型号 功能描述 生产厂家 企业 LOGO 操作
CC1310F32RSM

CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU

1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka

TI

德州仪器

丝印代码:CC1310F32;CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU

1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka

TI

德州仪器

丝印代码:CC1310F32;CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU

1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka

TI

德州仪器

丝印代码:CC1310F32;CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU

1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka

TI

德州仪器

丝印代码:CC1310F32;CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU

1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka

TI

德州仪器

丝印代码:CC1310F32;SimpleLink Ultralow Power Sub-1-GHz Wireless MCU

文件:1.47595 Mbytes Page:54 Pages

TI

德州仪器

封装/外壳:32-VFQFN 裸露焊盘 包装:托盘 描述:IC RF TXRX+MCU ISM\u003c1GHZ 32VFQFN RF/IF,射频/中频和 RFID 射频收发器 IC

TI

德州仪器

封装/外壳:32-VFQFN 裸露焊盘 包装:管件 描述:IC RF TXRX+MCU 802.15.4 32VFQFN RF/IF,射频/中频和 RFID 射频收发器 IC

TI

德州仪器

丝印代码:CC1310F32;SimpleLink Ultralow Power Sub-1-GHz Wireless MCU

文件:1.47595 Mbytes Page:54 Pages

TI

德州仪器

CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU

1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka

TI

德州仪器

丝印代码:CC1310F32;CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU

1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka

TI

德州仪器

丝印代码:CC1310F32;CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU

1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka

TI

德州仪器

丝印代码:CC1310F32;SimpleLink Ultralow Power Sub-1-GHz Wireless MCU

文件:1.47595 Mbytes Page:54 Pages

TI

德州仪器

丝印代码:CC1310F32;SimpleLink Ultralow Power Sub-1-GHz Wireless MCU

文件:1.47595 Mbytes Page:54 Pages

TI

德州仪器

更新时间:2026-3-12 19:52:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
TI 热卖
18+
VQFN32
500
一级代理,专注军工、汽车、医疗、工业、新能源、电力
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24+
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3265
全新原厂原装,进口正品现货,正规渠道可含税!!
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20+
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29860
TI微控制器MCU-可开原型号增税票
TI(德州仪器)
24+/25+
10000
原装正品现货库存价优
TI(德州仪器)
23+
NA
20094
正纳10年以上分销经验原装进口正品做服务做口碑有支持
TI/德州仪器
25+
原厂封装
10280
原厂授权代理,专注军工、汽车、医疗、工业、新能源!
TI(德州仪器)
24+
N/A
6000
原厂原装,价格优势,欢迎洽谈!
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23+
VQFN32
24500
交个朋友支持实单
TI
24+
VQFN-32
39500
进口原装现货 支持实单价优
TI(德州仪器)
23+
VQFN-32(4x4)
13650
公司只做原装正品,假一赔十

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