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C453价格
参考价格：￥281.3029
型号：C453 品牌：Coilcraft 备注：这里有C453多少钱，2025年最近7天走势，今日出价，今日竞价，C453批发/采购报价，C453行情走势销售排行榜，C453报价。| 型号 | 功能描述 | 生产厂家 企业 | LOGO | 操作 |
|---|---|---|---|---|
OCXO Surface Mount Package Reflow Process Compatible AT-Cut and SC-Cut Crystal Options Low Profile Compact Package Frequency range 10 MHz – 160 MHz Standard frequencies 10; 12.8; 16.384; 19.2 ; 20; 30.72; 32.768MHz Features Surface Mount Package Reflow Process Compatible AT-Cut and SC-Cut Crystal Options Low Profile Compact Package OCO1000, C4500 Typical Applications Base Station | Vectron |   | ||
Multilayer Ceramic Chip Capacitors General use Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS C Series General (Up to 50V) Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency | TDK 东电化 | | ||
Multilayer Ceramic Chip Capacitors General use Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de | TDK 东电化 | | ||
Multilayer Ceramic Chip Capacitors General use Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS C Series General (Up to 50V) Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Commercial grade, general (Up to 75V) ■SERIES OVERVIEW General type C series is a surface-mounted component, which multilayer dielectrics and inner electrodes are stacked alternately. The monolithic structure ensures superior mechanical strength and high reliability. Also, outstanding frequency characteristics such as low ESR and lo | TDK 东电化 | | ||
Multilayer Ceramic Chip Capacitors Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
Multilayer Ceramic Chip Capacitors Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
Multilayer Ceramic Chip Capacitors Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
Multilayer Ceramic Chip Capacitors Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
Multilayer Ceramic Chip Capacitors Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
Multilayer Ceramic Chip Capacitors Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
Multilayer Ceramic Chip Capacitors Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
Multilayer Ceramic Chip Capacitors Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
Multilayer Ceramic Chip Capacitors Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
Ceramic Capacitors For Mid Voltage SMD FEATURES • The unique design structure for mid voltage enables a compact size with high voltage resistance. • Rated voltage Edc: 100, 250 and 630V. • C3225, C4532 and C5750 types are specific to reflow soldering. APPLICATIONS Snapper circuits for switching power supply, ringer c | TDK 东电化 | | ||
Ceramic Capacitors For Mid Voltage SMD FEATURES • The unique design structure for mid voltage enables a compact size with high voltage resistance. • Rated voltage Edc: 100, 250 and 630V. • C3225, C4532 and C5750 types are specific to reflow soldering. APPLICATIONS Snapper circuits for switching power supply, ringer c | TDK 东电化 | | ||
Ceramic Capacitors For Mid Voltage SMD FEATURES • The unique design structure for mid voltage enables a compact size with high voltage resistance. • Rated voltage Edc: 100, 250 and 630V. • C3225, C4532 and C5750 types are specific to reflow soldering. APPLICATIONS Snapper circuits for switching power supply, ringer c | TDK 东电化 | | ||
Ceramic Capacitors For Mid Voltage SMD FEATURES • The unique design structure for mid voltage enables a compact size with high voltage resistance. • Rated voltage Edc: 100, 250 and 630V. • C3225, C4532 and C5750 types are specific to reflow soldering. APPLICATIONS Snapper circuits for switching power supply, ringer c | TDK 东电化 | | ||
Ceramic Capacitors For Mid Voltage SMD FEATURES • The unique design structure for mid voltage enables a compact size with high voltage resistance. • Rated voltage Edc: 100, 250 and 630V. • C3225, C4532 and C5750 types are specific to reflow soldering. APPLICATIONS Snapper circuits for switching power supply, ringer c | TDK 东电化 | | ||
Ceramic Capacitors For Mid Voltage SMD FEATURES • The unique design structure for mid voltage enables a compact size with high voltage resistance. • Rated voltage Edc: 100, 250 and 630V. • C3225, C4532 and C5750 types are specific to reflow soldering. APPLICATIONS Snapper circuits for switching power supply, ringer c | TDK 东电化 | | ||
Ceramic Capacitors For Mid Voltage SMD FEATURES • The unique design structure for mid voltage enables a compact size with high voltage resistance. • Rated voltage Edc: 100, 250 and 630V. • C3225, C4532 and C5750 types are specific to reflow soldering. APPLICATIONS Snapper circuits for switching power supply, ringer c | TDK 东电化 | | ||
Ceramic Capacitors For Mid Voltage SMD FEATURES • The unique design structure for mid voltage enables a compact size with high voltage resistance. • Rated voltage Edc: 100, 250 and 630V. • C3225, C4532 and C5750 types are specific to reflow soldering. APPLICATIONS Snapper circuits for switching power supply, ringer c | TDK 东电化 | | ||
Ceramic Capacitors For Mid Voltage SMD FEATURES • The unique design structure for mid voltage enables a compact size with high voltage resistance. • Rated voltage Edc: 100, 250 and 630V. • C3225, C4532 and C5750 types are specific to reflow soldering. APPLICATIONS Snapper circuits for switching power supply, ringer c | TDK 东电化 | | ||
Commercial Grade ( Mid Voltage (100 to 630V) ) Features • Voltage rating of 100V to 630V with capacitance range up to 15μF. • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • Low residual inductance assures superior frequency characteristics. • Excellent | TDK 东电化 | | ||
Commercial Grade ( Mid Voltage (100 to 630V) ) Features • Voltage rating of 100V to 630V with capacitance range up to 15μF. • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • Low residual inductance assures superior frequency characteristics. • Excellent | TDK 东电化 | | ||
Ceramic Capacitors For Mid Voltage SMD FEATURES • The unique design structure for mid voltage enables a compact size with high voltage resistance. • Rated voltage Edc: 100, 250 and 630V. • C3225, C4532 and C5750 types are specific to reflow soldering. APPLICATIONS Snapper circuits for switching power supply, ringer c | TDK 东电化 | | ||
Ceramic Capacitors For Mid Voltage SMD FEATURES • The unique design structure for mid voltage enables a compact size with high voltage resistance. • Rated voltage Edc: 100, 250 and 630V. • C3225, C4532 and C5750 types are specific to reflow soldering. APPLICATIONS Snapper circuits for switching power supply, ringer c | TDK 东电化 | | ||
Ceramic Capacitors For Mid Voltage SMD FEATURES • The unique design structure for mid voltage enables a compact size with high voltage resistance. • Rated voltage Edc: 100, 250 and 630V. • C3225, C4532 and C5750 types are specific to reflow soldering. APPLICATIONS Snapper circuits for switching power supply, ringer c | TDK 东电化 | | ||
Ceramic Capacitors For Mid Voltage SMD FEATURES • The unique design structure for mid voltage enables a compact size with high voltage resistance. • Rated voltage Edc: 100, 250 and 630V. • C3225, C4532 and C5750 types are specific to reflow soldering. APPLICATIONS Snapper circuits for switching power supply, ringer c | TDK 东电化 | | ||
Ceramic Capacitors For Mid Voltage SMD FEATURES • The unique design structure for mid voltage enables a compact size with high voltage resistance. • Rated voltage Edc: 100, 250 and 630V. • C3225, C4532 and C5750 types are specific to reflow soldering. APPLICATIONS Snapper circuits for switching power supply, ringer c | TDK 东电化 | | ||
Ceramic Capacitors For Mid Voltage SMD FEATURES • The unique design structure for mid voltage enables a compact size with high voltage resistance. • Rated voltage Edc: 100, 250 and 630V. • C3225, C4532 and C5750 types are specific to reflow soldering. APPLICATIONS Snapper circuits for switching power supply, ringer c | TDK 东电化 | | ||
Ceramic Capacitors For Mid Voltage SMD FEATURES • The unique design structure for mid voltage enables a compact size with high voltage resistance. • Rated voltage Edc: 100, 250 and 630V. • C3225, C4532 and C5750 types are specific to reflow soldering. APPLICATIONS Snapper circuits for switching power supply, ringer c | TDK 东电化 | | ||
Ceramic Capacitors For Mid Voltage SMD FEATURES • The unique design structure for mid voltage enables a compact size with high voltage resistance. • Rated voltage Edc: 100, 250 and 630V. • C3225, C4532 and C5750 types are specific to reflow soldering. APPLICATIONS Snapper circuits for switching power supply, ringer c | TDK 东电化 | | ||
Ceramic Capacitors For Mid Voltage SMD FEATURES • The unique design structure for mid voltage enables a compact size with high voltage resistance. • Rated voltage Edc: 100, 250 and 630V. • C3225, C4532 and C5750 types are specific to reflow soldering. APPLICATIONS Snapper circuits for switching power supply, ringer c | TDK 东电化 | | ||
Commercial Grade ( Mid Voltage (100 to 630V) ) Features • Voltage rating of 100V to 630V with capacitance range up to 15μF. • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • Low residual inductance assures superior frequency characteristics. • Excellent | TDK 东电化 | | ||
Commercial Grade ( Mid Voltage (100 to 630V) ) Features • Voltage rating of 100V to 630V with capacitance range up to 15μF. • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • Low residual inductance assures superior frequency characteristics. • Excellent | TDK 东电化 | | ||
Ceramic Capacitors For Mid Voltage SMD FEATURES • The unique design structure for mid voltage enables a compact size with high voltage resistance. • Rated voltage Edc: 100, 250 and 630V. • C3225, C4532 and C5750 types are specific to reflow soldering. APPLICATIONS Snapper circuits for switching power supply, ringer c | TDK 东电化 | | ||
Ceramic Capacitors For Mid Voltage SMD FEATURES • The unique design structure for mid voltage enables a compact size with high voltage resistance. • Rated voltage Edc: 100, 250 and 630V. • C3225, C4532 and C5750 types are specific to reflow soldering. APPLICATIONS Snapper circuits for switching power supply, ringer c | TDK 东电化 | | ||
Ceramic Capacitors For Mid Voltage SMD FEATURES • The unique design structure for mid voltage enables a compact size with high voltage resistance. • Rated voltage Edc: 100, 250 and 630V. • C3225, C4532 and C5750 types are specific to reflow soldering. APPLICATIONS Snapper circuits for switching power supply, ringer c | TDK 东电化 | |
C453产品属性
- 类型
描述
- 型号
C453
- 制造商
VECTRON
- 制造商全称
Vectron International, Inc
- 功能描述
OCXO Surface Mount Package Reflow Process Compatible AT-Cut and SC-Cut Crystal Options Low Profile Compact Package
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
TDK |
23+ |
[ 1812] |
7000 |
||||
TDK |
24+ |
SMD |
320000 |
||||
TDK |
24+ |
N/A |
5650 |
公司原厂原装现货假一罚十!特价出售!强势库存! |
|||
TDK |
22+ |
标准包装 |
100000 |
原装正品,可送样品测试,可含税交易 |
|||
TDK |
2019+ |
SMD |
120000 |
原盒原包装 可BOM配套 |
|||
TDK/东电化 |
23+ |
SMD |
10000 |
原厂授权一级代理,专业海外优势订货,价格优势、品种 |
|||
24+ |
N/A |
54000 |
一级代理-主营优势-实惠价格-不悔选择 |
||||
TDK |
23+ |
SMD |
55000 |
1812 C0G 250V 47NF 5% |
|||
TDK/东电化 |
23+ |
1812 |
50000 |
全新原装正品现货,支持订货 |
|||
TDK |
24+ |
con |
35960 |
查现货到京北通宇商城 |
C453规格书下载地址
C453参数引脚图相关
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- C4532
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- C45-2DC-84
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- C4520X7R3D471M130KA
- C4520X7R3D471K130KA
- C4520X7R3D102M130KE
- C4520X7R3D102M130KA
- C4520X7R3D102K130KE
- C4520X7R3D102K130KA
- C4520
- C451T2
- C451T1
- C451S2
- C451S1
- C451PS2
- C451PS1
- C451PN2
- C451PN1
- C451PN
- C451PM2
- C451PM1
- C451PM
- C451PE2
- C451PE1
- C451PD2
- C451PD1
- C451PD
- C451PC2
- C451PC1
C453数据表相关新闻
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2024-4-8C4532X7R1H475KT000N原装贴片电容TDK18138231376
产品等级： 优级品 封装： SMD 耐压值： 50（V） 批号： 17+ 外形： 方块状 应用范围： 通用 允许偏差： ±10（%
2019-10-17C3D10060A
C3D10060A ，全新原装当天发货或门市自取0755-82732291.
2019-9-6C4532X7R3D222KT000N深圳市光华微科技有限公司18138231376
TDK车规全系列欢迎来电全系列
2019-6-22C4532X5R1A476M280KA电容中文资料规格书深圳市凌丰发微电子有限公司
C4532X5R1A476M280KA TDK 电容
2019-3-7
DdatasheetPDF页码索引
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