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C322价格
参考价格：￥343.8146
型号：C322 品牌：Coilcraft 备注：这里有C322多少钱，2025年最近7天走势，今日出价，今日竞价，C322批发/采购报价，C322行情走势销售排行榜，C322报价。| 型号 | 功能描述 | 生产厂家 企业 | LOGO | 操作 |
|---|---|---|---|---|
C322 | MILITARY SPECIFCATIONS ON BACK 文件：580.55 Kbytes Page：40 Pages | KEMETKEMET Corporation 基美 |   | |
C322 | Aluminum Electrolytic Capacitors 文件：5.29445 Mbytes Page：66 Pages | KEMETKEMET Corporation 基美 | | |
C322 | MULTILAYER CERAMIC CAPACITORS/AXIAL & RADIAL LEADED 文件：971.77 Kbytes Page：16 Pages | KEMETKEMET Corporation 基美 | | |
C322 | MAGNETICS FOR RF, POWER,FILTER AND DATA APPLICATIONS 文件：8.35916 Mbytes Page：60 Pages | COILCRAFT | | |
C322 | High Voltage Goldmax, 300 Series, Conformally Coated, X7R Dielectric, 500 – 3,000 VDC (Commercial Grade) | KEMETKEMET Corporation 基美 | | |
MULTILAYER CERAMIC CHIP CAPACITORS Commercial grade, general (Up to 75V) ■SERIES OVERVIEW General type C series is a surface-mounted component, which multilayer dielectrics and inner electrodes are stacked alternately. The monolithic structure ensures superior mechanical strength and high reliability. Also, outstanding frequency characteristics such as low ESR and lo | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
Multilayer Ceramic Chip Capacitors General use Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
Multilayer Ceramic Chip Capacitors General use Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de | TDK 东电化 | | ||
Multilayer Ceramic Chip Capacitors General use Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS C Series General (Up to 50V) Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS C Series General (Up to 50V) Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency | TDK 东电化 | | ||
Multilayer Ceramic Chip Capacitors Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
Multilayer Ceramic Chip Capacitors Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
Multilayer Ceramic Chip Capacitors Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
Multilayer Ceramic Chip Capacitors Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
Multilayer Ceramic Chip Capacitors Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
Multilayer Ceramic Chip Capacitors Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
Multilayer Ceramic Chip Capacitors Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
Multilayer Ceramic Chip Capacitors Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
Multilayer Ceramic Chip Capacitors Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
Ceramic Capacitors For Mid Voltage SMD FEATURES • The unique design structure for mid voltage enables a compact size with high voltage resistance. • Rated voltage Edc: 100, 250 and 630V. • C3225, C4532 and C5750 types are specific to reflow soldering. APPLICATIONS Snapper circuits for switching power supply, ringer c | TDK 东电化 | | ||
Ceramic Capacitors For Mid Voltage SMD FEATURES • The unique design structure for mid voltage enables a compact size with high voltage resistance. • Rated voltage Edc: 100, 250 and 630V. • C3225, C4532 and C5750 types are specific to reflow soldering. APPLICATIONS Snapper circuits for switching power supply, ringer c | TDK 东电化 | | ||
Ceramic Capacitors For Mid Voltage SMD FEATURES • The unique design structure for mid voltage enables a compact size with high voltage resistance. • Rated voltage Edc: 100, 250 and 630V. • C3225, C4532 and C5750 types are specific to reflow soldering. APPLICATIONS Snapper circuits for switching power supply, ringer c | TDK 东电化 | | ||
Ceramic Capacitors For Mid Voltage SMD FEATURES • The unique design structure for mid voltage enables a compact size with high voltage resistance. • Rated voltage Edc: 100, 250 and 630V. • C3225, C4532 and C5750 types are specific to reflow soldering. APPLICATIONS Snapper circuits for switching power supply, ringer c | TDK 东电化 | | ||
Ceramic Capacitors For Mid Voltage SMD FEATURES • The unique design structure for mid voltage enables a compact size with high voltage resistance. • Rated voltage Edc: 100, 250 and 630V. • C3225, C4532 and C5750 types are specific to reflow soldering. APPLICATIONS Snapper circuits for switching power supply, ringer c | TDK 东电化 | | ||
Ceramic Capacitors For Mid Voltage SMD FEATURES • The unique design structure for mid voltage enables a compact size with high voltage resistance. • Rated voltage Edc: 100, 250 and 630V. • C3225, C4532 and C5750 types are specific to reflow soldering. APPLICATIONS Snapper circuits for switching power supply, ringer c | TDK 东电化 | | ||
Ceramic Capacitors For Mid Voltage SMD FEATURES • The unique design structure for mid voltage enables a compact size with high voltage resistance. • Rated voltage Edc: 100, 250 and 630V. • C3225, C4532 and C5750 types are specific to reflow soldering. APPLICATIONS Snapper circuits for switching power supply, ringer c | TDK 东电化 | | ||
Ceramic Capacitors For Mid Voltage SMD FEATURES • The unique design structure for mid voltage enables a compact size with high voltage resistance. • Rated voltage Edc: 100, 250 and 630V. • C3225, C4532 and C5750 types are specific to reflow soldering. APPLICATIONS Snapper circuits for switching power supply, ringer c | TDK 东电化 | | ||
Ceramic Capacitors For Mid Voltage SMD FEATURES • The unique design structure for mid voltage enables a compact size with high voltage resistance. • Rated voltage Edc: 100, 250 and 630V. • C3225, C4532 and C5750 types are specific to reflow soldering. APPLICATIONS Snapper circuits for switching power supply, ringer c | TDK 东电化 | | ||
Multilayer Ceramic Chip Capacitors Features • Voltage rating of 100V to 630V with capacitance range up to 15μF. • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • Low residual inductance assures superior frequency characteristics. • Excellent | TDK 东电化 | | ||
Multilayer Ceramic Chip Capacitors Features • Voltage rating of 100V to 630V with capacitance range up to 15μF. • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • Low residual inductance assures superior frequency characteristics. • Excellent | TDK 东电化 | | ||
Multilayer Ceramic Chip Capacitors Features • Voltage rating of 100V to 630V with capacitance range up to 15μF. • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • Low residual inductance assures superior frequency characteristics. • Excellent | TDK 东电化 | | ||
Ceramic Capacitors For Mid Voltage SMD FEATURES • The unique design structure for mid voltage enables a compact size with high voltage resistance. • Rated voltage Edc: 100, 250 and 630V. • C3225, C4532 and C5750 types are specific to reflow soldering. APPLICATIONS Snapper circuits for switching power supply, ringer c | TDK 东电化 | | ||
Multilayer Ceramic Chip Capacitors Features • Voltage rating of 100V to 630V with capacitance range up to 15μF. • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • Low residual inductance assures superior frequency characteristics. • Excellent | TDK 东电化 | | ||
Ceramic Capacitors For Mid Voltage SMD FEATURES • The unique design structure for mid voltage enables a compact size with high voltage resistance. • Rated voltage Edc: 100, 250 and 630V. • C3225, C4532 and C5750 types are specific to reflow soldering. APPLICATIONS Snapper circuits for switching power supply, ringer c | TDK 东电化 | | ||
Ceramic Capacitors For Mid Voltage SMD FEATURES • The unique design structure for mid voltage enables a compact size with high voltage resistance. • Rated voltage Edc: 100, 250 and 630V. • C3225, C4532 and C5750 types are specific to reflow soldering. APPLICATIONS Snapper circuits for switching power supply, ringer c | TDK 东电化 | | ||
Ceramic Capacitors For Mid Voltage SMD FEATURES • The unique design structure for mid voltage enables a compact size with high voltage resistance. • Rated voltage Edc: 100, 250 and 630V. • C3225, C4532 and C5750 types are specific to reflow soldering. APPLICATIONS Snapper circuits for switching power supply, ringer c | TDK 东电化 | | ||
Multilayer Ceramic Chip Capacitors Features • Voltage rating of 100V to 630V with capacitance range up to 15μF. • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • Low residual inductance assures superior frequency characteristics. • Excellent | TDK 东电化 | | ||
Ceramic Capacitors For Mid Voltage SMD FEATURES • The unique design structure for mid voltage enables a compact size with high voltage resistance. • Rated voltage Edc: 100, 250 and 630V. • C3225, C4532 and C5750 types are specific to reflow soldering. APPLICATIONS Snapper circuits for switching power supply, ringer c | TDK 东电化 | | ||
Ceramic Capacitors For Mid Voltage SMD FEATURES • The unique design structure for mid voltage enables a compact size with high voltage resistance. • Rated voltage Edc: 100, 250 and 630V. • C3225, C4532 and C5750 types are specific to reflow soldering. APPLICATIONS Snapper circuits for switching power supply, ringer c | TDK 东电化 | | ||
Ceramic Capacitors For Mid Voltage SMD FEATURES • The unique design structure for mid voltage enables a compact size with high voltage resistance. • Rated voltage Edc: 100, 250 and 630V. • C3225, C4532 and C5750 types are specific to reflow soldering. APPLICATIONS Snapper circuits for switching power supply, ringer c | TDK 东电化 | |
C322产品属性
- 类型
描述
- 型号
C322
- 功能描述
电感器套件及配件 RF Chip Inductr Kit 3.3-560 nH Values
- RoHS
否
- 制造商
Bourns
- 产品
SMD Inductor Kits
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
TDK/东电化 |
24+ |
1210 |
60289 |
TDK原厂直供,全系列可订货。美金交易,大陆交货。 |
|||
TDK |
24+ |
SMD1210 |
244000 |
专营被动元器件原装现货 |
|||
TDK(东电化) |
26+ |
SMD |
360000 |
原厂原装,可配单 |
|||
TDK/东电化 |
25+ |
SMD |
32360 |
TDK/东电化全新特价C3225X7S1H106MT即刻询购立享优惠#长期有货 |
|||
TDK |
22+ |
SMD |
6000 |
原装正品可支持验货,欢迎咨询 |
|||
TDK |
25+ |
SMD |
518000 |
明嘉莱只做原装正品现货 |
|||
TDK |
23+ |
SMD |
6850 |
只做原装正品假一赔十为客户做到零风险!! |
|||
TDK |
21+ |
3225 |
1469 |
十年信誉,只做原装,有挂就有现货! |
|||
TDK/东电化 |
SMD |
23+ |
6000 |
专业配单原装正品假一罚十 |
|||
TDK |
23+ |
SMD |
55000 |
1210 X7T 450V 220NF 10% |
C322规格书下载地址
C322参数引脚图相关
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- C3225C0G2A683J230AA
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- C3225C0G2A333J200AA
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- C3225C0G2A223J160AA
- C3225C0G2A153K125AA
- C3225C0G2A153J125AA
- C3225C0G1H683K200AA
- C3225C0G1H683J200AA
- C3225C0G1H473K200AA
- C3225C0G1H473J200AA
- C3225C0G1H333K160AA
- C3225C0G1H333J160AA
- C3225C0G1H223K125AA
- C3225C0G1H223J125AA
- C3225C0G1H104K250AA
- C3225C0G1H104J250AA
- C3225C0G1H104J
- C3225
- C321MP9
- C321MP8
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- C321MP5
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- C321MP3
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- C-321G
- C321C474K5R5TA
- C321C473K5R5TA
- C321C224K1R5TA
- C321C104M5U5TA
- C321C104M5U5CA
- C321C104M5R5TA
- C321C104K5R5TA
- C321C104K5R5HA
- C321C104K1R5CA
- C321C103M5U5TA
- C321C103M1R5TA
- C321C103K2R5TA
- C321C103K1R5TA
- C321C101JCG5TA
- C3218
- C3217
- C3216Y5V1H225Z/0.85
- C3216Y5V1E475Z/1.15
- C3216Y5V1C475ZT/1.15
- C3216Y5V1A106ZT/1.15
- C3216X8R2A683M115AA
- C3216X8R2A683K115AA
- C3216
- C3215
- C3214
- C3210
- C320PC7
- C320PC6
- C320PC5
- C320PC4
C322数据表相关新闻
C3M0160120D封装TO-247-3场效应管N沟道MOSFET管mos管原装现货
C3M0160120D封装TO-247-3场效应管N沟道MOSFET管mos管原装现货
2025-2-28C3216X7T2E224M160AA原现价美
C3216X7T2E224M160AA原现价美
2024-7-24C3225X7S1H106K250AB
进口代理
2023-3-18C3216C0G1H104J080AA产品资料 集成电路接口芯片
C3216C0G1H104J080AA产品资料 品牌：TDK 原装正品现货
2020-6-13C3216X7R1H475KT000N电容4.7UF120650VX7R材质18138231376
联系人：刘冬英 电话：0755-83203002 手机：18138231376、18806643356 QQ号：1546282226、微信号：18138231376 公司名称：深圳市光华微科技有限公司 Shenzhen Guanghua Micro Technology Co.， Ltd 公司地址：深圳市福田区振兴路华匀大厦1栋712室
2019-9-21C3D10060A
C3D10060A ，全新原装当天发货或门市自取0755-82732291.
2019-9-6
DdatasheetPDF页码索引
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