型号 功能描述 生产厂家&企业 LOGO 操作
CC1311R3

CC2674P10SimpleLink™High-PerformanceMultiprotocol2.4-GHzWirelessMCUwithIntegratedPowerAmplifier

1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMisavailabl

TITexas Instruments

德州仪器美国德州仪器公司

TI
CC1311R3

CC2674R10SimpleLink™High-PerformanceMultiprotocol2.4-GHzWirelessMCU

1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMisavailabl

TI1Texas Instruments

德州仪器美国德州仪器公司

TI1
CC1311R3

CC1354P10SimpleLink™High-PerformanceMulti-bandWirelessMCUWithIntegratedPowerAmplifier

1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMisavailabl

TI1Texas Instruments

德州仪器美国德州仪器公司

TI1
CC1311R3

CC2340R5-Q1SimpleLink™Bluetooth®5.3LowEnergyWirelessMCU

1Features Wirelessmicrocontroller •AEC-Q100Grade2qualifiedforAutomotive applications •Optimized48-MHzArm®Cortex®-M0+processor •512KBofin-systemprogrammableflash •12KBofROMforbootloaderanddrivers •36KBofultra-lowleakageSRAM.FullRAM retentioninstandbymod

TI1Texas Instruments

德州仪器美国德州仪器公司

TI1
CC1311R3

CC2340R2SimpleLink™Bluetooth®5.3LowEnergyWirelessMCU

1Features Wirelessmicrocontroller •Optimized48-MHzArm®Cortex®-M0+processor •256KBofin-systemprogrammableflash •12KBofROMforbootloaderanddrivers •28KBofultra-lowleakageSRAM.FullRAM retentioninstandbymode •2.4GHzRFtransceivercompatiblewith Bluetooth®5.3

TI1Texas Instruments

德州仪器美国德州仪器公司

TI1
CC1311R3

CC1314R10SimpleLink™High-PerformanceSub-1GHzWirelessMCU

1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMifparityisdis

TI1Texas Instruments

德州仪器美国德州仪器公司

TI1
CC1311R3

CC2340R2SimpleLink™Bluetooth®5.3LowEnergyWirelessMCU

1Features Wirelessmicrocontroller •Optimized48-MHzArm®Cortex®-M0+processor •256KBofin-systemprogrammableflash •12KBofROMforbootloaderanddrivers •28KBofultra-lowleakageSRAM.FullRAM retentioninstandbymode •2.4GHzRFtransceivercompatiblewith Bluetooth®5.3

TI1Texas Instruments

德州仪器美国德州仪器公司

TI1
CC1311R3

CC2674P10SimpleLink™High-PerformanceMultiprotocol2.4GHzWirelessMCUwithIntegratedPowerAmplifier

1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMifparityisdis

TI1Texas Instruments

德州仪器美国德州仪器公司

TI1
CC1311R3

CC2652PSIPSimpleLink??Multiprotocol2.4-GHzWirelessSystem-in-PackageWithIntegratedPowerAmplifier

1Features Wirelessmicrocontroller •Powerful48-MHzArm®Cortex®-M4Fprocessor •352KBflashprogrammemory •256KBofROMforprotocolsandlibraryfunctions •8KBofcacheSRAM •80KBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation •Dynamicmultiprotocolmanager(

TITexas Instruments

德州仪器美国德州仪器公司

TI
CC1311R3

CC2642R-Q1SimpleLink™Bluetooth®5.2LowEnergyWirelessMCU

1Features Wirelessmicrocontroller •Powerful48-MHzArm®Cortex®-M4processor •EEMBCCoreMark®score:148 •352KBflashprogrammemory •256KBofROMforprotocolsandlibraryfunctions •8KBofcacheSRAM •80KBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation •2-

TITexas Instruments

德州仪器美国德州仪器公司

TI
CC1311R3

CC1311R3SimpleLink??High-PerformanceSub-1GHzWirelessMCU

文件:2.86982 Mbytes Page:64 Pages

TITexas Instruments

德州仪器美国德州仪器公司

TI
CC1311R3

CC2651P3SimpleLink??Single-Protocol2.4GHzWirelessMCUWithIntegratedPowerAmplifier

文件:3.51768 Mbytes Page:63 Pages

TITexas Instruments

德州仪器美国德州仪器公司

TI

CC1311R3SimpleLink??High-PerformanceSub-1GHzWirelessMCU

文件:2.86982 Mbytes Page:64 Pages

TITexas Instruments

德州仪器美国德州仪器公司

TI

CC1311R3SimpleLink??High-PerformanceSub-1GHzWirelessMCU

文件:2.86982 Mbytes Page:64 Pages

TITexas Instruments

德州仪器美国德州仪器公司

TI
更新时间:2025-6-25 20:00:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
TI(德州仪器)
24+
NA/
8735
原厂直销,现货供应,账期支持!
Texas Instruments
24+
VQFN-48
3265
全新原厂原装,进口正品现货,正规渠道可含税!!
Texas Instruments
20+
VQFN-48
29860
TI微控制器MCU-可开原型号增税票
TI(德州仪器)
24+/25+
10000
原装正品现货库存价优
TI/德州仪器
23+
VQFN-48
9990
只有原装
TI
21+
VQFN
9850
只做原装正品假一赔十!正规渠道订货!
TI/德州仪器
21+
VQFN48
2500
百域芯优势 实单必成 可开13点增值税
NA
23+
NA
26094
10年以上分销经验原装进口正品,做服务型企业
TI/德州仪器
25+
原厂封装
10280
原厂授权代理,专注军工、汽车、医疗、工业、新能源!
TI(德州仪器)
2021+
VQFN-48
502

CC1311R3芯片相关品牌

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