型号 功能描述 生产厂家 企业 LOGO 操作
CC1310F128RSM

CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU

1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka

TI

德州仪器

CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU

1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka

TI

德州仪器

CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU

1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka

TI

德州仪器

CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU

1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka

TI

德州仪器

CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU

1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka

TI

德州仪器

封装/外壳:32-VFQFN 裸露焊盘 包装:卷带(TR)剪切带(CT)Digi-Reel® 得捷定制卷带 描述:IC RF TXRX+MCU ISM\u003c1GHZ 32VFQFN RF/IF,射频/中频和 RFID 射频收发器 IC

TI

德州仪器

SimpleLink Ultralow Power Sub-1-GHz Wireless MCU

文件:1.47595 Mbytes Page:54 Pages

TI

德州仪器

SimpleLink Ultralow Power Sub-1-GHz Wireless MCU

文件:1.47595 Mbytes Page:54 Pages

TI

德州仪器

封装/外壳:32-VFQFN 裸露焊盘 包装:卷带(TR)剪切带(CT)Digi-Reel® 得捷定制卷带 描述:IC RF TXRX+MCU ISM\u003c1GHZ 32VFQFN RF/IF,射频/中频和 RFID 射频收发器 IC

TI

德州仪器

CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU

1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka

TI

德州仪器

CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU

1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka

TI

德州仪器

CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU

1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka

TI

德州仪器

SimpleLink Ultralow Power Sub-1-GHz Wireless MCU

文件:1.47595 Mbytes Page:54 Pages

TI

德州仪器

SimpleLink Ultralow Power Sub-1-GHz Wireless MCU

文件:1.47595 Mbytes Page:54 Pages

TI

德州仪器

更新时间:2025-12-17 23:00:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
TI(德州仪器)
24+
QFN32
13048
原厂可订货,技术支持,直接渠道。可签保供合同
TI/德州仪器
23+
VQFN32
3000
全新原装假一赔十
TI/德州仪器
25+
VQFN32
32000
TI/德州仪器全新特价CC1310F128RSMR即刻询购立享优惠#长期有货
TI
23+
VQFN32
25000
仓库现货,下单即发货,含税13%
TI
21+
VQFN-32
2863
十年信誉,只做原装,有挂就有现货!
TI/德州仪器
23+
VQFN32
32078
10年以上分销商,原装进口件,服务型企业
TI/德州仪器
25+
明嘉莱只做原装正品现货
2510000
VQFN32
TI(德州仪器)
24+
32-VFQFN 裸露焊盘
12048
原厂可订货,技术支持,直接渠道。可签保供合同
TI(德州仪器)
23+
N/A
12000
一级代理,专注军工、汽车、医疗、工业、新能源、电力
TI/德州仪器
2025+
VQFN32
3000
原装进口价格优 请找坤融电子!

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