型号 功能描述 生产厂家 企业 LOGO 操作
CC1350F128RGZ

CC1350 SimpleLink™ Ultra-Low-Power Dual-Band Wireless MCU

1.1 Features 1 • World's First Dual-Band (Sub-1 GHz and 2.4 GHz) Wireless Microcontroller • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 128KB of In-System Programmable Flash – 8KB of SRAM for C

TI

德州仪器

CC1350F128RGZ

SimpleLink Ultra-Low-Power Dual-Band Wireless MCU

文件:1.0034 Mbytes Page:61 Pages

TI

德州仪器

CC1350 SimpleLink™ Ultra-Low-Power Dual-Band Wireless MCU

1.1 Features 1 • World's First Dual-Band (Sub-1 GHz and 2.4 GHz) Wireless Microcontroller • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 128KB of In-System Programmable Flash – 8KB of SRAM for C

TI

德州仪器

CC1350 SimpleLink™ Ultra-Low-Power Dual-Band Wireless MCU

1.1 Features 1 • World's First Dual-Band (Sub-1 GHz and 2.4 GHz) Wireless Microcontroller • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 128KB of In-System Programmable Flash – 8KB of SRAM for C

TI

德州仪器

CC1350 SimpleLink™ Ultra-Low-Power Dual-Band Wireless MCU

1.1 Features 1 • World's First Dual-Band (Sub-1 GHz and 2.4 GHz) Wireless Microcontroller • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 128KB of In-System Programmable Flash – 8KB of SRAM for C

TI

德州仪器

CC1350 SimpleLink™ Ultra-Low-Power Dual-Band Wireless MCU

1.1 Features 1 • World's First Dual-Band (Sub-1 GHz and 2.4 GHz) Wireless Microcontroller • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 128KB of In-System Programmable Flash – 8KB of SRAM for C

TI

德州仪器

SimpleLink Ultra-Low-Power Dual-Band Wireless MCU

文件:1.0034 Mbytes Page:61 Pages

TI

德州仪器

SimpleLink Ultra-Low-Power Dual-Band Wireless MCU

文件:799.63 Kbytes Page:52 Pages

TI

德州仪器

封装/外壳:48-VFQFN 裸露焊盘 包装:卷带(TR) 描述:IC RF TXRX+MCU BLE 4.2 48VQFN RF/IF,射频/中频和 RFID 射频收发器 IC

TI

德州仪器

SimpleLink Ultra-Low-Power Dual-Band Wireless MCU

文件:799.63 Kbytes Page:52 Pages

TI

德州仪器

SimpleLink Ultra-Low-Power Dual-Band Wireless MCU

文件:1.0034 Mbytes Page:61 Pages

TI

德州仪器

封装/外壳:48-VFQFN 裸露焊盘 包装:卷带(TR)剪切带(CT)Digi-Reel® 得捷定制卷带 描述:IC RF TXRX+MCU BLUETOOTH 48VFQFN RF/IF,射频/中频和 RFID 射频收发器 IC

TI

德州仪器

更新时间:2025-12-18 16:20:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
TI
25+
38
公司优势库存 热卖中!
TI
2430+
VQFN-48
8540
只做原装正品假一赔十为客户做到零风险!!
TI/德州仪器
24+
VQFN-48
19537
只供应原装正品 欢迎询价
TI
22+
5000
只做原装鄙视假货15118075546
TI
23+
NA
20000
TI
23+
VQFN-4
5000
全新原装,支持实单,非诚勿扰
TI
25+23+
QFN
27365
绝对原装正品全新进口深圳现货
TI
22+
48VFQFN
9000
原厂渠道,现货配单
TI/德州仪器
2023+
VQFN48
6895
原厂全新正品旗舰店优势现货
TI
24+
VQFN
17900
一级授权代理原装现货热卖

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