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C1608X5R1E225M价格
参考价格：￥0.2364
型号：C1608X5R1E225M080AB 品牌：TDK 备注：这里有C1608X5R1E225M多少钱，2026年最近7天走势，今日出价，今日竞价，C1608X5R1E225M批发/采购报价，C1608X5R1E225M行情走势销售排行榜，C1608X5R1E225M报价。| 型号 | 功能描述 | 生产厂家 企业 | LOGO | 操作 |
|---|---|---|---|---|
Multilayer Ceramic Chip Capacitors C Series General (Up to 50V) Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency | TDK 东电化 |   | ||
封装/外壳：0603（1608 公制） 包装：剪切带（CT）带盒（TB） 描述：CAP CER 2.2UF 25V X5R 0603 电容器 陶瓷电容器 | TDK 东电化 | | ||
封装/外壳：0603（1608 公制） 包装：剪切带（CT）带盒（TB） 描述：CAP CER 2.2UF 25V X5R 0603 电容器 陶瓷电容器 | TDK 东电化 | | ||
积层贴片陶瓷片式电容器 | TDK 东电化 | | ||
Multilayer Ceramic Chip Capacitors 文件：231.08 Kbytes Page：3 Pages | TDK 东电化 | |
C1608X5R1E225M产品属性
- 类型
描述
- 型号
C1608X5R1E225M
- 功能描述
多层陶瓷电容器MLCC - SMD/SMT 0603 2.2uF 25volts X5R 20%
- RoHS
否
- 制造商
American Technical Ceramics(ATC)
- 电容
10 pF
- 容差
1 %
- 电压额定值
250 V
- 温度系数/代码
C0G(NP0) 外壳代码 -
- in
0505 外壳代码 -
- mm
1414
- 工作温度范围
- 55 C to + 125 C
- 产品
Low ESR MLCCs
- 封装
Reel
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
TDK/东电化 |
23+ |
SMD |
8450000 |
原厂授权一级代理,专业海外优势订货,价格优势、品种 |
|||
TDK/东电化 |
23+ |
7300 |
专注配单,只做原装进口现货 |
||||
TDK |
24+ |
103280 |
|||||
CYPRESS/赛普拉斯 |
24+ |
QFN |
6618 |
公司现货库存,支持实单 |
|||
TDK |
2026+ |
SMD |
900000 |
优势贴片电容全新原装进口现货欢迎咨询 |
|||
TDK |
2019+ |
SMD |
120000 |
原厂渠道 可含税出货 |
|||
TDK |
2021+ |
0603 |
20000 |
一级代理,专注军工、汽车、医疗、工业、新能源、电力 |
|||
TDK/东电化 |
24+ |
65200 |
|||||
TDK/东电化 |
25+ |
SMD |
2640000 |
QQ全天询价/耐高温/防断裂 专营日系/支持小批量 |
|||
TDK |
25+ |
- |
23458 |
样件支持,可原厂排单订货! |
C1608X5R1E225M芯片相关品牌
C1608X5R1E225M规格书下载地址
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C1608X5R1E225M数据表相关新闻
C1608X5R1E105K080AC
C1608X5R1E105K080AC
2022-2-10C19D903205P1375
C19D903205P1375 OTHER 20+ 标准封装 C8051F001 SILICONLABS 20+ 标准封装 C8051F023-GQ SILICONLABS 20+ 标准封装 CAT24C04WI CATALYSTSEMICONDUCTOR 20+ 标准封装 CAT24C08WI-GT3 CATALYSTSEMICONDUCTOR 20+ 标准封装 CAT28F010G-12(PROG) OTHER 20+ 标准封装 CMCPCI102BR CALIFORNIAMICRODEVICES 20+ 标准封装 CP
2021-6-5C1720J5003AHF定向耦合器
C1720J5003AHF定向耦合器
2021-3-23C1608C0G1H332J080AA产品技术参数 资料品牌TDK 批号2019 封装：SMD
C1608C0G1H332J080AA产品技术参数 资料品牌TDK
2020-6-13C1608COG1HR68CT000N0603-0.68PPB-FREE，C1608COG221JT000N
C1608COG1HR68CT000N 0603-0.68P PB-FREE，C1608COG221JT000N
2020-4-3C17AH，C18003，C18005(104-022-B)，C1806，C1808DKNPOEBN6R0
C17AH，C18003，C18005(104-022-B)，C1806，C1808DKNPOEBN6R0
2020-4-3
DdatasheetPDF页码索引
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