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BZT52C6V2S价格
参考价格:¥0.1383
型号:BZT52C6V2S 品牌:Taiwan Semi 备注:这里有BZT52C6V2S多少钱,2025年最近7天走势,今日出价,今日竞价,BZT52C6V2S批发/采购报价,BZT52C6V2S行情走势销售排行榜,BZT52C6V2S报价。型号 | 功能描述 | 生产厂家 企业 | LOGO | 操作 |
---|---|---|---|---|
BZT52C6V2S | SURFACE MOUNT ZENER DIODE Features • Planar Die Construction • Small Surface Mount Package • Ideally Suited for Automated Assembly Processes • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) • Halogen and Antimony Free. “Green” Device (Notes 3 & 4) • Qualified to AEC-Q101 Standards for High Reliabi | DIODES 美台半导体 | ||
BZT52C6V2S | 200 mW Zener Diodes 2.4 to 39 Volts Features • Planar Die Construction • 200mW Power Dissipation on Ceramic PCB • General Purpose Medium Current • Ideally Suited for Automated Assembly Processes • Epoxy meets UL 94 V-0 flammability rating • Moisture Sensitivity Level 1 • Lead Free Finish/RoHS Compliant(P Suffix designates | MCC | ||
BZT52C6V2S | 200mW SURFACE MOUNT ZENER DIODE Features ● Planar Die Construction ● 200mW Power Dissipation ● 2.0V – 51V Nominal Zener Voltage ● 5 Standard Vz Tolerance ● Designed for Surface Mount Application ● Plastic Material – UL Recognition Flammability Classification 94V-0 | WTE Won-Top Electronics | ||
BZT52C6V2S | Surface mount zener diode FEATURES ● Planar die construction. ● General purpose, medium current. ● Ideally suited for automated assembly processes. APPLICATIONS ● Zener diode. ● Ultra-small surface mount package. | BILIN 银河微电 | ||
BZT52C6V2S | Surface Mount Zener Diodes Features ● Planar Die Construction ● Ultra-Small Surface Mount Package ● Ideally Suited for Automated Assembly Processes | KEXIN 科信电子 | ||
BZT52C6V2S | 200mW, 5 Tolerance SMD Zener Diode FEATURES - Wide zener voltage range selection : 2.4V to 75V - Surface Mount Device Type - VZ Tolerance Selection of ±5 - Matte Tin(Sn) lead finish with Nickel(Ni) underplate - Moisture sensitivity level 1 - Pb free and RoHS compliant - Green compound (Halogen free) with suffix G on pack | TSC 台湾半导体 | ||
BZT52C6V2S | Surface mount zener diode FEATURES ● Planar die construction. ● General purpose, medium current. ● Ideally suited for automated assembly processes. APPLICATIONS ● Zener diode. ● Ultra-small surface mount package. | SY 顺烨电子 | ||
BZT52C6V2S | ZENER DIODE SOD-323 Plastic-Encapsulate Diodes FEATURES ● Planar die construction ● 200mW power dissipation on ceramic PBC ● General purpose, medium current ● Ideally suited for automated assembly processes ● Available in lead free version | JIANGSU 长电科技 | ||
BZT52C6V2S | Surface mount zener diode Features • Planar die construction. • General purpose, medium current. • Ideally suited for automated assembly processes. • RoHS compliant package Applications • Zener diode. • Ultra-small surface mount package.SOD-323 | BWTECH | ||
BZT52C6V2S | 200mW SURFACE MOUNT ZENER DIODE Features: Power dissipation: Pd: 200mW (tamb=25°C) Forward Voltage: Vf: 0.9V Operating and storage junction temp. range: Tj, Tstg: -55°C to +150°C | FCI 富加宜 | ||
BZT52C6V2S | PLASTIC-ENCAPSULATE ZENER DIODE VOLTAGE 2.0~75 Volts POWER 200.0 mW FEATURES • Low Zener Impedance • Power Dissipation of 200mW • High Stability and High Reliability • Zener Voltage Tolerance: ± 5 MECHANICAL DATA • Case: SOD-123 Small Outline Plastic Package • Epoxy UL: 94V-0 • Polarity: Color band denotes cathode end | NIUHANG 纽航电子 | ||
BZT52C6V2S | ZENER DIODE FEATURES ● Planar die construction. ● General purpose, medium current. ● Ideally suited for automated assembly processes. APPLICATIONS ● Zener diode. ● Ultra-small surface mount package. | CHENDA 辰达半导体 | ||
BZT52C6V2S | ZENER DIODE FEATURES ● Planar die construction. ● General purpose, medium current. ● Ideally suited for automated assembly processes. APPLICATIONS ● Zener diode. ● Ultra-small surface mount package. | CHENDA 辰达半导体 | ||
BZT52C6V2S | SURFACE MOUNT ZENER DIODE Features • Planar Die Construction • Ultra-Small Surface Mount Package • Ideally suited for Automated Assembly Processes | DIODES 美台半导体 | ||
BZT52C6V2S | Surface mount zener diode FEATURES ● Planar die construction. ● General purpose, medium current. ● Ideally suited for automated assembly processes. APPLICATIONS ● Zener diode. ● Ultra-small surface mount package. | CHENDA 辰达半导体 | ||
BZT52C6V2S | Surface mount zener diode FEATURES ● Planar die construction. ● General purpose, medium current. ● Ideally suited for automated assembly processes. APPLICATIONS ● Zener diode. ● Ultra-small surface mount package. | SHUNYE 顺烨电子 | ||
BZT52C6V2S | 200 mW Zener Diode 2.4 to 39 Volts Features • Planar Die Construction • 200mW Power Dissipation on Ceramic PCB • General Purpose Medium Current • Ideally Suited for Automated Assembly Processes • Epoxy meets UL 94 V-0 flammability rating • Moisture Sensitivity Level 1 • Lead Free Finish/RoHS Compliant(P Suffix designates | MCC | ||
BZT52C6V2S | Plastic-Encapsulate Diodes Plastic-Encapsulate Diodes FEATURES Planar die construction General purpose, Medium current Ideally suited for automated assembly processes Available in Lead free version | HOTTECH 合科泰 | ||
BZT52C6V2S | Surface Mount Silicon Zener Diodes FEATURES ● Ideally suited for automated assembly processes. ● Total power dissipation: Max. 200mW | SKTECHNOLGYSHIKE Electronics 时科广东时科微实业有限公司 | ||
BZT52C6V2S | Plastic-Encapsulate Zener Diode Features ● Low Zener Impedance ● 200mW; Power Dissipation of 200mW ● High Stability and High Reliability | LEIDITECH 雷卯电子 | ||
BZT52C6V2S | Surface mount zener diode FEATURES ● Planar die construction. ● General purpose, medium current. ● Ideally suited for automated assembly processes. APPLICATIONS ● Zener diode. ● Ultra-small surface mount package. | DSK | ||
BZT52C6V2S | Planar Die Construction Features • Planar Die Construction • Ultra-Small Surface Mount Package • Ideally suited for Automated Assembly Processes | DIODES 美台半导体 | ||
BZT52C6V2S | SURFACE MOUNT SILICON ZENER DIODES Features: • Planar Die Construction • 200mW Power Dissipation • 2.4-51V Nominal Zener Voltage • Ideally Suited for Automated Assembly Processes • In compliance with EU RoHS 2002/95/EC directives • This is a Pb − Free Device • All SMC parts are traceable to the wafer lot • Additional testin | SMC 桑德斯微电子 | ||
BZT52C6V2S | SURFACE MOUNT ZENER DIODE Features • Planar Die Construction • Ultra-Small Surface Mount Package • Ideally suited for Automated Assembly Processes | YIXIN 壹芯微 | ||
BZT52C6V2S | Zener Diodes ■ Features ● Planar die construction ● 200mW power dissipation on ceramic PBC ● General purpose, medium current ● Ideally suited for automated assembly processes ● Available in lead free version | YFWDIODE 佑风微 | ||
BZT52C6V2S | SOD-323 Plastic-Encapsulate Zener Diodes Features Planar Die Construction General Purpose, Medium Current 200mW Power Dissipation On Ceramic PBC Ideally Suited for Automated Assembly Processes Available in Lead Free Version | UNSEMI 优恩半导体 | ||
BZT52C6V2S | SURFACE MOUNT ZENER DIODES FEATURES Planar die construction 200mW power dissipation on ceramic PBC General purpose, medium current Ideally suited for automated assembly processes Available in lead free version | SY 顺烨电子 | ||
BZT52C6V2S | SOD323 Zener Diodes Features » Low Zener Impedance » Power Dissipation of 200mW High Stability and High Reliability « Halogen free and RoHS compliant © SOD323 surface mount package | TECHPUBLIC 台舟电子 | ||
BZT52C6V2S | SURFACE MOUNT SILICON ZENER DIODE Description DIODE, ZENER 0.2W SOD-323 | MULTICOMP 易络盟 | ||
BZT52C6V2S | 稳压二极管 | JSCJ 长晶科技 | ||
BZT52C6V2S | Zener Diode | ETC 知名厂家 | ETC | |
BZT52C6V2S | 稳压管 | JIEJIEJIEJIE MICROELECTRONICS CO.,Ltd 捷捷微电江苏捷捷微电子股份有限公司 | ||
BZT52C6V2S | 0.2W Zener Diode 文件:1.53972 Mbytes Page:3 Pages | LUGUANG 鲁光电子 | ||
BZT52C6V2S | 封装/外壳:SC-76,SOD-323 包装:卷带(TR)剪切带(CT)Digi-Reel® 得捷定制卷带 描述:ZENER DIODE 6.2V 0.2W SOD-323 分立半导体产品 二极管 - 齐纳 - 单 | ETC 知名厂家 | ETC | |
BZT52C6V2S | 5 Tolerance SMD Zener Diode 文件:247.9 Kbytes Page:5 Pages | TSC 台湾半导体 | ||
BZT52C6V2S | 200mW SOD-323 SURFACE MOUNT 文件:298.29 Kbytes Page:4 Pages | WINNERJOIN 永而佳 | ||
BZT52C6V2S | SURFACE MOUNT ZENER DIODE 文件:956.23 Kbytes Page:3 Pages | CHENDA 辰达半导体 | ||
BZT52C6V2S | ZENER DIODE 文件:237.7 Kbytes Page:3 Pages | WINNERJOIN 永而佳 | ||
BZT52C6V2S | ZENER DIODE 文件:517.13 Kbytes Page:4 Pages | FS | ||
BZT52C6V2S | SURFACE MOUNT ZENER DIODE 文件:88.9 Kbytes Page:4 Pages | DIODES 美台半导体 | ||
BZT52C6V2S | Surface mount zener diode 文件:191.5 Kbytes Page:5 Pages | BILIN 银河微电 | ||
BZT52C6V2S | SOD323 Plastic-Encapsulate Diodes 文件:1.89514 Mbytes Page:5 Pages | HDSEMI 海德半导体 | ||
BZT52C6V2S | SURFACE MOUNT ZENER DIODE 文件:185.21 Kbytes Page:5 Pages | DIODES 美台半导体 | ||
BZT52C6V2S | 200 mW Zener Diode 2.4 to 56 Volts 文件:272.9 Kbytes Page:4 Pages | MCC | ||
BZT52C6V2S | Zener Diodes 文件:1.16825 Mbytes Page:4 Pages | YFWDIODE 佑风微 | ||
BZT52C6V2S | 200 mW Zener Diode 2.4 to 39 Volts 文件:282.09 Kbytes Page:4 Pages | MCC | ||
BZT52C6V2S | SURFACE MOUNT ZENER DIODE 文件:146.74 Kbytes Page:4 Pages | DIODES 美台半导体 | ||
BZT52C6V2S | SURFACE MOUNT SILICON ZENER DIODES 文件:186.75 Kbytes Page:3 Pages | CDIL | ||
BZT52C6V2S | SURFACE MOUNT ZENER DIODE 文件:91.18 Kbytes Page:3 Pages | DIODES 美台半导体 | ||
SURFACE MOUNT ZENER DIODE Features • Planar Die Construction • 500mW Power Dissipation • General Purpose, Medium Current • Ideally Suited for Automated Assembly Processes • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) • Halogen and Antimony Free. “Green” Device (Notes 3 & 4) • Qualified to AEC- | DIODES 美台半导体 | |||
SURFACE MOUNT ZENER DIODE Features • Planar Die Construction • 500mW Power Dissipation • General Purpose, Medium Current • Ideally Suited for Automated Assembly Processes • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) • Halogen and Antimony Free. “Green” Device (Notes 3 & 4) • Qualified to AEC- | DIODES 美台半导体 | |||
410 mW Zener Diodes 2.4 to 39 Volts Features • Planar Die Construction • 500mW Power Dissipation on Ceramic PCB • General Purpose Medium Current • Ideally Suited for Automated Assembly Processes • Epoxy meets UL 94 V-0 flammability rating • Moisture Sensitivity Level 1 • Lead Free Finish/RoHS Compliant(P Suffix designates RoH | MCC | |||
ZENER DIODE Features · Constant voltage control · Wide voltage range selection 2.4V to 75V · Vz tolerance selection of ±2 (B series) · SOD-323F thin SMD package · RoHS compliant / Green EMC · Matte Tin (Sn) lead finish · Cathode band | DAESAN | |||
SURFACE MOUNT ZENER DIODE DESCRIPTION The UTC BZT52CXXXS is surface mount zener diode. it uses UTC’s advanced technology to provide the customers with low leakage current, etc. The UTC BZT52CXXXS is suitable for automated assembly processes, etc. FEATURES * Low leakage current | UTC 友顺 | |||
SURFACE MOUNT ZENER DIODE DESCRIPTION The UTC BZT52CXXXS is surface mount zener diode. it uses UTC’s advanced technology to provide the customers with low leakage current, etc. The UTC BZT52CXXXS is suitable for automated assembly processes, etc. FEATURES * Low leakage current | UTC 友顺 | |||
封装/外壳:SC-76,SOD-323 包装:卷带(TR)剪切带(CT) 描述:DIODE ZENER 6.2V 200MW SOD323 分立半导体产品 二极管 - 齐纳 - 单 | DIODES 美台半导体 | |||
SURFACE MOUNT ZENER DIODE 文件:91.18 Kbytes Page:3 Pages | DIODES 美台半导体 | |||
Plastic-Encapsulated Diode FEATURES ⚫ Planar die construction ⚫ 200mW power dissipation on ceramic PBC ⚫ General purpose, medium current ⚫ AEC-Q101 qualified | SY 顺烨电子 | |||
0.5W 6.2V Zener diode 文件:496.332 Kbytes Page:3 Pages |
BZT52C6V2S产品属性
- 类型
描述
- 型号
BZT52C6V2S
- 功能描述
稳压二极管 6.2 Volt 200mW 5%
- RoHS
否
- 制造商
Vishay Semiconductors
- 齐纳电压
12 V
- 电压容差
5 %
- 电压温度系数
0.075 %/K
- 功率耗散
3 W
- 最大反向漏泄电流
3 uA
- 最大齐纳阻抗
7 Ohms
- 最大工作温度
+ 150 C
- 安装风格
SMD/SMT
- 封装/箱体
DO-214AC
- 封装
Reel
IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
---|---|---|---|---|---|---|---|
JJM |
2502 |
SOD-323 |
110 |
原装现货17377264928微信同号 |
|||
Diodes(美台) |
2511 |
标准封装 |
12000 |
电子元器件采购降本 30%!盈慧通原厂直采,砍掉中间差价 |
|||
DIODES/美台 |
23+ |
SOD323 |
50000 |
只做原装正品 |
|||
DiodesZetex |
23+ |
稳压二极管 |
5864 |
原装原标原盒 给价就出 全网最低 |
|||
DIODES/美台 |
24+ |
SOD-323 |
6000 |
全新原装深圳仓库现货有单必成 |
|||
DIODES/美台 |
24+ |
SOD-323 |
9600 |
原装现货,优势供应,支持实单! |
|||
长电 |
24+ |
SOD-323 |
80000 |
只做自己库存 全新原装进口正品假一赔百 可开13%增 |
|||
DIODES |
20+ |
SOD323 |
7820 |
原装 |
|||
24+ |
N/A |
64000 |
一级代理-主营优势-实惠价格-不悔选择 |
||||
DIODES |
23+ |
SOT |
7300 |
专注配单,只做原装进口现货 |
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BZT52C6V2S规格书下载地址
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