SURFACE MOUNT ZENER DIODE

Features • Planar Die Construction • Small Surface Mount Package • Ideally Suited for Automated Assembly Processes • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) • Halogen and Antimony Free. “Green” Device (Notes 3 & 4) • Qualified to AEC-Q101 Standards for High Reliabi

200 mW Zener Diodes 2.4 to 39 Volts

Features • Planar Die Construction • 200mW Power Dissipation on Ceramic PCB • General Purpose Medium Current • Ideally Suited for Automated Assembly Processes • Epoxy meets UL 94 V-0 flammability rating • Moisture Sensitivity Level 1 • Lead Free Finish/RoHS Compliant(P Suffix designates

Plastic-Encapsulate Transistors

ZENER DIODE FEATURES Power dissipation PD: 200 mW (Tamb=25℃) Forward Voltage VF: 0.9 V Operating and storage junction temperature range TJ, Tstg: -55℃ to +150℃

200mW SURFACE MOUNT ZENER DIODE

Features ● Planar Die Construction ● 200mW Power Dissipation ● 2.0V – 51V Nominal Zener Voltage ● 5 Standard Vz Tolerance ● Designed for Surface Mount Application ● Plastic Material – UL Recognition Flammability Classification 94V-0

200 mW Zener Diode 2.4 to 39 Volts

Features • Planar Die Construction • 200mW Power Dissipation on Ceramic PCB • General Purpose Medium Current • Ideally Suited for Automated Assembly Processes • Epoxy meets UL 94 V-0 flammability rating • Moisture Sensitivity Level 1 • Lead Free Finish/RoHS Compliant(P Suffix designates

Surface mount zener diode

FEATURES ● Planar die construction. ● General purpose, medium current. ● Ideally suited for automated assembly processes. APPLICATIONS ● Zener diode. ● Ultra-small surface mount package.

Plastic-Encapsulate Diodes

Plastic-Encapsulate Diodes FEATURES Planar die construction General purpose, Medium current Ideally suited for automated assembly processes Available in Lead free version

Planar Die Construction

Features • Planar Die Construction • Ultra-Small Surface Mount Package • Ideally suited for Automated Assembly Processes

Surface mount zener diode

FEATURES ● Planar die construction. ● General purpose, medium current. ● Ideally suited for automated assembly processes. APPLICATIONS ● Zener diode. ● Ultra-small surface mount package.

Surface Mount Zener Diodes

Features ● Planar Die Construction ● Ultra-Small Surface Mount Package ● Ideally Suited for Automated Assembly Processes

Surface mount zener diode

FEATURES ● Planar die construction. ● General purpose, medium current. ● Ideally suited for automated assembly processes. APPLICATIONS ● Zener diode. ● Ultra-small surface mount package.

ZENER DIODE

SOD-323 Plastic-Encapsulate Diodes FEATURES ● Planar die construction ● 200mW power dissipation on ceramic PBC ● General purpose, medium current ● Ideally suited for automated assembly processes ● Available in lead free version

Zener Diode in a SOD-123 Plastic Package.

Descriptions Zener Diode in a SOD-323 Plastic Package. Features 200mW Power dissipation, medium current, automated assembly processes. Applications 2.4V to 39V wide zener voltage range applications.

200mW, 5 Tolerance SMD Zener Diode

FEATURES - Wide zener voltage range selection : 2.4V to 75V - Surface Mount Device Type - VZ Tolerance Selection of ±5 - Matte Tin(Sn) lead finish with Nickel(Ni) underplate - Moisture sensitivity level 1 - Pb free and RoHS compliant - Green compound (Halogen free) with suffix G on pack

Surface mount zener diode

FEATURES ● Planar die construction. ● General purpose, medium current. ● Ideally suited for automated assembly processes. APPLICATIONS ● Zener diode. ● Ultra-small surface mount package.

Surface mount zener diode

Features • Planar die construction. • General purpose, medium current. • Ideally suited for automated assembly processes. • RoHS compliant package Applications • Zener diode. • Ultra-small surface mount package.SOD-323

ZENER DIODE

FEATURES ● Planar die construction. ● General purpose, medium current. ● Ideally suited for automated assembly processes. APPLICATIONS ● Zener diode. ● Ultra-small surface mount package.

丝印代码：WT；Plastic-Encapsulate Zener Diode

Features ● Low Zener Impedance ● 200mW; Power Dissipation of 200mW ● High Stability and High Reliability

200mW SURFACE MOUNT ZENER DIODE

Features ● Planar Die Construction ● 200mW Power Dissipation ● 2.0V – 51V Nominal Zener Voltage ● 5 Standard Vz Tolerance ● Designed for Surface Mount Application ● Plastic Material – UL Recognition Flammability Classification 94V-0

ZENER DIODE

FEATURES ● Planar die construction. ● General purpose, medium current. ● Ideally suited for automated assembly processes. APPLICATIONS ● Zener diode. ● Ultra-small surface mount package.

SURFACE MOUNT ZENER DIODE

Features • Planar Die Construction • Ultra-Small Surface Mount Package • Ideally suited for Automated Assembly Processes

SURFACE MOUNT SILICON ZENER DIODES

Features: • Planar Die Construction • 200mW Power Dissipation • 2.4-51V Nominal Zener Voltage • Ideally Suited for Automated Assembly Processes • In compliance with EU RoHS 2002/95/EC directives • This is a Pb − Free Device • All SMC parts are traceable to the wafer lot • Additional testin

200mW SURFACE MOUNT ZENER DIODE

Features: Power dissipation: Pd: 200mW (tamb=25°C) Forward Voltage: Vf: 0.9V Operating and storage junction temp. range: Tj, Tstg: -55°C to +150°C

丝印代码：WT；SURFACE MOUNT ZENER DIODE

Features • Planar Die Construction • Ultra-Small Surface Mount Package • Ideally suited for Automated Assembly Processes

丝印代码：WT；SOD-323 Plastic-Encapsulate Zener Diodes

Features Planar Die Construction General Purpose, Medium Current 200mW Power Dissipation On Ceramic PBC Ideally Suited for Automated Assembly Processes Available in Lead Free Version

丝印代码：WT；SURFACE MOUNT ZENER DIODES

FEATURES Planar die construction 200mW power dissipation on ceramic PBC General purpose, medium current Ideally suited for automated assembly processes Available in lead free version

SURFACE MOUNT SILICON ZENER DIODE

Description DIODE, ZENER 0.2W SOD-323

丝印代码：WT；Zener Diodes

■ Features ● Planar die construction ● 200mW power dissipation on ceramic PBC ● General purpose, medium current ● Ideally suited for automated assembly processes ● Available in lead free version

丝印代码：WT；PLASTIC-ENCAPSULATE ZENER DIODE

VOLTAGE 2.0~75 Volts POWER 200.0 mW FEATURES • Low Zener Impedance • Power Dissipation of 200mW • High Stability and High Reliability • Zener Voltage Tolerance: ± 5 MECHANICAL DATA • Case: SOD-123 Small Outline Plastic Package • Epoxy UL: 94V-0 • Polarity: Color band denotes cathode end

SURFACE MOUNT ZENER DIODE

封装/外壳：SC-76，SOD-323 包装：散装 描述：ZENER DIODE 39V 0.2W SOD-323 分立半导体产品 二极管 - 齐纳 - 单

丝印代码：WT；SURFACE MOUNT ZENER DIODE

文件：956.23 Kbytes Page：3 Pages

SOD323 Plastic-Encapsulate Diodes

文件：1.89514 Mbytes Page：5 Pages

丝印代码：WT；ZENER DIODE

文件：517.13 Kbytes Page：4 Pages

200mW SOD-323 SURFACE MOUNT

文件：298.29 Kbytes Page：4 Pages

200 mW Zener Diode 2.4 to 39 Volts

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200 mW Zener Diode 2.4 to 56 Volts

文件：272.9 Kbytes Page：4 Pages

ZENER DIODE

文件：237.7 Kbytes Page：3 Pages

丝印代码：WT；0.2W Zener Diode

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SURFACE MOUNT ZENER DIODE

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TECHNICAL SPECIFICATIONS OF SURFACE MOUNT ZENER DIODES

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丝印代码：WT；Zener Diodes

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SURFACE MOUNT ZENER DIODE

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5 Tolerance SMD Zener Diode

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SCHOTTKY DIODE Surface mount package ideally suited for automatic insertion

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SURFACE MOUNT ZENER DIODE

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Surface mount zener diode

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SURFACE MOUNT ZENER DIODE

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SURFACE MOUNT SILICON ZENER DIODES

文件：186.75 Kbytes Page：3 Pages

ZENER DIODE

Features · Constant voltage control · Wide voltage range selection 2.4V to 75V · Vz tolerance selection of ±2 (B series) · SOD-323F thin SMD package · RoHS compliant / Green EMC · Matte Tin (Sn) lead finish · Cathode band

包装：卷带（TR） 描述：DIODE ZENER 39V 200MW SOD323 分立半导体产品 二极管 - 齐纳 - 单

SURFACE MOUNT ZENER DIODE

文件：91.18 Kbytes Page：3 Pages

Zener Diode

小信号稳压管

丝印代码：WT；SURFACE MOUNT ZENER DIODE

Features • Planar Die Construction • 500mW Power Dissipation • General Purpose, Medium Current • Ideally Suited for Automated Assembly Processes • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) • Halogen and Antimony Free. “Green” Device (Notes 3 & 4) • Qualified to AEC-

410 mW Zener Diodes 2.4 to 39 Volts

Features • Planar Die Construction • 500mW Power Dissipation on Ceramic PCB • General Purpose Medium Current • Ideally Suited for Automated Assembly Processes • Epoxy meets UL 94 V-0 flammability rating • Moisture Sensitivity Level 1 • Lead Free Finish/RoHS Compliant(P Suffix designates RoH

Surface mount Zener Diodes

Features Sharp Zener voltage breakdown Low leakage current Compliant to RoHS (exemp. 7a) REACH, Conflict Minerals 1) Typical Applications Voltage stabilization and regulators (For overvoltage protection see TVS diodes SMF series) Commercial /industrial grade Su