Up to 6 lanes of PCI Express ● 2 SATA Gen3 ● 2 USB 3.2 Gen1 and 8 USB 2.0 ● Supports up to 64GB eMMC 5.1 (by request) ● Supports TPM 2.0

COM Express Type 6 Basic Module with Intel® Xeon® and 6th Gen Intel® Core™ i7/i5/i3 Processor, Intel® CM236/QM170/HM170

Features ● 6th gen Intel® Xeon® and Core™ i7/i5/i3 processors (Skylake-H) ● Intel® CM236/QM170/HM170 chipset ● 2 DDR4-2133 SO-DIMM, up to 32GB ECC or non-ECC ● 1 x PCIe x16 and 8 x PCIe x1 Gen. 3 ● 4 SATA-600 with RAID 0/1/5/10 ● 4 USB 3.0 and 8 USB 2.0 ● Intel® AMT 11.0 and TPM 1.2 support

COM Express Type 6 Development Baseboard

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