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C453价格
参考价格:¥281.3029
型号:C453 品牌:Coilcraft 备注:这里有C453多少钱,2025年最近7天走势,今日出价,今日竞价,C453批发/采购报价,C453行情走势销售排行榜,C453报价。型号 | 功能描述 | 生产厂家&企业 | LOGO | 操作 |
---|---|---|---|---|
OCXOSurfaceMountPackageReflowProcessCompatibleAT-CutandSC-CutCrystalOptionsLowProfileCompactPackage Frequencyrange10MHz–160MHz Standardfrequencies10;12.8;16.384;19.2;20;30.72;32.768MHz Features SurfaceMountPackage ReflowProcessCompatible AT-CutandSC-CutCrystalOptions LowProfileCompactPackage OCO1000,C4500 TypicalApplications BaseStation | Vectron Vectron International, Inc | |||
MULTILAYERCERAMICCHIPCAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation TDK株式会社东电化(中国)投资有限公司 | |||
MULTILAYERCERAMICCHIPCAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation TDK株式会社东电化(中国)投资有限公司 | |||
MULTILAYERCERAMICCHIPCAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •LowESLandexcellentfrequencycharacteristicsallowforacircuitde | TDKTDK Corporation TDK株式会社东电化(中国)投资有限公司 | |||
MultilayerCeramicChipCapacitorsGeneraluse Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation TDK株式会社东电化(中国)投资有限公司 | |||
MULTILAYERCERAMICCHIPCAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation TDK株式会社东电化(中国)投资有限公司 | |||
MULTILAYERCERAMICCHIPCAPACITORS CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency | TDKTDK Corporation TDK株式会社东电化(中国)投资有限公司 | |||
MultilayerCeramicChipCapacitorsGeneraluse Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation TDK株式会社东电化(中国)投资有限公司 | |||
MULTILAYERCERAMICCHIPCAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •LowESLandexcellentfrequencycharacteristicsallowforacircuitde | TDKTDK Corporation TDK株式会社东电化(中国)投资有限公司 | |||
MultilayerCeramicChipCapacitorsGeneraluse Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation TDK株式会社东电化(中国)投资有限公司 | |||
MULTILAYERCERAMICCHIPCAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation TDK株式会社东电化(中国)投资有限公司 | |||
MULTILAYERCERAMICCHIPCAPACITORS CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency | TDKTDK Corporation TDK株式会社东电化(中国)投资有限公司 | |||
MULTILAYERCERAMICCHIPCAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •LowESLandexcellentfrequencycharacteristicsallowforacircuitde | TDKTDK Corporation TDK株式会社东电化(中国)投资有限公司 | |||
MULTILAYERCERAMICCHIPCAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •LowESLandexcellentfrequencycharacteristicsallowforacircuitde | TDKTDK Corporation TDK株式会社东电化(中国)投资有限公司 | |||
MULTILAYERCERAMICCHIPCAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •LowESLandexcellentfrequencycharacteristicsallowforacircuitde | TDKTDK Corporation TDK株式会社东电化(中国)投资有限公司 | |||
MULTILAYERCERAMICCHIPCAPACITORSCommercialgrade,general(Upto75V) ■SERIESOVERVIEW GeneraltypeCseriesisasurface-mountedcomponent,whichmultilayerdielectricsandinnerelectrodesarestackedalternately.Themonolithic structureensuressuperiormechanicalstrengthandhighreliability.Also,outstandingfrequencycharacteristicssuchaslowESRandlo | TDKTDK Corporation TDK株式会社东电化(中国)投资有限公司 | |||
MultilayerCeramicChipCapacitors Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation TDK株式会社东电化(中国)投资有限公司 | |||
MultilayerCeramicChipCapacitors Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation TDK株式会社东电化(中国)投资有限公司 | |||
MultilayerCeramicChipCapacitors Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation TDK株式会社东电化(中国)投资有限公司 | |||
MultilayerCeramicChipCapacitors Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation TDK株式会社东电化(中国)投资有限公司 | |||
MultilayerCeramicChipCapacitors Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation TDK株式会社东电化(中国)投资有限公司 | |||
MultilayerCeramicChipCapacitors Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation TDK株式会社东电化(中国)投资有限公司 | |||
MULTILAYERCERAMICCHIPCAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation TDK株式会社东电化(中国)投资有限公司 | |||
MULTILAYERCERAMICCHIPCAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation TDK株式会社东电化(中国)投资有限公司 | |||
MULTILAYERCERAMICCHIPCAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation TDK株式会社东电化(中国)投资有限公司 | |||
MULTILAYERCERAMICCHIPCAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation TDK株式会社东电化(中国)投资有限公司 | |||
MULTILAYERCERAMICCHIPCAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation TDK株式会社东电化(中国)投资有限公司 | |||
MULTILAYERCERAMICCHIPCAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation TDK株式会社东电化(中国)投资有限公司 | |||
MULTILAYERCERAMICCHIPCAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation TDK株式会社东电化(中国)投资有限公司 | |||
MULTILAYERCERAMICCHIPCAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation TDK株式会社东电化(中国)投资有限公司 | |||
MULTILAYERCERAMICCHIPCAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation TDK株式会社东电化(中国)投资有限公司 | |||
MULTILAYERCERAMICCHIPCAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation TDK株式会社东电化(中国)投资有限公司 | |||
MultilayerCeramicChipCapacitors Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation TDK株式会社东电化(中国)投资有限公司 | |||
MultilayerCeramicChipCapacitors Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation TDK株式会社东电化(中国)投资有限公司 | |||
MultilayerCeramicChipCapacitors Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation TDK株式会社东电化(中国)投资有限公司 | |||
CeramicCapacitorsForMidVoltageSMD FEATURES •Theuniquedesignstructureformidvoltageenablesacompactsizewithhighvoltageresistance. •RatedvoltageEdc:100,250and630V. •C3225,C4532andC5750typesarespecifictoreflowsoldering. APPLICATIONS Snappercircuitsforswitchingpowersupply,ringerc | TDKTDK Corporation TDK株式会社东电化(中国)投资有限公司 | |||
CeramicCapacitorsForMidVoltageSMD FEATURES •Theuniquedesignstructureformidvoltageenablesacompactsizewithhighvoltageresistance. •RatedvoltageEdc:100,250and630V. •C3225,C4532andC5750typesarespecifictoreflowsoldering. APPLICATIONS Snappercircuitsforswitchingpowersupply,ringerc | TDKTDK Corporation TDK株式会社东电化(中国)投资有限公司 | |||
CeramicCapacitorsForMidVoltageSMD FEATURES •Theuniquedesignstructureformidvoltageenablesacompactsizewithhighvoltageresistance. •RatedvoltageEdc:100,250and630V. •C3225,C4532andC5750typesarespecifictoreflowsoldering. APPLICATIONS Snappercircuitsforswitchingpowersupply,ringerc | TDKTDK Corporation TDK株式会社东电化(中国)投资有限公司 | |||
CeramicCapacitorsForMidVoltageSMD FEATURES •Theuniquedesignstructureformidvoltageenablesacompactsizewithhighvoltageresistance. •RatedvoltageEdc:100,250and630V. •C3225,C4532andC5750typesarespecifictoreflowsoldering. APPLICATIONS Snappercircuitsforswitchingpowersupply,ringerc | TDKTDK Corporation TDK株式会社东电化(中国)投资有限公司 | |||
CeramicCapacitorsForMidVoltageSMD FEATURES •Theuniquedesignstructureformidvoltageenablesacompactsizewithhighvoltageresistance. •RatedvoltageEdc:100,250and630V. •C3225,C4532andC5750typesarespecifictoreflowsoldering. APPLICATIONS Snappercircuitsforswitchingpowersupply,ringerc | TDKTDK Corporation TDK株式会社东电化(中国)投资有限公司 | |||
CeramicCapacitorsForMidVoltageSMD FEATURES •Theuniquedesignstructureformidvoltageenablesacompactsizewithhighvoltageresistance. •RatedvoltageEdc:100,250and630V. •C3225,C4532andC5750typesarespecifictoreflowsoldering. APPLICATIONS Snappercircuitsforswitchingpowersupply,ringerc | TDKTDK Corporation TDK株式会社东电化(中国)投资有限公司 | |||
CeramicCapacitorsForMidVoltageSMD FEATURES •Theuniquedesignstructureformidvoltageenablesacompactsizewithhighvoltageresistance. •RatedvoltageEdc:100,250and630V. •C3225,C4532andC5750typesarespecifictoreflowsoldering. APPLICATIONS Snappercircuitsforswitchingpowersupply,ringerc | TDKTDK Corporation TDK株式会社东电化(中国)投资有限公司 | |||
CeramicCapacitorsForMidVoltageSMD FEATURES •Theuniquedesignstructureformidvoltageenablesacompactsizewithhighvoltageresistance. •RatedvoltageEdc:100,250and630V. •C3225,C4532andC5750typesarespecifictoreflowsoldering. APPLICATIONS Snappercircuitsforswitchingpowersupply,ringerc | TDKTDK Corporation TDK株式会社东电化(中国)投资有限公司 | |||
CeramicCapacitorsForMidVoltageSMD FEATURES •Theuniquedesignstructureformidvoltageenablesacompactsizewithhighvoltageresistance. •RatedvoltageEdc:100,250and630V. •C3225,C4532andC5750typesarespecifictoreflowsoldering. APPLICATIONS Snappercircuitsforswitchingpowersupply,ringerc | TDKTDK Corporation TDK株式会社东电化(中国)投资有限公司 | |||
CommercialGrade(MidVoltage(100to630V)) Features •Voltageratingof100Vto630Vwithcapacitancerangeupto15μF. •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Lowresidualinductanceassuressuperiorfrequencycharacteristics. •Excellent | TDKTDK Corporation TDK株式会社东电化(中国)投资有限公司 | |||
CommercialGrade(MidVoltage(100to630V)) Features •Voltageratingof100Vto630Vwithcapacitancerangeupto15μF. •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Lowresidualinductanceassuressuperiorfrequencycharacteristics. •Excellent | TDKTDK Corporation TDK株式会社东电化(中国)投资有限公司 | |||
CeramicCapacitorsForMidVoltageSMD FEATURES •Theuniquedesignstructureformidvoltageenablesacompactsizewithhighvoltageresistance. •RatedvoltageEdc:100,250and630V. •C3225,C4532andC5750typesarespecifictoreflowsoldering. APPLICATIONS Snappercircuitsforswitchingpowersupply,ringerc | TDKTDK Corporation TDK株式会社东电化(中国)投资有限公司 | |||
CeramicCapacitorsForMidVoltageSMD FEATURES •Theuniquedesignstructureformidvoltageenablesacompactsizewithhighvoltageresistance. •RatedvoltageEdc:100,250and630V. •C3225,C4532andC5750typesarespecifictoreflowsoldering. APPLICATIONS Snappercircuitsforswitchingpowersupply,ringerc | TDKTDK Corporation TDK株式会社东电化(中国)投资有限公司 | |||
CeramicCapacitorsForMidVoltageSMD FEATURES •Theuniquedesignstructureformidvoltageenablesacompactsizewithhighvoltageresistance. •RatedvoltageEdc:100,250and630V. •C3225,C4532andC5750typesarespecifictoreflowsoldering. APPLICATIONS Snappercircuitsforswitchingpowersupply,ringerc | TDKTDK Corporation TDK株式会社东电化(中国)投资有限公司 | |||
CeramicCapacitorsForMidVoltageSMD FEATURES •Theuniquedesignstructureformidvoltageenablesacompactsizewithhighvoltageresistance. •RatedvoltageEdc:100,250and630V. •C3225,C4532andC5750typesarespecifictoreflowsoldering. APPLICATIONS Snappercircuitsforswitchingpowersupply,ringerc | TDKTDK Corporation TDK株式会社东电化(中国)投资有限公司 | |||
CeramicCapacitorsForMidVoltageSMD FEATURES •Theuniquedesignstructureformidvoltageenablesacompactsizewithhighvoltageresistance. •RatedvoltageEdc:100,250and630V. •C3225,C4532andC5750typesarespecifictoreflowsoldering. APPLICATIONS Snappercircuitsforswitchingpowersupply,ringerc | TDKTDK Corporation TDK株式会社东电化(中国)投资有限公司 | |||
CeramicCapacitorsForMidVoltageSMD FEATURES •Theuniquedesignstructureformidvoltageenablesacompactsizewithhighvoltageresistance. •RatedvoltageEdc:100,250and630V. •C3225,C4532andC5750typesarespecifictoreflowsoldering. APPLICATIONS Snappercircuitsforswitchingpowersupply,ringerc | TDKTDK Corporation TDK株式会社东电化(中国)投资有限公司 | |||
CeramicCapacitorsForMidVoltageSMD FEATURES •Theuniquedesignstructureformidvoltageenablesacompactsizewithhighvoltageresistance. •RatedvoltageEdc:100,250and630V. •C3225,C4532andC5750typesarespecifictoreflowsoldering. APPLICATIONS Snappercircuitsforswitchingpowersupply,ringerc | TDKTDK Corporation TDK株式会社东电化(中国)投资有限公司 | |||
CeramicCapacitorsForMidVoltageSMD FEATURES •Theuniquedesignstructureformidvoltageenablesacompactsizewithhighvoltageresistance. •RatedvoltageEdc:100,250and630V. •C3225,C4532andC5750typesarespecifictoreflowsoldering. APPLICATIONS Snappercircuitsforswitchingpowersupply,ringerc | TDKTDK Corporation TDK株式会社东电化(中国)投资有限公司 | |||
CeramicCapacitorsForMidVoltageSMD FEATURES •Theuniquedesignstructureformidvoltageenablesacompactsizewithhighvoltageresistance. •RatedvoltageEdc:100,250and630V. •C3225,C4532andC5750typesarespecifictoreflowsoldering. APPLICATIONS Snappercircuitsforswitchingpowersupply,ringerc | TDKTDK Corporation TDK株式会社东电化(中国)投资有限公司 | |||
CommercialGrade(MidVoltage(100to630V)) Features •Voltageratingof100Vto630Vwithcapacitancerangeupto15μF. •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Lowresidualinductanceassuressuperiorfrequencycharacteristics. •Excellent | TDKTDK Corporation TDK株式会社东电化(中国)投资有限公司 | |||
CommercialGrade(MidVoltage(100to630V)) Features •Voltageratingof100Vto630Vwithcapacitancerangeupto15μF. •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Lowresidualinductanceassuressuperiorfrequencycharacteristics. •Excellent | TDKTDK Corporation TDK株式会社东电化(中国)投资有限公司 | |||
CeramicCapacitorsForMidVoltageSMD FEATURES •Theuniquedesignstructureformidvoltageenablesacompactsizewithhighvoltageresistance. •RatedvoltageEdc:100,250and630V. •C3225,C4532andC5750typesarespecifictoreflowsoldering. APPLICATIONS Snappercircuitsforswitchingpowersupply,ringerc | TDKTDK Corporation TDK株式会社东电化(中国)投资有限公司 | |||
CeramicCapacitorsForMidVoltageSMD FEATURES •Theuniquedesignstructureformidvoltageenablesacompactsizewithhighvoltageresistance. •RatedvoltageEdc:100,250and630V. •C3225,C4532andC5750typesarespecifictoreflowsoldering. APPLICATIONS Snappercircuitsforswitchingpowersupply,ringerc | TDKTDK Corporation TDK株式会社东电化(中国)投资有限公司 | |||
CeramicCapacitorsForMidVoltageSMD FEATURES •Theuniquedesignstructureformidvoltageenablesacompactsizewithhighvoltageresistance. •RatedvoltageEdc:100,250and630V. •C3225,C4532andC5750typesarespecifictoreflowsoldering. APPLICATIONS Snappercircuitsforswitchingpowersupply,ringerc | TDKTDK Corporation TDK株式会社东电化(中国)投资有限公司 |
C453产品属性
- 类型
描述
- 型号
C453
- 制造商
VECTRON
- 制造商全称
Vectron International, Inc
- 功能描述
OCXO Surface Mount Package Reflow Process Compatible AT-Cut and SC-Cut Crystal Options Low Profile Compact Package
IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
---|---|---|---|---|---|---|---|
TDK |
24+ |
1812 |
7350 |
现货供应,当天可交货!免费送样,原厂技术支持!!! |
|||
TDK |
24+ |
1812 |
1000 |
优势代理渠道,原装正品,可全系列订货开增值税票 |
|||
TDK |
2025+ |
SMD |
16854648 |
代理销售TDK原装现货 |
|||
TDK |
24+ |
N/A |
5650 |
公司原厂原装现货假一罚十!特价出售!强势库存! |
|||
TDK |
23+ |
SMD |
55000 |
1812 C0G 250V 47NF 5% |
|||
TDK/东电化 |
23+ |
SMD |
10000 |
原厂授权一级代理,专业海外优势订货,价格优势、品种 |
|||
TDK |
17+ |
SMD |
100000 |
原装正品现货 |
|||
TDK |
9856 |
1812 |
1812 |
只做进口原装现货!假一赔十! |
|||
TDK |
24+ |
SMD |
320000 |
||||
TDK |
22+ |
SMD |
54000 |
原装现货样品可售 |
C453规格书下载地址
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- C4559-6
- C4559-5
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- C4532
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- C45-2DC-84
- C45-2DC-72P
- C45-2DC-60
- C45-2DC-36
- C45-2DC-24P
- C45-2DC-24
- C45-2DC-144P
- C45-2DC
- C45-24P
- C45-24
- C4520X7S3A472M160KA
- C4520X7S3A472K160KA
- C4520X7S3A222M160KA
- C4520X7S3A222K160KA
- C4520X7R3D471M130KA
- C4520X7R3D471K130KA
- C4520X7R3D102M130KE
- C4520X7R3D102M130KA
- C4520X7R3D102K130KE
- C4520X7R3D102K130KA
- C4520
- C451T2
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- C451S1
- C451PS2
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- C451PN2
- C451PN1
- C451PN
- C451PM2
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- C451PE2
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C453数据表相关新闻
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2019-3-7
DdatasheetPDF页码索引
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