CC2640F128价格

参考价格:¥30.1975

型号:CC2640F128RGZT 品牌:Texas Instruments 备注:这里有CC2640F128多少钱,2026年最近7天走势,今日出价,今日竞价,CC2640F128批发/采购报价,CC2640F128行情走势销售排行榜,CC2640F128报价。
型号 功能描述 生产厂家 企业 LOGO 操作

丝印代码:CC2640F128;CC2640 SimpleLink™ Bluetooth® Wireless MCU

1 1.1 Features 1 • Microcontroller – Powerful ARM® Cortex®-M3 – EEMBC CoreMark® Score: 142 – Up to 48-MHz Clock Speed – 128KB of In-System Programmable Flash – 8KB of SRAM for Cache – 20KB of Ultralow-Leakage SRAM – 2-Pin cJTAG and JTAG Debugging – Supports Over-The-Air Upgrade (OTA) •

TI

德州仪器

丝印代码:CC2640F128;CC2640 SimpleLink™ Bluetooth® Wireless MCU

1 1.1 Features 1 • Microcontroller – Powerful ARM® Cortex®-M3 – EEMBC CoreMark® Score: 142 – Up to 48-MHz Clock Speed – 128KB of In-System Programmable Flash – 8KB of SRAM for Cache – 20KB of Ultralow-Leakage SRAM – 2-Pin cJTAG and JTAG Debugging – Supports Over-The-Air Upgrade (OTA) •

TI

德州仪器

丝印代码:CC2640F128;CC2640 SimpleLink™ Bluetooth® Wireless MCU

1 1.1 Features 1 • Microcontroller – Powerful ARM® Cortex®-M3 – EEMBC CoreMark® Score: 142 – Up to 48-MHz Clock Speed – 128KB of In-System Programmable Flash – 8KB of SRAM for Cache – 20KB of Ultralow-Leakage SRAM – 2-Pin cJTAG and JTAG Debugging – Supports Over-The-Air Upgrade (OTA) •

TI

德州仪器

丝印代码:CC2640F128;CC2640 SimpleLink™ Bluetooth® Wireless MCU

1 1.1 Features 1 • Microcontroller – Powerful ARM® Cortex®-M3 – EEMBC CoreMark® Score: 142 – Up to 48-MHz Clock Speed – 128KB of In-System Programmable Flash – 8KB of SRAM for Cache – 20KB of Ultralow-Leakage SRAM – 2-Pin cJTAG and JTAG Debugging – Supports Over-The-Air Upgrade (OTA) •

TI

德州仪器

丝印代码:CC2640F128;CC2640 SimpleLink™ Bluetooth® Wireless MCU

1 1.1 Features 1 • Microcontroller – Powerful ARM® Cortex®-M3 – EEMBC CoreMark® Score: 142 – Up to 48-MHz Clock Speed – 128KB of In-System Programmable Flash – 8KB of SRAM for Cache – 20KB of Ultralow-Leakage SRAM – 2-Pin cJTAG and JTAG Debugging – Supports Over-The-Air Upgrade (OTA) •

TI

德州仪器

丝印代码:CC2640F128;CC2640 SimpleLink™ Bluetooth® Wireless MCU

1 1.1 Features 1 • Microcontroller – Powerful ARM® Cortex®-M3 – EEMBC CoreMark® Score: 142 – Up to 48-MHz Clock Speed – 128KB of In-System Programmable Flash – 8KB of SRAM for Cache – 20KB of Ultralow-Leakage SRAM – 2-Pin cJTAG and JTAG Debugging – Supports Over-The-Air Upgrade (OTA) •

TI

德州仪器

丝印代码:CC2640F128;CC2640 SimpleLink™ Bluetooth® Wireless MCU

1 1.1 Features 1 • Microcontroller – Powerful ARM® Cortex®-M3 – EEMBC CoreMark® Score: 142 – Up to 48-MHz Clock Speed – 128KB of In-System Programmable Flash – 8KB of SRAM for Cache – 20KB of Ultralow-Leakage SRAM – 2-Pin cJTAG and JTAG Debugging – Supports Over-The-Air Upgrade (OTA) •

TI

德州仪器

丝印代码:CC2640F128;CC2640 SimpleLink™ Bluetooth® Wireless MCU

1 1.1 Features 1 • Microcontroller – Powerful ARM® Cortex®-M3 – EEMBC CoreMark® Score: 142 – Up to 48-MHz Clock Speed – 128KB of In-System Programmable Flash – 8KB of SRAM for Cache – 20KB of Ultralow-Leakage SRAM – 2-Pin cJTAG and JTAG Debugging – Supports Over-The-Air Upgrade (OTA) •

TI

德州仪器

丝印代码:CC2640F128;CC2640 SimpleLink™ Bluetooth® Wireless MCU

1 1.1 Features 1 • Microcontroller – Powerful ARM® Cortex®-M3 – EEMBC CoreMark® Score: 142 – Up to 48-MHz Clock Speed – 128KB of In-System Programmable Flash – 8KB of SRAM for Cache – 20KB of Ultralow-Leakage SRAM – 2-Pin cJTAG and JTAG Debugging – Supports Over-The-Air Upgrade (OTA) •

TI

德州仪器

丝印代码:CC2640F128;CC2640 SimpleLink™ Bluetooth® Wireless MCU

1 1.1 Features 1 • Microcontroller – Powerful ARM® Cortex®-M3 – EEMBC CoreMark® Score: 142 – Up to 48-MHz Clock Speed – 128KB of In-System Programmable Flash – 8KB of SRAM for Cache – 20KB of Ultralow-Leakage SRAM – 2-Pin cJTAG and JTAG Debugging – Supports Over-The-Air Upgrade (OTA) •

TI

德州仪器

丝印代码:CC2640F128;CC2640 SimpleLink™ Bluetooth® Wireless MCU

1 1.1 Features 1 • Microcontroller – Powerful ARM® Cortex®-M3 – EEMBC CoreMark® Score: 142 – Up to 48-MHz Clock Speed – 128KB of In-System Programmable Flash – 8KB of SRAM for Cache – 20KB of Ultralow-Leakage SRAM – 2-Pin cJTAG and JTAG Debugging – Supports Over-The-Air Upgrade (OTA) •

TI

德州仪器

丝印代码:CC2640F128;CC2640 SimpleLink™ Bluetooth® Wireless MCU

1 1.1 Features 1 • Microcontroller – Powerful ARM® Cortex®-M3 – EEMBC CoreMark® Score: 142 – Up to 48-MHz Clock Speed – 128KB of In-System Programmable Flash – 8KB of SRAM for Cache – 20KB of Ultralow-Leakage SRAM – 2-Pin cJTAG and JTAG Debugging – Supports Over-The-Air Upgrade (OTA) •

TI

德州仪器

丝印代码:CC2640F128;CC2640 SimpleLink™ Bluetooth® Wireless MCU

1 1.1 Features 1 • Microcontroller – Powerful ARM® Cortex®-M3 – EEMBC CoreMark® Score: 142 – Up to 48-MHz Clock Speed – 128KB of In-System Programmable Flash – 8KB of SRAM for Cache – 20KB of Ultralow-Leakage SRAM – 2-Pin cJTAG and JTAG Debugging – Supports Over-The-Air Upgrade (OTA) •

TI

德州仪器

丝印代码:CC2640F128;CC2640 SimpleLink™ Bluetooth® Wireless MCU

1 1.1 Features 1 • Microcontroller – Powerful ARM® Cortex®-M3 – EEMBC CoreMark® Score: 142 – Up to 48-MHz Clock Speed – 128KB of In-System Programmable Flash – 8KB of SRAM for Cache – 20KB of Ultralow-Leakage SRAM – 2-Pin cJTAG and JTAG Debugging – Supports Over-The-Air Upgrade (OTA) •

TI

德州仪器

丝印代码:CC2640F128;CC2640 SimpleLink Bluetooth Smart Wireless MCU

文件:1.75518 Mbytes Page:51 Pages

TI

德州仪器

丝印代码:CC2640F128;CC2640 SimpleLink Bluetooth Smart Wireless MCU

文件:1.75518 Mbytes Page:51 Pages

TI

德州仪器

丝印代码:CC2640F128;CC2640 SimpleLink Bluetooth Smart Wireless MCU

文件:1.75518 Mbytes Page:51 Pages

TI

德州仪器

丝印代码:CC2640F128;CC2640 SimpleLink Bluetooth Smart Wireless MCU

文件:1.75518 Mbytes Page:51 Pages

TI

德州仪器

丝印代码:CC2640F128;CC2640 SimpleLink Bluetooth Smart Wireless MCU

文件:1.75518 Mbytes Page:51 Pages

TI

德州仪器

丝印代码:CC2640F128;CC2640 SimpleLink Bluetooth Smart Wireless MCU

文件:1.75518 Mbytes Page:51 Pages

TI

德州仪器

CC2640 SimpleLink™ Bluetooth® Wireless MCU

1 1.1 Features 1 • Microcontroller – Powerful ARM® Cortex®-M3 – EEMBC CoreMark® Score: 142 – Up to 48-MHz Clock Speed – 128KB of In-System Programmable Flash – 8KB of SRAM for Cache – 20KB of Ultralow-Leakage SRAM – 2-Pin cJTAG and JTAG Debugging – Supports Over-The-Air Upgrade (OTA) •

TI

德州仪器

CC2640 SimpleLink™ Bluetooth® Wireless MCU

1 1.1 Features 1 • Microcontroller – Powerful ARM® Cortex®-M3 – EEMBC CoreMark® Score: 142 – Up to 48-MHz Clock Speed – 128KB of In-System Programmable Flash – 8KB of SRAM for Cache – 20KB of Ultralow-Leakage SRAM – 2-Pin cJTAG and JTAG Debugging – Supports Over-The-Air Upgrade (OTA) •

TI

德州仪器

CC2640 SimpleLink™ Bluetooth® Wireless MCU

1 1.1 Features 1 • Microcontroller – Powerful ARM® Cortex®-M3 – EEMBC CoreMark® Score: 142 – Up to 48-MHz Clock Speed – 128KB of In-System Programmable Flash – 8KB of SRAM for Cache – 20KB of Ultralow-Leakage SRAM – 2-Pin cJTAG and JTAG Debugging – Supports Over-The-Air Upgrade (OTA) •

TI

德州仪器

CC2640 SimpleLink™ Bluetooth® Wireless MCU

1 1.1 Features 1 • Microcontroller – Powerful ARM® Cortex®-M3 – EEMBC CoreMark® Score: 142 – Up to 48-MHz Clock Speed – 128KB of In-System Programmable Flash – 8KB of SRAM for Cache – 20KB of Ultralow-Leakage SRAM – 2-Pin cJTAG and JTAG Debugging – Supports Over-The-Air Upgrade (OTA) •

TI

德州仪器

CC2640 SimpleLink™ Bluetooth® Wireless MCU

1 1.1 Features 1 • Microcontroller – Powerful ARM® Cortex®-M3 – EEMBC CoreMark® Score: 142 – Up to 48-MHz Clock Speed – 128KB of In-System Programmable Flash – 8KB of SRAM for Cache – 20KB of Ultralow-Leakage SRAM – 2-Pin cJTAG and JTAG Debugging – Supports Over-The-Air Upgrade (OTA) •

TI

德州仪器

CC2640 SimpleLink™ Bluetooth® Wireless MCU

1 1.1 Features 1 • Microcontroller – Powerful ARM® Cortex®-M3 – EEMBC CoreMark® Score: 142 – Up to 48-MHz Clock Speed – 128KB of In-System Programmable Flash – 8KB of SRAM for Cache – 20KB of Ultralow-Leakage SRAM – 2-Pin cJTAG and JTAG Debugging – Supports Over-The-Air Upgrade (OTA) •

TI

德州仪器

CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU

1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys

TI

德州仪器

CC2640 SimpleLink Bluetooth Smart Wireless MCU

文件:1.75518 Mbytes Page:51 Pages

TI

德州仪器

封装/外壳:48-VFQFN 裸露焊盘 包装:管件 描述:IC RF TXRX+MCU BLE 5.1 48VQFN RF/IF,射频/中频和 RFID 射频收发器 IC

TI

德州仪器

CC2640 SimpleLink Bluetooth Smart Wireless MCU

文件:1.75518 Mbytes Page:51 Pages

TI

德州仪器

封装/外壳:32-VFQFN 裸露焊盘 包装:卷带(TR)剪切带(CT)Digi-Reel® 得捷定制卷带 描述:IC RF TXRX+MCU BLUETOOTH 32VFQFN RF/IF,射频/中频和 RFID 射频收发器 IC

TI

德州仪器

CC2640 SimpleLink Bluetooth Smart Wireless MCU

文件:1.75518 Mbytes Page:51 Pages

TI

德州仪器

更新时间:2026-3-14 11:40:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
TI/德州仪器
25+
QFN48
33500
全新进口原装现货,假一罚十
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2025+
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TI/德州仪器
25+
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TI/德州仪器
23+
VQFN48
1820
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TI/德州仪器
26+
VQFN48
87230
全新原装进口现货,,本公司承诺原装正品假一赔百
TI
23+
48-VQFN
25000
TI现货商!原装正品!
TI/德州仪器
24+
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10000
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TI
23+/24+
VQFN48
9865
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TI
16+
VQFN48
2500
CC优势渠道原装现货
TI/德州仪器
2038+
VQFN48
8000
原装正品假一罚十

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