型号 功能描述 生产厂家&企业 LOGO 操作
CC2652P7

CC2652PSIPSimpleLink??Multiprotocol2.4-GHzWirelessSystem-in-PackageWithIntegratedPowerAmplifier

1Features Wirelessmicrocontroller •Powerful48-MHzArm®Cortex®-M4Fprocessor •352KBflashprogrammemory •256KBofROMforprotocolsandlibraryfunctions •8KBofcacheSRAM •80KBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation •Dynamicmultiprotocolmanager(

TITexas Instruments

德州仪器美国德州仪器公司

TI
CC2652P7

CC2642R-Q1SimpleLink™Bluetooth®5.2LowEnergyWirelessMCU

1Features Wirelessmicrocontroller •Powerful48-MHzArm®Cortex®-M4processor •EEMBCCoreMark®score:148 •352KBflashprogrammemory •256KBofROMforprotocolsandlibraryfunctions •8KBofcacheSRAM •80KBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation •2-

TITexas Instruments

德州仪器美国德州仪器公司

TI
CC2652P7

CC2674R10SimpleLink™High-PerformanceMultiprotocol2.4-GHzWirelessMCU

1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMisavailabl

TI1Texas Instruments

德州仪器美国德州仪器公司

TI1
CC2652P7

CC2674P10SimpleLink™High-PerformanceMultiprotocol2.4-GHzWirelessMCUwithIntegratedPowerAmplifier

1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMisavailabl

TITexas Instruments

德州仪器美国德州仪器公司

TI
CC2652P7

CC2340R5-Q1SimpleLink™Bluetooth®5.3LowEnergyWirelessMCU

1Features Wirelessmicrocontroller •AEC-Q100Grade2qualifiedforAutomotive applications •Optimized48-MHzArm®Cortex®-M0+processor •512KBofin-systemprogrammableflash •12KBofROMforbootloaderanddrivers •36KBofultra-lowleakageSRAM.FullRAM retentioninstandbymod

TI1Texas Instruments

德州仪器美国德州仪器公司

TI1
CC2652P7

CC1354P10SimpleLink™High-PerformanceMulti-bandWirelessMCUWithIntegratedPowerAmplifier

1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMisavailabl

TI1Texas Instruments

德州仪器美国德州仪器公司

TI1
CC2652P7

CC2340R2SimpleLink™Bluetooth®5.3LowEnergyWirelessMCU

1Features Wirelessmicrocontroller •Optimized48-MHzArm®Cortex®-M0+processor •256KBofin-systemprogrammableflash •12KBofROMforbootloaderanddrivers •28KBofultra-lowleakageSRAM.FullRAM retentioninstandbymode •2.4GHzRFtransceivercompatiblewith Bluetooth®5.3

TI1Texas Instruments

德州仪器美国德州仪器公司

TI1
CC2652P7

CC2340R2SimpleLink™Bluetooth®5.3LowEnergyWirelessMCU

1Features Wirelessmicrocontroller •Optimized48-MHzArm®Cortex®-M0+processor •256KBofin-systemprogrammableflash •12KBofROMforbootloaderanddrivers •28KBofultra-lowleakageSRAM.FullRAM retentioninstandbymode •2.4GHzRFtransceivercompatiblewith Bluetooth®5.3

TI1Texas Instruments

德州仪器美国德州仪器公司

TI1
CC2652P7

CC1314R10SimpleLink™High-PerformanceSub-1GHzWirelessMCU

1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMifparityisdis

TI1Texas Instruments

德州仪器美国德州仪器公司

TI1
CC2652P7

CC2674P10SimpleLink™High-PerformanceMultiprotocol2.4GHzWirelessMCUwithIntegratedPowerAmplifier

1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMifparityisdis

TI1Texas Instruments

德州仪器美国德州仪器公司

TI1
CC2652P7

CC2652P7SimpleLink??Multiprotocol2.4GHzWirelessMCUWithIntegratedPowerAmplifier

文件:1.48149 Mbytes Page:53 Pages

TITexas Instruments

德州仪器美国德州仪器公司

TI
CC2652P7

CC2651P3SimpleLink??Single-Protocol2.4GHzWirelessMCUWithIntegratedPowerAmplifier

文件:3.51768 Mbytes Page:63 Pages

TITexas Instruments

德州仪器美国德州仪器公司

TI

CC2652P7SimpleLink??Multiprotocol2.4GHzWirelessMCUWithIntegratedPowerAmplifier

文件:1.48149 Mbytes Page:53 Pages

TITexas Instruments

德州仪器美国德州仪器公司

TI

封装/外壳:48-VFQFN 裸露焊盘 包装:卷带(TR)剪切带(CT)Digi-Reel® 得捷定制卷带 描述:SIMPLELINK ARM CORTEX-M4F MULTIP RF/IF,射频/中频和 RFID 射频收发器 IC

TI2Texas Instruments

德州仪器美国德州仪器公司

TI2
更新时间:2025-6-27 12:10:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
Texas Instruments
24+
VQFN-48
3265
全新原厂原装,进口正品现货,正规渠道可含税!!
23+
NA
6800
原装正品,力挺实单
TI/德州仪器
25+
原厂封装
10280
原厂授权代理,专注军工、汽车、医疗、工业、新能源!
TI
21+
QFN48
10000
只做原装,质量保证
TI(德州仪器)
24+
VQFN-48
9548
原厂可订货,技术支持,直接渠道。可签保供合同
TI
24+
VQFN-48
2500
市场最低 原装现货 假一罚百 可开原型号
TI
24+
VQFN-48
10000
低于市场价,实单必成,QQ1562321770
TI
24+
QFN48
6000
全新原装深圳仓库现货有单必成
TI/德州仪器
25+
原厂封装
10000
TI
24+
QFN48
30000
原装正品公司现货,假一赔十!

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