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C452价格
参考价格：￥1.9829
型号：C4520C0G3F100F 品牌：TDK Corporation 备注：这里有C452多少钱，2025年最近7天走势，今日出价，今日竞价，C452批发/采购报价，C452行情走势销售排行榜，C452报价。| 型号 | 功能描述 | 生产厂家 企业 | LOGO | 操作 |
|---|---|---|---|---|
C452 | 通用胶水/胶棒 | 3M |   | |
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de | TDK 东电化 | | ||
ISL6844 Reference Design: ISL6844EVAL3Z The ISL6840, ISL6841, ISL6842, ISL6843, ISL6844, ISL6845 family of adjustable frequency, low power, pulse width modulating (PWM) current mode controllers is designed for a wide range of power conversion applications including boost, flyback, and isolated output configurations. Peak current mode co | Intersil | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de | TDK 东电化 | | ||
C Series High Voltage Application 文件：2.37923 Mbytes Page：12 Pages | TDK 东电化 | | ||
C Series High Voltage Application 文件：2.37923 Mbytes Page：12 Pages | TDK 东电化 | | ||
封装/外壳：1808（4520 公制） 包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 描述：CAP CER 10PF 3KV C0G 1808 电容器 陶瓷电容器 | TDK 东电化 | | ||
C Series Commercial Grade High Voltage (1000V and over) 文件：1.19794 Mbytes Page：7 Pages | TDK 东电化 | | ||
Commercial Grade ( High Voltage (1000V and over) ) 文件：130.78 Kbytes Page：1 Pages | TDK 东电化 | | ||
C Series High Voltage Application 文件：2.37923 Mbytes Page：12 Pages | TDK 东电化 | | ||
C Series Commercial Grade High Voltage (1000V and over) 文件：1.19794 Mbytes Page：7 Pages | TDK 东电化 | | ||
积层贴片陶瓷片式电容器 | TDK 东电化 | |
C452产品属性
- 类型
描述
- 型号
C452
- 功能描述
电感器套件及配件 Power Inductor Kit 0.15-2.2 uH Values
- RoHS
否
- 制造商
Bourns
- 产品
SMD Inductor Kits
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
TDK/东电化 |
24+ |
SMD |
42461 |
TDK原厂直供,全系列可订货。美金交易,大陆交货。 |
|||
TDK/东电化 |
24+ |
NA/ |
4054 |
原装现货,当天可交货,原型号开票 |
|||
TDK |
2016+ |
SMD |
17000 |
只做原装,假一罚十,公司可开17%增值税发票! |
|||
TDK |
25+ |
SMD |
904 |
原装正品,假一罚十! |
|||
MITSUBI |
24+ |
409 |
现货供应 |
||||
TDK |
20+ |
SMD |
362200 |
TDK原装优势主营型号-可开原型号增税票 |
|||
TDK |
原厂封装 |
9800 |
原装进口公司现货假一赔百 |
||||
TDK |
23+ |
原封 原厂 |
90000 |
TDK元件 现货电子元件更多数量咨询 |
|||
KEC |
24+ |
TO220F |
8540 |
只做原装正品现货或订货假一赔十! |
|||
TDK |
24+ |
SMD |
90000 |
进口原装现货假一罚十价格合理 |
C452芯片相关品牌
C452规格书下载地址
C452参数引脚图相关
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C452数据表相关新闻
C3M0160120D封装TO-247-3场效应管N沟道MOSFET管mos管原装现货
C3M0160120D封装TO-247-3场效应管N沟道MOSFET管mos管原装现货
2025-2-28C44UVGT5900T81K电容器
KEMET 的电容器在恶劣环境下具有 300,000 小时的使用寿命
2024-4-8C4532X7R1H475KT000N原装贴片电容TDK18138231376
产品等级： 优级品 封装： SMD 耐压值： 50（V） 批号： 17+ 外形： 方块状 应用范围： 通用 允许偏差： ±10（%
2019-10-17C3D10060A
C3D10060A ，全新原装当天发货或门市自取0755-82732291.
2019-9-6C4532X7R3D222KT000N深圳市光华微科技有限公司18138231376
TDK车规全系列欢迎来电全系列
2019-6-22C4532X5R1A476M280KA电容中文资料规格书深圳市凌丰发微电子有限公司
C4532X5R1A476M280KA TDK 电容
2019-3-7
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