CC430F613价格

参考价格:¥24.0786

型号:CC430F6135IRGCR 品牌:TI 备注:这里有CC430F613多少钱,2026年最近7天走势,今日出价,今日竞价,CC430F613批发/采购报价,CC430F613行情走势销售排行榜,CC430F613报价。
型号 功能描述 生产厂家 企业 LOGO 操作
CC430F613

MSP430 SoC with RF Core

文件:1.49123 Mbytes Page:120 Pages

TI

德州仪器

CC430F613

MSP430??SoC with RF Core

文件:1.73648 Mbytes Page:120 Pages

TI

德州仪器

丝印代码:CC430F6135;CC430F613x, CC430F612x, CC430F513x MSP430™ SoC With RF Core

1.1 Features 1 • True System-on-Chip (SoC) for Low-Power Wireless Communication Applications • Wide Supply Voltage Range: 3.6 V Down to 1.8 V • Ultra-Low Power Consumption – CPU Active Mode (AM): 160 μA/MHz – Standby Mode (LPM3 RTC Mode): 2.0 μA – Off Mode (LPM4 RAM Retention): 1.0 μA – R

TI

德州仪器

丝印代码:CC430F6135;CC430F613x, CC430F612x, CC430F513x MSP430™ SoC With RF Core

1.1 Features 1 • True System-on-Chip (SoC) for Low-Power Wireless Communication Applications • Wide Supply Voltage Range: 3.6 V Down to 1.8 V • Ultra-Low Power Consumption – CPU Active Mode (AM): 160 μA/MHz – Standby Mode (LPM3 RTC Mode): 2.0 μA – Off Mode (LPM4 RAM Retention): 1.0 μA – R

TI

德州仪器

丝印代码:CC430F6135;CC430F613x, CC430F612x, CC430F513x MSP430™ SoC With RF Core

1.1 Features 1 • True System-on-Chip (SoC) for Low-Power Wireless Communication Applications • Wide Supply Voltage Range: 3.6 V Down to 1.8 V • Ultra-Low Power Consumption – CPU Active Mode (AM): 160 μA/MHz – Standby Mode (LPM3 RTC Mode): 2.0 μA – Off Mode (LPM4 RAM Retention): 1.0 μA – R

TI

德州仪器

丝印代码:CC430F6137;CC430F613x, CC430F612x, CC430F513x MSP430™ SoC With RF Core

1.1 Features 1 • True System-on-Chip (SoC) for Low-Power Wireless Communication Applications • Wide Supply Voltage Range: 3.6 V Down to 1.8 V • Ultra-Low Power Consumption – CPU Active Mode (AM): 160 μA/MHz – Standby Mode (LPM3 RTC Mode): 2.0 μA – Off Mode (LPM4 RAM Retention): 1.0 μA – R

TI

德州仪器

丝印代码:CC430F6137;CC430F613x, CC430F612x, CC430F513x MSP430™ SoC With RF Core

1.1 Features 1 • True System-on-Chip (SoC) for Low-Power Wireless Communication Applications • Wide Supply Voltage Range: 3.6 V Down to 1.8 V • Ultra-Low Power Consumption – CPU Active Mode (AM): 160 μA/MHz – Standby Mode (LPM3 RTC Mode): 2.0 μA – Off Mode (LPM4 RAM Retention): 1.0 μA – R

TI

德州仪器

丝印代码:CC430F6137;CC430F613x, CC430F612x, CC430F513x MSP430™ SoC With RF Core

1.1 Features 1 • True System-on-Chip (SoC) for Low-Power Wireless Communication Applications • Wide Supply Voltage Range: 3.6 V Down to 1.8 V • Ultra-Low Power Consumption – CPU Active Mode (AM): 160 μA/MHz – Standby Mode (LPM3 RTC Mode): 2.0 μA – Off Mode (LPM4 RAM Retention): 1.0 μA – R

TI

德州仪器

丝印代码:CC430F6137;CC430F613x, CC430F612x, CC430F513x MSP430™ SoC With RF Core

1.1 Features 1 • True System-on-Chip (SoC) for Low-Power Wireless Communication Applications • Wide Supply Voltage Range: 3.6 V Down to 1.8 V • Ultra-Low Power Consumption – CPU Active Mode (AM): 160 μA/MHz – Standby Mode (LPM3 RTC Mode): 2.0 μA – Off Mode (LPM4 RAM Retention): 1.0 μA – R

TI

德州仪器

CC430F613x, CC430F612x, CC430F513x MSP430™ SoC With RF Core

1.1 Features 1 • True System-on-Chip (SoC) for Low-Power Wireless Communication Applications • Wide Supply Voltage Range: 3.6 V Down to 1.8 V • Ultra-Low Power Consumption – CPU Active Mode (AM): 160 μA/MHz – Standby Mode (LPM3 RTC Mode): 2.0 μA – Off Mode (LPM4 RAM Retention): 1.0 μA – R

TI

德州仪器

CC430F613x, CC430F612x, CC430F513x MSP430™ SoC With RF Core

1.1 Features 1 • True System-on-Chip (SoC) for Low-Power Wireless Communication Applications • Wide Supply Voltage Range: 3.6 V Down to 1.8 V • Ultra-Low Power Consumption – CPU Active Mode (AM): 160 μA/MHz – Standby Mode (LPM3 RTC Mode): 2.0 μA – Off Mode (LPM4 RAM Retention): 1.0 μA – R

TI

德州仪器

CC430F613x, CC430F612x, CC430F513x MSP430™ SoC With RF Core

1.1 Features 1 • True System-on-Chip (SoC) for Low-Power Wireless Communication Applications • Wide Supply Voltage Range: 3.6 V Down to 1.8 V • Ultra-Low Power Consumption – CPU Active Mode (AM): 160 μA/MHz – Standby Mode (LPM3 RTC Mode): 2.0 μA – Off Mode (LPM4 RAM Retention): 1.0 μA – R

TI

德州仪器

CC430F613x, CC430F612x, CC430F513x MSP430™ SoC With RF Core

1.1 Features 1 • True System-on-Chip (SoC) for Low-Power Wireless Communication Applications • Wide Supply Voltage Range: 3.6 V Down to 1.8 V • Ultra-Low Power Consumption – CPU Active Mode (AM): 160 μA/MHz – Standby Mode (LPM3 RTC Mode): 2.0 μA – Off Mode (LPM4 RAM Retention): 1.0 μA – R

TI

德州仪器

ULTRA-LOW-POWER MICROCONTROLLERS

文件:6.72412 Mbytes Page:21 Pages

TI

德州仪器

具有 16KB 闪存、2KB SRAM、低于 1GHz 无线电、AES-128、12 位 ADC、I2C/SPI/UART 和 96 段 LCD 的 20MHz MCU

TI

德州仪器

MSP430??SoC with RF Core

文件:1.73648 Mbytes Page:120 Pages

TI

德州仪器

MSP430??SoC With RF Core

文件:2.06178 Mbytes Page:120 Pages

TI

德州仪器

MSP430??SoC with RF Core

文件:1.73648 Mbytes Page:120 Pages

TI

德州仪器

MSP430 SoC with RF Core

文件:1.49123 Mbytes Page:120 Pages

TI

德州仪器

MSP430 SoC with RF Core

文件:1.3211 Mbytes Page:118 Pages

TI

德州仪器

MSP430??SoC with RF Core

文件:1.62567 Mbytes Page:121 Pages

TI

德州仪器

封装/外壳:64-VFQFN 裸露焊盘 包装:管件 描述:IC RF TXRX+MCU ISM\u003c1GHZ 64VFQFN RF/IF,射频/中频和 RFID 射频收发器 IC

TI

德州仪器

MSP430 SoC with RF Core

文件:1.3211 Mbytes Page:118 Pages

TI

德州仪器

MSP430 SoC with RF Core

文件:1.49123 Mbytes Page:120 Pages

TI

德州仪器

MSP430 SoC with RF Core

文件:1.49123 Mbytes Page:120 Pages

TI

德州仪器

MSP430 SoC with RF Core

文件:1.3211 Mbytes Page:118 Pages

TI

德州仪器

封装/外壳:64-VFQFN 裸露焊盘 包装:管件 描述:IC RF TXRX+MCU ISM\u003c1GHZ 64VFQFN RF/IF,射频/中频和 RFID 射频收发器 IC

TI

德州仪器

具有 32KB 闪存、4KB SRAM、低于 1GHz 无线电、AES-128、12 位 ADC、I2C/SPI/UART 和 96 段 LCD 的 20MHz MCU

TI

德州仪器

MSP430??SoC With RF Core

文件:2.06178 Mbytes Page:120 Pages

TI

德州仪器

ULTRA-LOW-POWER MICROCONTROLLERS

文件:6.72412 Mbytes Page:21 Pages

TI

德州仪器

eZ430-Chronos development kit

文件:797.81 Kbytes Page:2 Pages

TI

德州仪器

MSP430??SoC with RF Core

文件:1.73648 Mbytes Page:120 Pages

TI

德州仪器

MSP430??SoC With RF Core

文件:2.06178 Mbytes Page:120 Pages

TI

德州仪器

MSP430??SoC with RF Core

文件:1.73648 Mbytes Page:120 Pages

TI

德州仪器

MSP430 SoC with RF Core

文件:1.49123 Mbytes Page:120 Pages

TI

德州仪器

MSP430 SoC with RF Core

文件:1.3211 Mbytes Page:118 Pages

TI

德州仪器

MSP430??SoC with RF Core

文件:1.62567 Mbytes Page:121 Pages

TI

德州仪器

MSP430 SoC with RF Core

文件:1.49123 Mbytes Page:120 Pages

TI

德州仪器

MSP430 SoC with RF Core

文件:1.3211 Mbytes Page:118 Pages

TI

德州仪器

MSP430 SoC with RF Core

文件:1.3211 Mbytes Page:118 Pages

TI

德州仪器

MSP430 SoC with RF Core

文件:1.49123 Mbytes Page:120 Pages

TI

德州仪器

MSP430 SoC with RF Core

文件:1.3211 Mbytes Page:118 Pages

TI

德州仪器

MSP430??SoC with RF Core

文件:1.62567 Mbytes Page:121 Pages

TI

德州仪器

MSP430 SoC with RF Core

文件:1.49123 Mbytes Page:120 Pages

TI

德州仪器

MSP430??SoC with RF Core

文件:1.62567 Mbytes Page:121 Pages

TI

德州仪器

CC430F613产品属性

  • 类型

    描述

  • 型号

    CC430F613

  • 制造商

    TI

  • 制造商全称

    Texas Instruments

  • 功能描述

    MSP430 SoC with RF Core

更新时间:2026-3-13 17:53:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
TI
15+
QFP48
80
全新原装公司现货
TI/德州仪器
24+
N/A
20000
原厂直供原装正品
TI
25+
VQFN-64
2000
公司原装现货常备物料!
TI
1816+
VQFN64
6808
一级代理,专注军工、汽车、医疗、工业、新能源、电力
22+
5000
只做原装鄙视假货15118075546
TI/德州仪器
25+
VQFN64
15000
全新原装现货,假一赔十。
TI
23+
NA
20000
TI/德州仪器
2517+
QFN
8850
只做原装正品现货或订货假一赔十!
TI/德州仪器
2023+
VQFN64
8635
一级代理优势现货,全新正品直营店
TI
25+
64-VQFN(9x9)
20948
样件支持,可原厂排单订货!

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