C453价格

参考价格:¥281.3029

型号:C453 品牌:Coilcraft 备注:这里有C453多少钱,2025年最近7天走势,今日出价,今日竞价,C453批发/采购报价,C453行情走势销售排行榜,C453报价。
型号 功能描述 生产厂家&企业 LOGO 操作

OCXOSurfaceMountPackageReflowProcessCompatibleAT-CutandSC-CutCrystalOptionsLowProfileCompactPackage

Frequencyrange10MHz–160MHz Standardfrequencies10;12.8;16.384;19.2;20;30.72;32.768MHz Features SurfaceMountPackage ReflowProcessCompatible AT-CutandSC-CutCrystalOptions LowProfileCompactPackage OCO1000,C4500 TypicalApplications BaseStation

Vectron

Vectron International, Inc

Vectron

MULTILAYERCERAMICCHIPCAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式会社东电化(中国)投资有限公司

TDK

MULTILAYERCERAMICCHIPCAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式会社东电化(中国)投资有限公司

TDK

MULTILAYERCERAMICCHIPCAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •LowESLandexcellentfrequencycharacteristicsallowforacircuitde

TDKTDK Corporation

TDK株式会社东电化(中国)投资有限公司

TDK

MultilayerCeramicChipCapacitorsGeneraluse

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式会社东电化(中国)投资有限公司

TDK

MULTILAYERCERAMICCHIPCAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式会社东电化(中国)投资有限公司

TDK

MULTILAYERCERAMICCHIPCAPACITORS

CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency

TDKTDK Corporation

TDK株式会社东电化(中国)投资有限公司

TDK

MultilayerCeramicChipCapacitorsGeneraluse

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式会社东电化(中国)投资有限公司

TDK

MULTILAYERCERAMICCHIPCAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •LowESLandexcellentfrequencycharacteristicsallowforacircuitde

TDKTDK Corporation

TDK株式会社东电化(中国)投资有限公司

TDK

MultilayerCeramicChipCapacitorsGeneraluse

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式会社东电化(中国)投资有限公司

TDK

MULTILAYERCERAMICCHIPCAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式会社东电化(中国)投资有限公司

TDK

MULTILAYERCERAMICCHIPCAPACITORS

CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency

TDKTDK Corporation

TDK株式会社东电化(中国)投资有限公司

TDK

MULTILAYERCERAMICCHIPCAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •LowESLandexcellentfrequencycharacteristicsallowforacircuitde

TDKTDK Corporation

TDK株式会社东电化(中国)投资有限公司

TDK

MULTILAYERCERAMICCHIPCAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •LowESLandexcellentfrequencycharacteristicsallowforacircuitde

TDKTDK Corporation

TDK株式会社东电化(中国)投资有限公司

TDK

MULTILAYERCERAMICCHIPCAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •LowESLandexcellentfrequencycharacteristicsallowforacircuitde

TDKTDK Corporation

TDK株式会社东电化(中国)投资有限公司

TDK

MULTILAYERCERAMICCHIPCAPACITORSCommercialgrade,general(Upto75V)

■SERIESOVERVIEW GeneraltypeCseriesisasurface-mountedcomponent,whichmultilayerdielectricsandinnerelectrodesarestackedalternately.Themonolithic structureensuressuperiormechanicalstrengthandhighreliability.Also,outstandingfrequencycharacteristicssuchaslowESRandlo

TDKTDK Corporation

TDK株式会社东电化(中国)投资有限公司

TDK

MultilayerCeramicChipCapacitors

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式会社东电化(中国)投资有限公司

TDK

MultilayerCeramicChipCapacitors

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式会社东电化(中国)投资有限公司

TDK

MultilayerCeramicChipCapacitors

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式会社东电化(中国)投资有限公司

TDK

MultilayerCeramicChipCapacitors

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式会社东电化(中国)投资有限公司

TDK

MultilayerCeramicChipCapacitors

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式会社东电化(中国)投资有限公司

TDK

MultilayerCeramicChipCapacitors

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式会社东电化(中国)投资有限公司

TDK

MULTILAYERCERAMICCHIPCAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式会社东电化(中国)投资有限公司

TDK

MULTILAYERCERAMICCHIPCAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式会社东电化(中国)投资有限公司

TDK

MULTILAYERCERAMICCHIPCAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式会社东电化(中国)投资有限公司

TDK

MULTILAYERCERAMICCHIPCAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式会社东电化(中国)投资有限公司

TDK

MULTILAYERCERAMICCHIPCAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式会社东电化(中国)投资有限公司

TDK

MULTILAYERCERAMICCHIPCAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式会社东电化(中国)投资有限公司

TDK

MULTILAYERCERAMICCHIPCAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式会社东电化(中国)投资有限公司

TDK

MULTILAYERCERAMICCHIPCAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式会社东电化(中国)投资有限公司

TDK

MULTILAYERCERAMICCHIPCAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式会社东电化(中国)投资有限公司

TDK

MULTILAYERCERAMICCHIPCAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式会社东电化(中国)投资有限公司

TDK

MultilayerCeramicChipCapacitors

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式会社东电化(中国)投资有限公司

TDK

MultilayerCeramicChipCapacitors

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式会社东电化(中国)投资有限公司

TDK

MultilayerCeramicChipCapacitors

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式会社东电化(中国)投资有限公司

TDK

CeramicCapacitorsForMidVoltageSMD

FEATURES •Theuniquedesignstructureformidvoltageenablesacompactsizewithhighvoltageresistance. •RatedvoltageEdc:100,250and630V. •C3225,C4532andC5750typesarespecifictoreflowsoldering. APPLICATIONS Snappercircuitsforswitchingpowersupply,ringerc

TDKTDK Corporation

TDK株式会社东电化(中国)投资有限公司

TDK

CeramicCapacitorsForMidVoltageSMD

FEATURES •Theuniquedesignstructureformidvoltageenablesacompactsizewithhighvoltageresistance. •RatedvoltageEdc:100,250and630V. •C3225,C4532andC5750typesarespecifictoreflowsoldering. APPLICATIONS Snappercircuitsforswitchingpowersupply,ringerc

TDKTDK Corporation

TDK株式会社东电化(中国)投资有限公司

TDK

CeramicCapacitorsForMidVoltageSMD

FEATURES •Theuniquedesignstructureformidvoltageenablesacompactsizewithhighvoltageresistance. •RatedvoltageEdc:100,250and630V. •C3225,C4532andC5750typesarespecifictoreflowsoldering. APPLICATIONS Snappercircuitsforswitchingpowersupply,ringerc

TDKTDK Corporation

TDK株式会社东电化(中国)投资有限公司

TDK

CeramicCapacitorsForMidVoltageSMD

FEATURES •Theuniquedesignstructureformidvoltageenablesacompactsizewithhighvoltageresistance. •RatedvoltageEdc:100,250and630V. •C3225,C4532andC5750typesarespecifictoreflowsoldering. APPLICATIONS Snappercircuitsforswitchingpowersupply,ringerc

TDKTDK Corporation

TDK株式会社东电化(中国)投资有限公司

TDK

CeramicCapacitorsForMidVoltageSMD

FEATURES •Theuniquedesignstructureformidvoltageenablesacompactsizewithhighvoltageresistance. •RatedvoltageEdc:100,250and630V. •C3225,C4532andC5750typesarespecifictoreflowsoldering. APPLICATIONS Snappercircuitsforswitchingpowersupply,ringerc

TDKTDK Corporation

TDK株式会社东电化(中国)投资有限公司

TDK

CeramicCapacitorsForMidVoltageSMD

FEATURES •Theuniquedesignstructureformidvoltageenablesacompactsizewithhighvoltageresistance. •RatedvoltageEdc:100,250and630V. •C3225,C4532andC5750typesarespecifictoreflowsoldering. APPLICATIONS Snappercircuitsforswitchingpowersupply,ringerc

TDKTDK Corporation

TDK株式会社东电化(中国)投资有限公司

TDK

CeramicCapacitorsForMidVoltageSMD

FEATURES •Theuniquedesignstructureformidvoltageenablesacompactsizewithhighvoltageresistance. •RatedvoltageEdc:100,250and630V. •C3225,C4532andC5750typesarespecifictoreflowsoldering. APPLICATIONS Snappercircuitsforswitchingpowersupply,ringerc

TDKTDK Corporation

TDK株式会社东电化(中国)投资有限公司

TDK

CeramicCapacitorsForMidVoltageSMD

FEATURES •Theuniquedesignstructureformidvoltageenablesacompactsizewithhighvoltageresistance. •RatedvoltageEdc:100,250and630V. •C3225,C4532andC5750typesarespecifictoreflowsoldering. APPLICATIONS Snappercircuitsforswitchingpowersupply,ringerc

TDKTDK Corporation

TDK株式会社东电化(中国)投资有限公司

TDK

CeramicCapacitorsForMidVoltageSMD

FEATURES •Theuniquedesignstructureformidvoltageenablesacompactsizewithhighvoltageresistance. •RatedvoltageEdc:100,250and630V. •C3225,C4532andC5750typesarespecifictoreflowsoldering. APPLICATIONS Snappercircuitsforswitchingpowersupply,ringerc

TDKTDK Corporation

TDK株式会社东电化(中国)投资有限公司

TDK

CommercialGrade(MidVoltage(100to630V))

Features •Voltageratingof100Vto630Vwithcapacitancerangeupto15μF. •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Lowresidualinductanceassuressuperiorfrequencycharacteristics. •Excellent

TDKTDK Corporation

TDK株式会社东电化(中国)投资有限公司

TDK

CommercialGrade(MidVoltage(100to630V))

Features •Voltageratingof100Vto630Vwithcapacitancerangeupto15μF. •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Lowresidualinductanceassuressuperiorfrequencycharacteristics. •Excellent

TDKTDK Corporation

TDK株式会社东电化(中国)投资有限公司

TDK

CeramicCapacitorsForMidVoltageSMD

FEATURES •Theuniquedesignstructureformidvoltageenablesacompactsizewithhighvoltageresistance. •RatedvoltageEdc:100,250and630V. •C3225,C4532andC5750typesarespecifictoreflowsoldering. APPLICATIONS Snappercircuitsforswitchingpowersupply,ringerc

TDKTDK Corporation

TDK株式会社东电化(中国)投资有限公司

TDK

CeramicCapacitorsForMidVoltageSMD

FEATURES •Theuniquedesignstructureformidvoltageenablesacompactsizewithhighvoltageresistance. •RatedvoltageEdc:100,250and630V. •C3225,C4532andC5750typesarespecifictoreflowsoldering. APPLICATIONS Snappercircuitsforswitchingpowersupply,ringerc

TDKTDK Corporation

TDK株式会社东电化(中国)投资有限公司

TDK

CeramicCapacitorsForMidVoltageSMD

FEATURES •Theuniquedesignstructureformidvoltageenablesacompactsizewithhighvoltageresistance. •RatedvoltageEdc:100,250and630V. •C3225,C4532andC5750typesarespecifictoreflowsoldering. APPLICATIONS Snappercircuitsforswitchingpowersupply,ringerc

TDKTDK Corporation

TDK株式会社东电化(中国)投资有限公司

TDK

CeramicCapacitorsForMidVoltageSMD

FEATURES •Theuniquedesignstructureformidvoltageenablesacompactsizewithhighvoltageresistance. •RatedvoltageEdc:100,250and630V. •C3225,C4532andC5750typesarespecifictoreflowsoldering. APPLICATIONS Snappercircuitsforswitchingpowersupply,ringerc

TDKTDK Corporation

TDK株式会社东电化(中国)投资有限公司

TDK

CeramicCapacitorsForMidVoltageSMD

FEATURES •Theuniquedesignstructureformidvoltageenablesacompactsizewithhighvoltageresistance. •RatedvoltageEdc:100,250and630V. •C3225,C4532andC5750typesarespecifictoreflowsoldering. APPLICATIONS Snappercircuitsforswitchingpowersupply,ringerc

TDKTDK Corporation

TDK株式会社东电化(中国)投资有限公司

TDK

CeramicCapacitorsForMidVoltageSMD

FEATURES •Theuniquedesignstructureformidvoltageenablesacompactsizewithhighvoltageresistance. •RatedvoltageEdc:100,250and630V. •C3225,C4532andC5750typesarespecifictoreflowsoldering. APPLICATIONS Snappercircuitsforswitchingpowersupply,ringerc

TDKTDK Corporation

TDK株式会社东电化(中国)投资有限公司

TDK

CeramicCapacitorsForMidVoltageSMD

FEATURES •Theuniquedesignstructureformidvoltageenablesacompactsizewithhighvoltageresistance. •RatedvoltageEdc:100,250and630V. •C3225,C4532andC5750typesarespecifictoreflowsoldering. APPLICATIONS Snappercircuitsforswitchingpowersupply,ringerc

TDKTDK Corporation

TDK株式会社东电化(中国)投资有限公司

TDK

CeramicCapacitorsForMidVoltageSMD

FEATURES •Theuniquedesignstructureformidvoltageenablesacompactsizewithhighvoltageresistance. •RatedvoltageEdc:100,250and630V. •C3225,C4532andC5750typesarespecifictoreflowsoldering. APPLICATIONS Snappercircuitsforswitchingpowersupply,ringerc

TDKTDK Corporation

TDK株式会社东电化(中国)投资有限公司

TDK

CeramicCapacitorsForMidVoltageSMD

FEATURES •Theuniquedesignstructureformidvoltageenablesacompactsizewithhighvoltageresistance. •RatedvoltageEdc:100,250and630V. •C3225,C4532andC5750typesarespecifictoreflowsoldering. APPLICATIONS Snappercircuitsforswitchingpowersupply,ringerc

TDKTDK Corporation

TDK株式会社东电化(中国)投资有限公司

TDK

CommercialGrade(MidVoltage(100to630V))

Features •Voltageratingof100Vto630Vwithcapacitancerangeupto15μF. •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Lowresidualinductanceassuressuperiorfrequencycharacteristics. •Excellent

TDKTDK Corporation

TDK株式会社东电化(中国)投资有限公司

TDK

CommercialGrade(MidVoltage(100to630V))

Features •Voltageratingof100Vto630Vwithcapacitancerangeupto15μF. •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Lowresidualinductanceassuressuperiorfrequencycharacteristics. •Excellent

TDKTDK Corporation

TDK株式会社东电化(中国)投资有限公司

TDK

CeramicCapacitorsForMidVoltageSMD

FEATURES •Theuniquedesignstructureformidvoltageenablesacompactsizewithhighvoltageresistance. •RatedvoltageEdc:100,250and630V. •C3225,C4532andC5750typesarespecifictoreflowsoldering. APPLICATIONS Snappercircuitsforswitchingpowersupply,ringerc

TDKTDK Corporation

TDK株式会社东电化(中国)投资有限公司

TDK

CeramicCapacitorsForMidVoltageSMD

FEATURES •Theuniquedesignstructureformidvoltageenablesacompactsizewithhighvoltageresistance. •RatedvoltageEdc:100,250and630V. •C3225,C4532andC5750typesarespecifictoreflowsoldering. APPLICATIONS Snappercircuitsforswitchingpowersupply,ringerc

TDKTDK Corporation

TDK株式会社东电化(中国)投资有限公司

TDK

CeramicCapacitorsForMidVoltageSMD

FEATURES •Theuniquedesignstructureformidvoltageenablesacompactsizewithhighvoltageresistance. •RatedvoltageEdc:100,250and630V. •C3225,C4532andC5750typesarespecifictoreflowsoldering. APPLICATIONS Snappercircuitsforswitchingpowersupply,ringerc

TDKTDK Corporation

TDK株式会社东电化(中国)投资有限公司

TDK

C453产品属性

  • 类型

    描述

  • 型号

    C453

  • 制造商

    VECTRON

  • 制造商全称

    Vectron International, Inc

  • 功能描述

    OCXO Surface Mount Package Reflow Process Compatible AT-Cut and SC-Cut Crystal Options Low Profile Compact Package

更新时间:2025-5-16 23:00:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
TDK
24+
1812
7350
现货供应,当天可交货!免费送样,原厂技术支持!!!
TDK
24+
1812
1000
优势代理渠道,原装正品,可全系列订货开增值税票
TDK
2025+
SMD
16854648
代理销售TDK原装现货
TDK
24+
N/A
5650
公司原厂原装现货假一罚十!特价出售!强势库存!
TDK
23+
SMD
55000
1812 C0G 250V 47NF 5%
TDK/东电化
23+
SMD
10000
原厂授权一级代理,专业海外优势订货,价格优势、品种
TDK
17+
SMD
100000
原装正品现货
TDK
9856
1812
1812
只做进口原装现货!假一赔十!
TDK
24+
SMD
320000
TDK
22+
SMD
54000
原装现货样品可售

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