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C163价格
参考价格:¥0.6476
型号:C1632C100K5GACTU 品牌:Kemet 备注:这里有C163多少钱,2025年最近7天走势,今日出价,今日竞价,C163批发/采购报价,C163行情走势销售排行榜,C163报价。型号 | 功能描述 | 生产厂家 企业 | LOGO | 操作 |
---|---|---|---|---|
C163 | 16-Bit CMOS Single-Chip Microcontrollers 文件:3.71663 Mbytes Page:283 Pages | SIEMENS 西门子 | ||
Part Number Change Notification C Series General (Up to 50V) Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency | TDK 东电化 | |||
Part Number Change Notification C Series General (Up to 50V) Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency | TDK 东电化 | |||
Part Number Change Notification C Series General (Up to 50V) Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency | TDK 东电化 | |||
Part Number Change Notification C Series General (Up to 50V) Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency | TDK 东电化 | |||
Part Number Change Notification C Series General (Up to 50V) Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency | TDK 东电化 | |||
Part Number Change Notification C Series General (Up to 50V) Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency | TDK 东电化 | |||
Part Number Change Notification C Series General (Up to 50V) Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency | TDK 东电化 | |||
Part Number Change Notification C Series General (Up to 50V) Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency | TDK 东电化 | |||
Part Number Change Notification C Series General (Up to 50V) Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency | TDK 东电化 | |||
Part Number Change Notification C Series General (Up to 50V) Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency | TDK 东电化 | |||
Part Number Change Notification C Series General (Up to 50V) Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency | TDK 东电化 | |||
Part Number Change Notification C Series General (Up to 50V) Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency | TDK 东电化 | |||
Part Number Change Notification C Series General (Up to 50V) Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency | TDK 东电化 | |||
Part Number Change Notification C Series General (Up to 50V) Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency | TDK 东电化 | |||
Part Number Change Notification C Series General (Up to 50V) Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency | TDK 东电化 | |||
Part Number Change Notification C Series General (Up to 50V) Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency | TDK 东电化 | |||
16-bit CMOS Single-Chip Microcontroller Introduction The C163-L is a derivative of the Siemens C166 family of 16-bit single-chip CMOS microcontrollers. It combines high CPU performance (up to 12.5 million instructions per second) with high peripheral functionality and enhanced IO-capabilities. C166-Family of High-Performance CMOS 16-B | SIEMENS 西门子 | |||
Gabriella Assembly 文件:1.2827 Mbytes Page:12 Pages | LEDIL | |||
Asymmetric beam for wall-washing 文件:3.72379 Mbytes Page:5 Pages | LEDIL | |||
CERAMIC CAPACITOR ARRAY 文件:937.23 Kbytes Page:7 Pages | KEMETKEMET Corporation 基美 | |||
CERAMIC CAPACITOR ARRAY 文件:937.23 Kbytes Page:7 Pages | KEMETKEMET Corporation 基美 | |||
网络阵列电容 | KEMETKEMET Corporation 基美 | |||
网络阵列电容 | KEMETKEMET Corporation 基美 | |||
CERAMIC CHIP CAPACITORS 文件:2.10586 Mbytes Page:30 Pages | KEMETKEMET Corporation 基美 | |||
CERAMIC CAPACITOR ARRAY 文件:937.23 Kbytes Page:7 Pages | KEMETKEMET Corporation 基美 | |||
网络阵列电容 | KEMETKEMET Corporation 基美 | |||
Four individual capacitors inside one 1206 monolithic structure 文件:938.18 Kbytes Page:7 Pages | KEMETKEMET Corporation 基美 | |||
CERAMIC CHIP CAPACITORS 文件:2.10586 Mbytes Page:30 Pages | KEMETKEMET Corporation 基美 | |||
CERAMIC CAPACITOR ARRAY 文件:937.23 Kbytes Page:7 Pages | KEMETKEMET Corporation 基美 | |||
Four individual capacitors inside one 1206 monolithic structure 文件:938.18 Kbytes Page:7 Pages | KEMETKEMET Corporation 基美 | |||
Four individual capacitors inside one 1206 monolithic structure 文件:938.18 Kbytes Page:7 Pages | KEMETKEMET Corporation 基美 | |||
Four individual capacitors inside one 1206 monolithic structure 文件:938.18 Kbytes Page:7 Pages | KEMETKEMET Corporation 基美 | |||
Four individual capacitors inside one 1206 monolithic structure 文件:938.18 Kbytes Page:7 Pages | KEMETKEMET Corporation 基美 | |||
Four individual capacitors inside one 1206 monolithic structure 文件:938.18 Kbytes Page:7 Pages | KEMETKEMET Corporation 基美 | |||
Four individual capacitors inside one 1206 monolithic structure 文件:938.18 Kbytes Page:7 Pages | KEMETKEMET Corporation 基美 | |||
Four individual capacitors inside one 1206 monolithic structure 文件:938.18 Kbytes Page:7 Pages | KEMETKEMET Corporation 基美 | |||
Four individual capacitors inside one 1206 monolithic structure 文件:938.18 Kbytes Page:7 Pages | KEMETKEMET Corporation 基美 | |||
Four individual capacitors inside one 1206 monolithic structure 文件:938.18 Kbytes Page:7 Pages | KEMETKEMET Corporation 基美 | |||
Four individual capacitors inside one 1206 monolithic structure 文件:938.18 Kbytes Page:7 Pages | KEMETKEMET Corporation 基美 | |||
Four individual capacitors inside one 1206 monolithic structure 文件:938.18 Kbytes Page:7 Pages | KEMETKEMET Corporation 基美 | |||
Four individual capacitors inside one 1206 monolithic structure 文件:938.18 Kbytes Page:7 Pages | KEMETKEMET Corporation 基美 | |||
Four individual capacitors inside one 1206 monolithic structure 文件:938.18 Kbytes Page:7 Pages | KEMETKEMET Corporation 基美 | |||
Four individual capacitors inside one 1206 monolithic structure 文件:938.18 Kbytes Page:7 Pages | KEMETKEMET Corporation 基美 | |||
封装/外壳:1206(3216 公制) 包装:卷带(TR)剪切带(CT)Digi-Reel® 得捷定制卷带 描述:CAP CER 10000PF 50V X7R 0612 电容器 电容器网络,阵列 | KEMETKEMET Corporation 基美 | |||
Four individual capacitors inside one 1206 monolithic structure 文件:938.18 Kbytes Page:7 Pages | KEMETKEMET Corporation 基美 | |||
Four individual capacitors inside one 1206 monolithic structure 文件:938.18 Kbytes Page:7 Pages | KEMETKEMET Corporation 基美 | |||
Four individual capacitors inside one 1206 monolithic structure 文件:938.18 Kbytes Page:7 Pages | KEMETKEMET Corporation 基美 | |||
CERAMIC CHIP CAPACITORS 文件:2.10586 Mbytes Page:30 Pages | KEMETKEMET Corporation 基美 | |||
CERAMIC CAPACITOR ARRAY 文件:937.23 Kbytes Page:7 Pages | KEMETKEMET Corporation 基美 | |||
Four individual capacitors inside one 1206 monolithic structure 文件:938.18 Kbytes Page:7 Pages | KEMETKEMET Corporation 基美 | |||
CERAMIC CAPACITOR ARRAY 文件:937.23 Kbytes Page:7 Pages | KEMETKEMET Corporation 基美 | |||
CERAMIC CAPACITOR ARRAY 文件:937.23 Kbytes Page:7 Pages | KEMETKEMET Corporation 基美 | |||
CERAMIC CHIP CAPACITORS 文件:2.10586 Mbytes Page:30 Pages | KEMETKEMET Corporation 基美 | |||
CERAMIC CAPACITOR ARRAY 文件:937.23 Kbytes Page:7 Pages | KEMETKEMET Corporation 基美 | |||
Four individual capacitors inside one 1206 monolithic structure 文件:938.18 Kbytes Page:7 Pages | KEMETKEMET Corporation 基美 | |||
CERAMIC CHIP CAPACITORS 文件:2.10586 Mbytes Page:30 Pages | KEMETKEMET Corporation 基美 | |||
CERAMIC CAPACITOR ARRAY 文件:937.23 Kbytes Page:7 Pages | KEMETKEMET Corporation 基美 | |||
Four individual capacitors inside one 1206 monolithic structure 文件:938.18 Kbytes Page:7 Pages | KEMETKEMET Corporation 基美 | |||
CERAMIC CAPACITOR ARRAY 文件:937.23 Kbytes Page:7 Pages | KEMETKEMET Corporation 基美 |
C163产品属性
- 类型
描述
- 型号
C163
- 制造商
INFINEON
- 制造商全称
Infineon Technologies AG
- 功能描述
16-Bit CMOS Single-Chip Microcontrollers
IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
---|---|---|---|---|---|---|---|
AMIS |
2025+ |
SOP28 |
4825 |
全新原厂原装产品、公司现货销售 |
|||
kemet |
25+ |
500000 |
行业低价,代理渠道 |
||||
KEMET |
24+ |
N/A |
10000 |
只做原装,实单最低价支持 |
|||
TDK |
18+ |
SMD |
900000 |
优势贴片电容全新原装进口现货欢迎咨询 |
|||
TDK |
23+ |
SMD0805 |
4000 |
受权代理!全新原装现货特价热卖! |
|||
TDK |
17+ |
SMD |
100000 |
原装正品现货 |
|||
TDK(东电化) |
24+ |
0612(1632 公制) |
71347 |
TDK原厂直供,全系列可订货。美金交易,大陆交货。 |
|||
TDK/东电化 |
25+ |
原厂原封可拆样 |
54687 |
百分百原装现货 实单必成 |
|||
KEMET/基美 |
2450+ |
ARRAY |
9850 |
只做原厂原装正品现货或订货假一赔十! |
|||
AMI |
20+ |
SOP28 |
2960 |
诚信交易大量库存现货 |
C163规格书下载地址
C163参数引脚图相关
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- C163-L
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- C16378
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- C16373
- C16371
- C16369
- C1632X5R1A105K
- C1632X5R0J475M130AC
- C1632X5R0J106M130AC
- C1632X5R0J106M
- C1632C471K5GACTU
- C1632C330K5GACTU
- C1632C221K5GACTU
- C1632C221K5GACAUTO
- C1632C220K5GACTU
- C1632C104M4RACTU
- C1632C104K4RACTU
- C1632C104K4RAC7800
- C1632C103M5RACAUTO
- C1632C103K5RAC7800
- C1632C103K4RACTU
- C1632C103K3RAC7800
- C1632C102K5RAC7800
- C1632C101K5GACTU
- C1632C101K5GAC7800
- C1632C100K5GACTU
- C16307
- C16306
- C16280
- C16265
- C16264
- C16263
- C16255
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- C16248
- C1623
- C16226
- C16220
- C161V
- C161U
- C161S
- C161RI
- C161PI
- C161OLMHABXUMA1
- C161OLMHABXQMA1
- C161O
- C161KLMHABXQMA1
- C161K
- C-16196
- C16193
- C16192
- C1614AC31630
- C160X020YJJ
- C1608Y5V1H104Z
- C1608Y5V1E474Z
- C1608X8R2A682M080AA
- C1608X8R2A682K080AA
- C1608X8R2A472M080AA
- C1608X8R2A472K080AA
- C1608X8R2A333M080AB
- C1608X8R2A333K080AB
- C1608X8R2A332M080AA
- C1608X8R2A332K080AA
- C1608X8R2A223M080AB
- C1608X8R2A223K080AB
- C1608X8R2A222M080AA
- C1608X8R2A222K080AA
- C1608X8R2A153M080AA
C163数据表相关新闻
C1608X5R1E105K080AC
C1608X5R1E105K080AC
2022-2-10C19D903205P1375
C19D903205P1375 OTHER 20+ 标准封装 C8051F001 SILICONLABS 20+ 标准封装 C8051F023-GQ SILICONLABS 20+ 标准封装 CAT24C04WI CATALYSTSEMICONDUCTOR 20+ 标准封装 CAT24C08WI-GT3 CATALYSTSEMICONDUCTOR 20+ 标准封装 CAT28F010G-12(PROG) OTHER 20+ 标准封装 CMCPCI102BR CALIFORNIAMICRODEVICES 20+ 标准封装 CP
2021-6-5C1720J5003AHF定向耦合器
C1720J5003AHF定向耦合器
2021-3-23C1608C0G1H332J080AA产品技术参数 资料品牌TDK 批号2019 封装:SMD
C1608C0G1H332J080AA产品技术参数 资料品牌TDK
2020-6-13C17AH,C18003,C18005(104-022-B),C1806,C1808DKNPOEBN6R0
C17AH,C18003,C18005(104-022-B),C1806,C1808DKNPOEBN6R0
2020-4-3C1608COG1HR68CT000N0603-0.68PPB-FREE,C1608COG221JT000N
C1608COG1HR68CT000N 0603-0.68P PB-FREE,C1608COG221JT000N
2020-4-3
DdatasheetPDF页码索引
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