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CD5晶体管资料
CD5000D别名：CD5000D三极管、CD5000D晶体管、CD5000D晶体三极管
CD5000D生产厂家：
CD5000D制作材料：Si-NPN
CD5000D性质：调频 （FM）_前置放大 （V）_混频 （M）
CD5000D封装形式：直插封装
CD5000D极限工作电压：
CD5000D最大电流允许值：
CD5000D最大工作频率：200MHZ
CD5000D引脚数：3
CD5000D最大耗散功率：
CD5000D放大倍数：
CD5000D图片代号：C-78
CD5000Dvtest：0
CD5000Dhtest：200000000
- CD5000Datest：0
CD5000Dwtest：0
CD5000D代换 CD5000D用什么型号代替：BF255,
CD5价格
参考价格：￥0.0000
型号：CD5369AA 品牌：Harris 备注：这里有CD5多少钱，2025年最近7天走势，今日出价，今日竞价，CD5批发/采购报价，CD5行情走势销售排行榜，CD5报价。| 型号 | 功能描述 | 生产厂家&企业 | LOGO | 操作 |
|---|---|---|---|---|
CD5 | Miniature Dipped, Mica Capacitors 文件：512.52 Kbytes Page：5 Pages | ETC1List of Unclassifed Manufacturers etc未分类制造商未分类制造商 |   | |
Dual Diode POW-R-BLOK??Modules 250 Amperes/800 Volts Description: Powerex Dual Diode POW-R-BLOK™ Modules are designed for use in applications requiring AC to DC rectification in isolated packaging. The modules are isolated for easy mounting with other components on common heatsinks. The CD510825 has been tested and recognized by Underwriters Labor | POWEREX | | ||
Dual Diode POW-R-BLOK??Modules 250 Amperes/1200-1600 Volts Description: Powerex Dual Diode POW-R-BLOK™ Modules are designed for use in applications requiring AC to DC rectification in isolated packaging. The modules are isolated for easy mounting with other components on common heatsinks. POW-R-BLOK™ has been tested and recognized by Underwriters Labora | POWEREX | | ||
Dual Diode POW-R-BLOK??Modules 250 Amperes/1200-1600 Volts Description: Powerex Dual Diode POW-R-BLOK™ Modules are designed for use in applications requiring AC to DC rectification in isolated packaging. The modules are isolated for easy mounting with other components on common heatsinks. POW-R-BLOK™ has been tested and recognized by Underwriters Labora | POWEREX | | ||
CD5151CP Monolithic black and white TV circuit {Google Trans ...) | ETC1List of Unclassifed Manufacturers etc未分类制造商未分类制造商 | | ||
GENERAL PURPOSE SILICON DIODES • GENERAL PURPOSE SILICON DIODES • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES EXCEPT SOLDER REFLOW | Microsemi 美高森美 | | ||
GENERAL PURPOSE SILICON DIODES • GENERAL PURPOSE SILICON DIODES • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES EXCEPT SOLDER REFLOW | Microsemi 美高森美 | | ||
GENERAL PURPOSE SILICON DIODES • GENERAL PURPOSE SILICON DIODES • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES EXCEPT SOLDER REFLOW | Microsemi 美高森美 | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | | ||
ZENER DIODE CHIPS • ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW | CDI-DIODE | |
CD5产品属性
- 类型
描述
- 型号
CD5
- 功能描述
Miniature Dipped, Mica Capacitors
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
CYPRESS(赛普拉斯) |
24+ |
- |
14093 |
正规渠道,大量现货,只等你来。 |
|||
TI |
2025+ |
CDIP |
32560 |
原装优势绝对有货 |
|||
SUMIDA |
2019+ |
CD54 |
30000 |
原厂渠道,提供技术支持 |
|||
TI |
2014+ |
10 |
公司原装现货常备库存! |
||||
TI |
17+ |
DIP |
6200 |
100%原装正品现货 |
|||
英伟达 |
21+ |
10560 |
十年专营,原装现货,假一赔十 |
||||
CD华晶 |
24+ |
HSOP28 |
8000 |
只做自己库存,全新原装进口正品假一赔百,可开13%增 |
|||
TI |
24+ |
CDIP|14 |
70230 |
免费送样原盒原包现货一手渠道联系 |
|||
TI |
CDIP |
190 |
原装现货，优势库存 |
||||
TI |
23+ |
CDIP16 |
3658 |
原装正品价格优惠,长期优势供应 |
CD5规格书下载地址
CD5参数引脚图相关
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- d325
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- d1004
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- c波段
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- cs5532
- cs1
- cpld
- cp10
- connector
- cob
- cmos传感器
- cmos
- cm2006
- CL4071BCN
- CK-134A
- CJSE071
- CJSE067
- CIVH047AD
- cicret
- CH3065
- CG24015A
- CDW75BE
- CDW73BD
- CD74HCT373E
- CD74HCT32E
- CD74HCT244E
- CD74HCT14E
- CD74HCT133E
- CD74HCT08E
- CD74HCT04E
- CD73/187/73
- CD73/187/72
- CD6039
- CD5328
- CD5232B
- CD5231B
- CD5230B
- CD5229B
- CD5228B
- CD5227B
- CD5226B
- CD5225B
- CD5224B
- CD5223B
- CD5222B
- CD5221B
- CD5196
- CD5195
- CD5194
- CD51002
- CD5.243
- CD5.242
- CD5.241
- CD5.121
- CD4D85BF
- CD4D85BE
- CD4D85BD
- CD4D82BF
- CD4D82BE
- CD4D82BD
- CD486B
- CD485B
- CD483B
- CD4782A
- CD4782
- CD4781A
- CD4781
- CD4780A
- CD4780
- CD4777A
- CD4777
- CD4776A
- CD4776
- CD4775A
- CD4775
- CD4772A
- CD4772
- CD4771A
- CD4771
- CD4770A
- CD4585BF
- CD4585BE
- CD4585BD
- CD4566A
- CD4566
- CD4556BF
- CD4556BE
- CD4556BD
- CD4555BF
- CD4555BE
- CD4555BD
- CD4543BF
- CD4543BE
- CD4543BD
CD5数据表相关新闻
CD4543BM96
CD4543BM96
2023-1-29CD74AC153全新原装现货
CD74AC153，全新原装现货0755-82732291当天发货或门市自取.
2020-12-28CD4555BPWR
CD4555BPWR，当天发货0755-82732291全新原装现货或门市自取.
2020-11-6CD4538BCN
+ 125 C单稳态多谐振荡器，2单稳态多谐振荡器+ 125 C单稳态多谐振荡器，2单稳态多谐振荡器，DHVQFN-16单稳态多谐振荡器，PDIP-16 12 mA单稳态多谐振荡器，单稳态多谐振荡器2-55 C单稳态多谐振荡器
2020-7-21CD54HCT4060F3A
M74HC4094计数器移位寄存器，SOP-16计数器移位寄存器，8位计数器移位寄存器，74HC移位寄存器计数器移位寄存器，并行至串行计数器移位寄存器，4位计数器移位寄存器
2020-7-21CD54HCT541F3A
热门搜索： 74HC CMOS缓冲器和线路驱动器，SC70-6 SMD / SMT + 125 C-55 C同相缓冲器和线路驱动器，2输入2输出同相5.5 V 4.5 V缓冲器和线路驱动器，4输入4输出-32 mA缓冲器和线路驱动器，16输入16输出缓冲器和线路驱动器，10 uA 2输入2输出-32 mA 32 mA缓冲器和线路驱动器
2020-7-17
DdatasheetPDF页码索引
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