位置：首页 > IC中文资料第6107页 > CD52
| 型号 | 功能描述 | 生产厂家 企业 | LOGO | 操作 |
|---|---|---|---|---|
CD52 | Unshielded Inductors | ETC 知名厂家 | ETC |   |
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
CURRENT REGULATOR CHIPS • 1N5283 THRU 1N5314 AVAILABLE IN JANHC AND JANKC PER MIL-PRF-19500/463 • CURRENT REGULATOR CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5283 THRU 1N5314 • CONSTANT CURRENT OVER WIDE VOLTAGE RANGE • COMPATIBLE WITH ALL WIRE BONDING A | MICROSEMI 美高森美 | | ||
CURRENT REGULATOR CHIPS • 1N5283 THRU 1N5314 AVAILABLE IN JANHC AND JANKC PER MIL-PRF-19500/463 • CURRENT REGULATOR CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5283 THRU 1N5314 • CONSTANT CURRENT OVER WIDE VOLTAGE RANGE • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATT | CDI-DIODE | | ||
CURRENT REGULATOR CHIPS • 1N5283 THRU 1N5314 AVAILABLE IN JANHC AND JANKC PER MIL-PRF-19500/463 • CURRENT REGULATOR CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5283 THRU 1N5314 • CONSTANT CURRENT OVER WIDE VOLTAGE RANGE • COMPATIBLE WITH ALL WIRE BONDING A | MICROSEMI 美高森美 | | ||
CURRENT REGULATOR CHIPS • 1N5283 THRU 1N5314 AVAILABLE IN JANHC AND JANKC PER MIL-PRF-19500/463 • CURRENT REGULATOR CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5283 THRU 1N5314 • CONSTANT CURRENT OVER WIDE VOLTAGE RANGE • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATT | CDI-DIODE | | ||
CURRENT REGULATOR CHIPS • 1N5283 THRU 1N5314 AVAILABLE IN JANHC AND JANKC PER MIL-PRF-19500/463 • CURRENT REGULATOR CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5283 THRU 1N5314 • CONSTANT CURRENT OVER WIDE VOLTAGE RANGE • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATT | CDI-DIODE | | ||
CURRENT REGULATOR CHIPS • 1N5283 THRU 1N5314 AVAILABLE IN JANHC AND JANKC PER MIL-PRF-19500/463 • CURRENT REGULATOR CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5283 THRU 1N5314 • CONSTANT CURRENT OVER WIDE VOLTAGE RANGE • COMPATIBLE WITH ALL WIRE BONDING A | MICROSEMI 美高森美 | | ||
CURRENT REGULATOR CHIPS • 1N5283 THRU 1N5314 AVAILABLE IN JANHC AND JANKC PER MIL-PRF-19500/463 • CURRENT REGULATOR CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5283 THRU 1N5314 • CONSTANT CURRENT OVER WIDE VOLTAGE RANGE • COMPATIBLE WITH ALL WIRE BONDING A | MICROSEMI 美高森美 | |
CD52产品属性
- 类型
描述
- 型号
CD52
- 功能描述
Logic IC
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
Microchip Technology |
25+ |
模具 |
9350 |
独立分销商 公司只做原装 诚心经营 免费试样正品保证 |
|||
SUMIDA |
2447 |
SMD |
100500 |
一级代理专营品牌!原装正品,优势现货,长期排单到货 |
|||
台产 |
23+ |
CD52 |
50000 |
全新原装正品现货,支持订货 |
|||
MAG |
2018 |
SMD |
7495 |
一级代理,专注军工、汽车、医疗、工业、新能源、电力 |
|||
TI |
24+ |
DIP16 |
5150 |
||||
MICROSS |
2450+ |
SMD |
6540 |
只做原厂原装正品终端客户免费申请样品 |
|||
xx |
24+ |
XX |
5000 |
只做原装公司现货 |
|||
华晶 |
20+ |
SMD |
26580 |
全新原装长期特价销售 |
|||
TI/德州仪器 |
24+ |
CDIP20 |
1358 |
原装优势现货 |
|||
24+ |
N/A |
64000 |
一级代理-主营优势-实惠价格-不悔选择 |
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- CD5233B
- CD5232B
- CD5231B
- CD5230B
- CD5229B
- CD5228B
- CD5227B
- CD5226B
- CD5225B
- CD5224B
- CD5223B
- CD5222B
- CD5-221G
- CD5221G
- CD5221B
- CD521A107
- CD521A106
- CD521A105
- CD521A104
- CD521A103
- CD521A102
- CD521A101
- CD520C9W
- CD520B9W
- CD520B7W
- CD5196
- CD5195
- CD5194
- CD516C6W
- CD516B6W
- CD5-14
- CD5-13
- CD5125C6W
- CD511625
- CD511225
- CD511-108
- CD511-107
- CD511-106
- CD511-105
- CD511-104
- CD511-103
- CD511-102
- CD511-101
- CD510ED220D03
- CD510825
- CD51002
- CD5.243
- CD5.242
- CD5.241
- CD5.121
- CD486B
- CD485B
- CD483B
- CD4782A
- CD4782
- CD4781A
- CD4781
- CD4780A
- CD4780
- CD4777A
- CD4777
- CD4776A
CD52数据表相关新闻
CD4543BM96
CD4543BM96
2023-1-29CD74AC153全新原装现货
CD74AC153，全新原装现货0755-82732291当天发货或门市自取.
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CD4555BPWR，当天发货0755-82732291全新原装现货或门市自取.
2020-11-6CD4538BCN
+ 125 C单稳态多谐振荡器，2单稳态多谐振荡器+ 125 C单稳态多谐振荡器，2单稳态多谐振荡器，DHVQFN-16单稳态多谐振荡器，PDIP-16 12 mA单稳态多谐振荡器，单稳态多谐振荡器2-55 C单稳态多谐振荡器
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M74HC4094计数器移位寄存器，SOP-16计数器移位寄存器，8位计数器移位寄存器，74HC移位寄存器计数器移位寄存器，并行至串行计数器移位寄存器，4位计数器移位寄存器
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热门搜索： 74HC CMOS缓冲器和线路驱动器，SC70-6 SMD / SMT + 125 C-55 C同相缓冲器和线路驱动器，2输入2输出同相5.5 V 4.5 V缓冲器和线路驱动器，4输入4输出-32 mA缓冲器和线路驱动器，16输入16输出缓冲器和线路驱动器，10 uA 2输入2输出-32 mA 32 mA缓冲器和线路驱动器
2020-7-17
DdatasheetPDF页码索引
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