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C0603X7R价格
参考价格：￥0.0196
型号：C0603X7R0J103K030BA 品牌：TDK 备注：这里有C0603X7R多少钱，2025年最近7天走势，今日出价，今日竞价，C0603X7R批发/采购报价，C0603X7R行情走势销售排行榜，C0603X7R报价。| 型号 | 功能描述 | 生产厂家 企业 | LOGO | 操作 |
|---|---|---|---|---|
C0603X7R | LOW-VOLTAGE 1.2-GHz FRACTIONAL-N/INTEGER-N SYNTHESIZER 文件：542.75 Kbytes Page：34 Pages | TI 德州仪器 |   | |
Part Number Change Notification C Series General (Up to 50V) Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency | TDK 东电化 | | ||
Part Number Change Notification C Series General (Up to 50V) Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency | TDK 东电化 | | ||
Evaluation Board Rev 5.0 for the Si2493/57/34/15/04 Description The global Si2493/57/34/15/04-EVB evaluation board Rev 5.0 provides the system designer an easy way of evaluating the Si2493/57/34/15/04 ISOmodem®. The Si2493/57/34/15/04-EVB consists of a motherboard with a power supply, an RS-232 and USB interface, other ease-of-use features, and a | SILABS 芯科科技 | | ||
ISOLATED EVALUATION BOARD FOR THE Si3402B Description The Si3402B isolated evaluation board (Si3402BISO-EVB Rev 2) is a reference design for power supplies in Power over Ethernet (PoE) Powered Device (PD) applications. The Si3402B is described more completely in the data sheet and application notes. This document describes only the Si340 | SILABS 芯科科技 | | ||
PROSLIC® SINGLE-CHIP FXS SOLUTION WITH INTEGRATED SERIAL INTERFACE (ISI) Si32172/3/5 Features Complete FXS solution in 5 x 7 mm 3-wire ISI combines PCM, SPI, and interrupt data Performs all BORSCHT functions Ideal for short to medium loops Global programmability Internal balanced or unbalanced ringing Patented low power ringing Simplified conf | SKYWORKS 思佳讯 | | ||
PROSLIC® SINGLE-CHIP FXS SOLUTION WITH INTEGRATED SERIAL INTERFACE (ISI) Si32172/3/5 Features Complete FXS solution in 5 x 7 mm 3-wire ISI combines PCM, SPI, and interrupt data Performs all BORSCHT functions Ideal for short to medium loops Global programmability Internal balanced or unbalanced ringing Patented low power ringing Simplified conf | SKYWORKS 思佳讯 | | ||
SINGLE-CHIP DUAL PROSLIC® Si32260/1 Features Two complete FXS channels in a single 6 x 8 mm or 8 x 8 mm package Performs all BORSCHT functions Ideal for short- or long-loop applications Ultra low power consumption Internal balanced or unbalanced ringing Patented low power ringing Adaptive ringing S | SKYWORKS 思佳讯 | | ||
Evaluation Board Rev 5.0 for the Si2493/57/34/15/04 Description The global Si2493/57/34/15/04-EVB evaluation board Rev 5.0 provides the system designer an easy way of evaluating the Si2493/57/34/15/04 ISOmodem®. The Si2493/57/34/15/04-EVB consists of a motherboard with a power supply, an RS-232 and USB interface, other ease-of-use features, and a | SILABS 芯科科技 | | ||
Evaluation Board Rev 5.0 for the Si2493/57/34/15/04 Description The global Si2493/57/34/15/04-EVB evaluation board Rev 5.0 provides the system designer an easy way of evaluating the Si2493/57/34/15/04 ISOmodem®. The Si2493/57/34/15/04-EVB consists of a motherboard with a power supply, an RS-232 and USB interface, other ease-of-use features, and a | SILABS 芯科科技 | | ||
Multilayer Ceramic Chip Capacitors Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
Multilayer Ceramic Chip Capacitors Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
Multilayer Ceramic Chip Capacitors Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
Multilayer Ceramic Chip Capacitors Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
Multilayer Ceramic Chip Capacitors Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
Multilayer Ceramic Chip Capacitors Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
Multilayer Ceramic Chip Capacitors Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
Multilayer Ceramic Chip Capacitors Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
Multilayer Ceramic Chip Capacitors Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
Multilayer Ceramic Chip Capacitors Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
Multilayer Ceramic Chip Capacitors Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
Multilayer Ceramic Chip Capacitors Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
Multilayer Ceramic Chip Capacitors Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
Multilayer Ceramic Chip Capacitors Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
Multilayer Ceramic Chip Capacitors Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
Commercial Grade ( General (Up to 50V) ) C Series General (Up to 50V) Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency | TDK 东电化 | | ||
Commercial Grade ( General (Up to 50V) ) C Series General (Up to 50V) Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency | TDK 东电化 | | ||
Multilayer Ceramic Chip Capacitors Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
Multilayer Ceramic Chip Capacitors Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
Multilayer Ceramic Chip Capacitors Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
Commercial Grade ( General (Up to 50V) ) C Series General (Up to 50V) Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency | TDK 东电化 | | ||
Commercial Grade ( General (Up to 50V) ) C Series General (Up to 50V) Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency | TDK 东电化 | | ||
Commercial Grade ( General (Up to 50V) ) C Series General (Up to 50V) Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency | TDK 东电化 | | ||
Commercial Grade ( General (Up to 50V) ) C Series General (Up to 50V) Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency | TDK 东电化 | | ||
Commercial Grade ( General (Up to 50V) ) C Series General (Up to 50V) Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency | TDK 东电化 | | ||
Commercial Grade ( General (Up to 50V) ) C Series General (Up to 50V) Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency | TDK 东电化 | | ||
Commercial Grade ( General (Up to 50V) ) C Series General (Up to 50V) Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency | TDK 东电化 | | ||
Commercial Grade ( General (Up to 50V) ) C Series General (Up to 50V) Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency | TDK 东电化 | | ||
PROSLIC® SINGLE-CHIP FXS SOLUTION WITH INTEGRATED SERIAL INTERFACE (ISI) Si32172/3/5 Features Complete FXS solution in 5 x 7 mm 3-wire ISI combines PCM, SPI, and interrupt data Performs all BORSCHT functions Ideal for short to medium loops Global programmability Internal balanced or unbalanced ringing Patented low power ringing Simplified conf | SKYWORKS 思佳讯 | | ||
SINGLE-CHIP DUAL PROSLIC® Si32260/1 Features Two complete FXS channels in a single 6 x 8 mm or 8 x 8 mm package Performs all BORSCHT functions Ideal for short- or long-loop applications Ultra low power consumption Internal balanced or unbalanced ringing Patented low power ringing Adaptive ringing S | SKYWORKS 思佳讯 | | ||
Part Number Change Notification C Series General (Up to 50V) Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency | TDK 东电化 | | ||
Part Number Change Notification C Series General (Up to 50V) Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency | TDK 东电化 | | ||
AT90USB1287 (AVR) 64 QFN device (2.7V VCC 5.5V) Overview This document describes the AT88CK109STK3, which is a development kit for the AT88SA100, AT88SA102, and ATSA8810HS CryptoAuthentication devices. This kit uses a modular approach. The development kit includes the AT88Microbase board and the AT88CK109BK3 CryptoAuthentication daughter board | Atmel 爱特梅尔 | | ||
AT90USB1287 (AVR) 64 QFN device (2.7V VCC 5.5V) Overview This document describes the AT88CK109STK3, which is a development kit for the AT88SA100, AT88SA102, and ATSA8810HS CryptoAuthentication devices. This kit uses a modular approach. The development kit includes the AT88Microbase board and the AT88CK109BK3 CryptoAuthentication daughter board | Atmel 爱特梅尔 | | ||
PROSLIC® SINGLE-CHIP FXS SOLUTION WITH INTEGRATED SERIAL INTERFACE (ISI) Si32172/3/5 Features Complete FXS solution in 5 x 7 mm 3-wire ISI combines PCM, SPI, and interrupt data Performs all BORSCHT functions Ideal for short to medium loops Global programmability Internal balanced or unbalanced ringing Patented low power ringing Simplified conf | SKYWORKS 思佳讯 | | ||
SINGLE-CHIP DUAL PROSLIC® Si32260/1 Features Two complete FXS channels in a single 6 x 8 mm or 8 x 8 mm package Performs all BORSCHT functions Ideal for short- or long-loop applications Ultra low power consumption Internal balanced or unbalanced ringing Patented low power ringing Adaptive ringing S | SKYWORKS 思佳讯 | | ||
Evaluation Board Rev 5.0 for the Si2493/57/34/15/04 Description The global Si2493/57/34/15/04-EVB evaluation board Rev 5.0 provides the system designer an easy way of evaluating the Si2493/57/34/15/04 ISOmodem®. The Si2493/57/34/15/04-EVB consists of a motherboard with a power supply, an RS-232 and USB interface, other ease-of-use features, and a | SILABS 芯科科技 | | ||
Evaluation Board Rev 5.0 for the Si2493/57/34/15/04 Description The global Si2493/57/34/15/04-EVB evaluation board Rev 5.0 provides the system designer an easy way of evaluating the Si2493/57/34/15/04 ISOmodem®. The Si2493/57/34/15/04-EVB consists of a motherboard with a power supply, an RS-232 and USB interface, other ease-of-use features, and a | SILABS 芯科科技 | | ||
General Application 文件：1.3923 Mbytes Page：72 Pages | TDK 东电化 | | ||
General Application 文件：1.3923 Mbytes Page：72 Pages | TDK 东电化 | | ||
General Application 文件：1.3923 Mbytes Page：72 Pages | TDK 东电化 | | ||
General Application 文件：1.3923 Mbytes Page：72 Pages | TDK 东电化 | | ||
General Application 文件：1.3923 Mbytes Page：72 Pages | TDK 东电化 | | ||
General Application 文件：1.3923 Mbytes Page：72 Pages | TDK 东电化 | | ||
General Application 文件：1.3923 Mbytes Page：72 Pages | TDK 东电化 | | ||
General Application 文件：1.3923 Mbytes Page：72 Pages | TDK 东电化 | | ||
General Application 文件：1.3923 Mbytes Page：72 Pages | TDK 东电化 | | ||
General Application 文件：1.3923 Mbytes Page：72 Pages | TDK 东电化 | | ||
General Application 文件：1.3923 Mbytes Page：72 Pages | TDK 东电化 | | ||
General Application 文件：1.3923 Mbytes Page：72 Pages | TDK 东电化 | |
C0603X7R产品属性
- 类型
描述
- 型号
C0603X7R
- 制造商
TDK
- 功能描述
Capacitor, Ceramic, 470pf, 50V, 10±%, X7R Temp Coef.
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
美隆 |
18+ |
SMD |
5000 |
一级代理,专注军工、汽车、医疗、工业、新能源、电力 |
|||
TDK/东电化 |
24+ |
NA/ |
30000 |
优势代理渠道,原装正品,可全系列订货开增值税票 |
|||
NA |
25+ |
原厂原封可拆样 |
54687 |
百分百原装现货 实单必成 |
|||
TDK |
18+ |
SMD |
900000 |
优势贴片电容全新原装进口现货欢迎咨询 |
|||
TDK |
17+ |
SMD |
100000 |
原装正品现货 |
|||
TDK/东电化 |
15+ROHS |
SMD |
229500 |
一级质量保证长期稳定提供货优价美 |
|||
TDK/东电化 |
25+ |
NA |
880000 |
明嘉莱只做原装正品现货 |
|||
VENKEL |
23+ |
NA |
30486 |
专做原装正品,假一罚百! |
|||
TDK/东电化 |
24+ |
SMD |
41535 |
TDK原厂直供,全系列可订货。美金交易,大陆交货。 |
|||
TDK/东电化 |
2021 |
SMD |
889000 |
现货库存一站式配套元器件 |
C0603X7R芯片相关品牌
C0603X7R规格书下载地址
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2018-12-19
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