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型号 功能描述 生产厂家 企业 LOGO 操作
CDBUR0145

SMD Schottky Barrier Diode

Io = 100 mA VR = 45 Volts Features Designed for mounting on small surface. Extremely thin/leadless package. Low leakage current. (IR=0.1uA typ.@VR=10V) Majority carrier conduction. Mechanical data Case: 0603(1608) standard package, molded plastic. Te

COMCHIP

典琦

CDBUR0145

封装/外壳:2-SMD,无引线 包装:卷带(TR) 描述:DIODE SCHOTTKY 45V 100MA 0603 分立半导体产品 二极管 - 整流器 - 单

COMCHIP

典琦

CDBUR0145

SMD Schottky Barrier Diode

COMCHIP

典琦

SMD Schottky Barrier Diode

Io = 100 mA VR = 45 Volts RoHS Device Halogen Free Features - Designed for mounting on small surface. - Extremely thin/leadless package. - Low leakage current. (IR=0.1uA typ.@VR=10V) - Majority carrier conduction. Mechanical data - Case: 0603/SOD-523F standard package, molded plastic. -

COMCHIP

典琦

封装/外壳:2-SMD,无引线 包装:剪切带(CT) 描述:DIODE SCHOTTKY 45V 100MA 0603 分立半导体产品 二极管 - 整流器 - 单

COMCHIP

典琦

Schottky Barrier Rectifiers Diodes

COMCHIP

典琦

SMD Schottky Barrier Diode

Io = 100 mA VR = 45 Volts Features Designed for mounting on small surface. Extremely thin/leadless package. Low leakage current (IR=0.1uA typ. @VR=10V). Majority carrier conduction. Mechanical data Case: 1005 (2512) Standard package , molded plastic. Terminals: Gold plat

COMCHIP

典琦

SMD Schottky Barrier Diode

Io = 100 mA VR = 45 Volts Features Designed for mounting on small surface. Extremely thin/leadless package. Low leakage current. (IR=0.1uA typ.@VR=10V) Majority carrier conduction. Mechanical data Case: 1005(2512) standard package, molded plastic. Te

COMCHIP

典琦

SMD Schottky Barrier Diode

Io = 100mA VR = 45 Volts Features Designed for mounting on small surface Extremely thin package Low stored charge Majority carrier conduction Mechanical data Case: 1206(3216)Standard package, molded plastic Terminals: Solder plated, solderable per MIL-STD-750, method 202

COMCHIP

典琦

SMD Schottky Barrier Diode

Io = 100mA VR = 45 Volts Features Designed for mounting on small surface Extremely thin package Low stored charge Majority carrier conduction Mechanical data Case: 0805(2012) Standard package, molded plastic. Terminals: Solder plated, solderable per MIL-STD-750, method 2

COMCHIP

典琦

CDBUR0145产品属性

  • 类型

    描述

  • VR(V):

    45

  • IO(A):

    0.1

  • 封裝型式:

    0603/SOD-523F

更新时间:2026-8-3 10:07:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
26+
N/A
56000
一级代理-主营优势-实惠价格-不悔选择
Semitehelec
23+
SOD-882
50000
全新原装正品现货,支持订货
Comchip Technology
25+
0603/SOD-523F
9350
独立分销商 公司只做原装 诚心经营 免费试样正品保证
CDB
23+
DFN1006(0402)
50000
全新原装正品现货,支持订货
SXSEMI
26+
DFN0603
900000
原装进口特价
23+
QFN
50000
只做原装正品
Comchip/典琦
25+
电联咨询
7800
公司现货,提供拆样技术支持
LIZ EIectronics
25+
SOD0201
10065
原装正品,有挂有货,假一赔十
CDB
25+
N/A
20000
只做原装,只有原装。
CDB
14+
DIP
3200
全新、原装

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