位置：首页 > IC中文资料第4256页 > C1608X7R1H102J
| 型号 | 功能描述 | 生产厂家 企业 | LOGO | 操作 |
|---|---|---|---|---|
Ceramic Capacitors For General Use SMD Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 |   | ||
General Application 文件：1.3923 Mbytes Page：72 Pages | TDK 东电化 | | ||
Simple Power Solution Using LDOs 文件：149.07 Kbytes Page：8 Pages | TI 德州仪器 | | ||
Evaluation Board provides the design engineer with a fully functional 文件：1.21912 Mbytes Page：10 Pages | NSCNational Semiconductor (TI) 美国国家半导体美国国家半导体公司 | | ||
General Application 文件：1.3923 Mbytes Page：72 Pages | TDK 东电化 | |
C1608X7R1H102J产品属性
- 类型
描述
- 型号
C1608X7R1H102J
- 功能描述
多层陶瓷电容器MLCC - SMD/SMT 0603 50volts 1000pF X7R 5%
- RoHS
否
- 制造商
American Technical Ceramics(ATC)
- 电容
10 pF
- 容差
1 %
- 电压额定值
250 V
- 温度系数/代码
C0G(NP0) 外壳代码 -
- in
0505 外壳代码 -
- mm
1414
- 工作温度范围
- 55 C to + 125 C
- 产品
Low ESR MLCCs
- 封装
Reel
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
TDK/东电化 |
25+ |
SMD |
860000 |
明嘉莱只做原装正品现货 |
|||
TDK/东电化 |
2409+ |
n/a |
3880 |
原装现货真实库存!量大特价! |
|||
TDK |
原厂封装 |
9800 |
原装进口公司现货假一赔百 |
||||
24+ |
N/A |
56000 |
一级代理-主营优势-实惠价格-不悔选择 |
||||
TDK |
24+ |
SMD |
36200 |
全新原装现货/放心购买 |
|||
TDK |
23+ |
0603 |
50000 |
全新原装正品现货,支持订货 |
|||
TDK |
24+ |
con |
2500 |
优势库存,原装正品 |
|||
TDK |
24+ |
N/A |
5650 |
公司原厂原装现货假一罚十!特价出售!强势库存! |
|||
TDK/东电化 |
24+ |
DIP8 |
9600 |
原装现货,优势供应,支持实单! |
|||
TDK |
24+ |
SMD |
6980 |
原装现货,可开13%税票 |
C1608X7R1H102J芯片相关品牌
C1608X7R1H102J规格书下载地址
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C1608X7R1H102J数据表相关新闻
C1608X5R1E105K080AC
C1608X5R1E105K080AC
2022-2-10C19D903205P1375
C19D903205P1375 OTHER 20+ 标准封装 C8051F001 SILICONLABS 20+ 标准封装 C8051F023-GQ SILICONLABS 20+ 标准封装 CAT24C04WI CATALYSTSEMICONDUCTOR 20+ 标准封装 CAT24C08WI-GT3 CATALYSTSEMICONDUCTOR 20+ 标准封装 CAT28F010G-12(PROG) OTHER 20+ 标准封装 CMCPCI102BR CALIFORNIAMICRODEVICES 20+ 标准封装 CP
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2021-3-23C1608C0G1H332J080AA产品技术参数 资料品牌TDK 批号2019 封装：SMD
C1608C0G1H332J080AA产品技术参数 资料品牌TDK
2020-6-13C1608COG1HR68CT000N0603-0.68PPB-FREE，C1608COG221JT000N
C1608COG1HR68CT000N 0603-0.68P PB-FREE，C1608COG221JT000N
2020-4-3C17AH，C18003，C18005(104-022-B)，C1806，C1808DKNPOEBN6R0
C17AH，C18003，C18005(104-022-B)，C1806，C1808DKNPOEBN6R0
2020-4-3
DdatasheetPDF页码索引
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