型号 功能描述 生产厂家 企业 LOGO 操作
CC1350F128RGZ

CC1350 SimpleLink™ Ultra-Low-Power Dual-Band Wireless MCU

1.1 Features 1 • World's First Dual-Band (Sub-1 GHz and 2.4 GHz) Wireless Microcontroller • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 128KB of In-System Programmable Flash – 8KB of SRAM for C

TI

德州仪器

CC1350F128RGZ

SimpleLink Ultra-Low-Power Dual-Band Wireless MCU

文件:1.0034 Mbytes Page:61 Pages

TI

德州仪器

CC1350 SimpleLink™ Ultra-Low-Power Dual-Band Wireless MCU

1.1 Features 1 • World's First Dual-Band (Sub-1 GHz and 2.4 GHz) Wireless Microcontroller • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 128KB of In-System Programmable Flash – 8KB of SRAM for C

TI

德州仪器

CC1350 SimpleLink™ Ultra-Low-Power Dual-Band Wireless MCU

1.1 Features 1 • World's First Dual-Band (Sub-1 GHz and 2.4 GHz) Wireless Microcontroller • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 128KB of In-System Programmable Flash – 8KB of SRAM for C

TI

德州仪器

CC1350 SimpleLink™ Ultra-Low-Power Dual-Band Wireless MCU

1.1 Features 1 • World's First Dual-Band (Sub-1 GHz and 2.4 GHz) Wireless Microcontroller • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 128KB of In-System Programmable Flash – 8KB of SRAM for C

TI

德州仪器

CC1350 SimpleLink™ Ultra-Low-Power Dual-Band Wireless MCU

1.1 Features 1 • World's First Dual-Band (Sub-1 GHz and 2.4 GHz) Wireless Microcontroller • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 128KB of In-System Programmable Flash – 8KB of SRAM for C

TI

德州仪器

SimpleLink Ultra-Low-Power Dual-Band Wireless MCU

文件:1.0034 Mbytes Page:61 Pages

TI

德州仪器

SimpleLink Ultra-Low-Power Dual-Band Wireless MCU

文件:799.63 Kbytes Page:52 Pages

TI

德州仪器

封装/外壳:48-VFQFN 裸露焊盘 包装:卷带(TR) 描述:IC RF TXRX+MCU BLE 4.2 48VQFN RF/IF,射频/中频和 RFID 射频收发器 IC

TI

德州仪器

SimpleLink Ultra-Low-Power Dual-Band Wireless MCU

文件:799.63 Kbytes Page:52 Pages

TI

德州仪器

SimpleLink Ultra-Low-Power Dual-Band Wireless MCU

文件:1.0034 Mbytes Page:61 Pages

TI

德州仪器

封装/外壳:48-VFQFN 裸露焊盘 包装:卷带(TR)剪切带(CT)Digi-Reel® 得捷定制卷带 描述:IC RF TXRX+MCU BLUETOOTH 48VFQFN RF/IF,射频/中频和 RFID 射频收发器 IC

TI

德州仪器

更新时间:2025-12-17 23:01:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
TI/德州仪器
24+
NA/
13826
优势代理渠道,原装正品,可全系列订货开增值税票
TI(德州仪器)
24+
QFN-48-EP(7x7)
2669
深耕行业12年,可提供技术支持。
TI
25+
VQFN48
31
原装正品,假一罚十!
Texas Instruments
24+
VQFN-48
3265
全新原厂原装,进口正品现货,正规渠道可含税!!
Texas Instruments
20+
VQFN-48
29860
TI微控制器MCU-可开原型号增税票
TI
2430+
VQFN-48
8540
只做原装正品假一赔十为客户做到零风险!!
TI
21+
VQFN
1356
绝对有现货,不止网上数量!原装正品,假一赔十!
TI/德州仪器
1614+
VQFN48
50
TI
23+
NA
20000
TI
22+
5000
只做原装鄙视假货15118075546

CC1350F128RGZ数据表相关新闻