Silicon Planar Zener Diodes

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SURFACE MOUNT ZENER DIODE

Features • Planar Die Construction • 500mW Power Dissipation • General Purpose, Medium Current • Ideally Suited for Automated Assembly Processes • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) • Halogen and Antimony Free. “Green” Device (Notes 3 & 4) • Qualified to AEC-

Small Signal Zener Diodes

Features • Silicon planar power zener diodes • These diodes are also available in other case styles and other configurations including: the SOT-23 case with type designation BZX84 series, the dual zener diode common anode configuration in the SOT-23 case with type designation AZ23 series and the

1/2 Watt ZEBER DIODES Planar Die Construction

Features: * Planar Die Construction * 500mW Power Dissipation on Ceramic PCB * General Purpose Medium Current * Ideally Suited for Automated Assembly Process

Surface mount zener diode

FEATURES ● Planar die construction. ● 500mW power dissipation on ceramic PCB. ● General purpose, medium current. ● Ideally suited for automated assembly processes. APPLICATIONS ● Zener diode. ● Ultra-small surface mount package.

500mW SOD-123 Surface Mount Zener Diodes

FEATURES ● Standard Zener Breakdown Voltage Range: 2.4V to 43V ● Steady State Power Rating of 500 mW ● Small Body Outline Dimensions: 3.70 mm x 1.60 mm ● Low Body Height: 1.05 mm ● Package Weight: 10.00 mg / unit ● ESD Rating of Class 3 ( > 16 KV ) per Human Body Model

ZENER DIODE

ZENER DIODE FEATURES： ● Planar Die Construction ● 350mW Power Dissipation on Ceramic PCB ● General Purpose, Medium Current ● Ideally Suited for Automated Assembly Processes ● Available in Lead Free Version

Surface mount zener diode

FEATURES ● Planar die construction. ● 500mW power dissipation on ceramic PCB. ● General purpose, medium current. ● Ideally suited for automated assembly processes. APPLICATIONS ● Zener diode. ● Ultra-small surface mount package.

Small Signal Zener Diodes

FEATURES • Silicon planar Zener diodes • The Zener voltages are graded according to    the international E24 standard • AEC-Q101 qualified available • ESD capability according to AEC-Q101:    Human body model > 8 kV    Machine model > 800 V • Base P/N-E3 - RoHS-compliant, commercial   

Small Signal Zener Diodes

Features • Silicon planar power zener diodes • These diodes are also available in other case styles and other configurations including: the SOT-23 case with type designation BZX84 series, the dual zener diode common anode configuration in the SOT-23 case with type designation AZ23 series and the

ZENER DIODE

SOD-123 Plastic-Encapsulate Diode ZENER DIODE FEATURES • Planar Die Construction • 500mW Power Dissipation on Ceramic PCB • General Purpose Medium Current • Ideally Suited for Automated Assembly Processes • High temperature soldering : 260°C / 10 seconds at terminals • Pb free product

Surface mount zener diode

FEATURES ● Planar die construction. ● 500mW power dissipation on ceramic PCB. ● General purpose, medium current. ● Ideally suited for automated assembly processes. APPLICATIONS ● Zener diode. ● Ultra-small surface mount package.

Small Signal Zener Diodes

Features • Silicon planar power zener diodes • These diodes are also available in other case styles and other configurations including: the SOT-23 case with type designation BZX84 series, the dual zener diode common anode configuration in the SOT-23 case with type designation AZ23 series and the

Small Signal Zener Diodes

Features • Silicon planar power zener diodes • These diodes are also available in other case styles and other configurations including: the SOT-23 case with type designation BZX84 series, the dual zener diode common anode configuration in the SOT-23 case with type designation AZ23 series and the

SURFACE MOUNT ZENER DIODE

Features • Planar Die Construction • 500mW Power Dissipation • General Purpose, Medium Current • Ideally Suited for Automated Assembly Processes • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) • Halogen and Antimony Free. “Green” Device (Notes 3 & 4) • Qualified to AEC-

SOD-123 Plastic-Encapsulate Zener Diodes

Features Planar Die Construction 350mW Power Dissipation on Ceramic PCB General Purpose, Medium Current Ideally Suited for Automated Assembly Processes Available in Lead Free Version

SURFACE MOUNT ZENER DIODES

FEATURES： Planar Die Construction 500mW Power Dissipation on Ceramic PCB General Purpose, Medium Current Ideally Suited for Automated Assembly Processes Available in Lead Free Version

500mW SURFACE MOUNT ZENER DIODE

Planar Die Construction 500mW Power Dissipation 2.0V – 51V Nominal Zener Voltage 5% Standard Vz Tolerance Designed for Surface Mount Application Plastic Material – UL Recognition Flammability Classification 94V-0

ZENER DIODE 500mW, ZENER VOLTAGE 2.0V TO 75V

DESCRIPTION The BZT52C2V0~BZT52C75 are available in SOD-123 Package. FEATURES  Total power dissipation: Max. 500mW.  Wide zener reverse voltage range 2.0V to 75V.  Small plastic package suitable for surface mounted design.  Tolerance approximately±5%  Available in SOD-123 Package

500m Watt Zener Voltage Regulators |

Features | o Low Zener Impedance. « Power Dissipation of 500mW « High Stability and High Reliability « Halogen free and RoHS compliant o SOD123 surface mount package |

410 mW Zener Diodes 2.4 to 39 Volts

Features • Planar Die Construction • 500mW Power Dissipation on Ceramic PCB • General Purpose Medium Current • Ideally Suited for Automated Assembly Processes • Epoxy meets UL 94 V-0 flammability rating • Moisture Sensitivity Level 1 • Lead Free Finish/RoHS Compliant(P Suffix designates RoH

Surface mount Zener Diodes

Features Sharp Zener voltage breakdown Low leakage current Compliant to RoHS (exemp. 7a) REACH, Conflict Minerals 1) Typical Applications Voltage stabilization and regulators (For overvoltage protection see TVS diodes SMF series) Commercial /industrial grade Su

SURFACE MOUNT ZENER DIODE

Features • Planar Die Construction • 500mW Power Dissipation • General Purpose, Medium Current • Ideally Suited for Automated Assembly Processes • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) • Halogen and Antimony Free. “Green” Device (Notes 3 & 4) • Qualified to AEC-

Surface Mount Zener Diodes

Features: * 500mw Power Dissipation * Ideal for Surface Mountted Application * Zener Breakdown Voltage Range 2.4V to 51V

SURFACE MOUNT SILICON ZENER DIODES

SURFACE MOUNT SILICON ZENER DIODES

Surface mount zener diode

FEATURES ● Planar die construction. ● 500mW power dissipation on ceramic PCB. ● General purpose, medium current. ● Ideally suited for automated assembly processes. ● The Plastic Material Carries U/L Recognition 94V-0. APPLICATIONS ● Zener diode. ● Ultra-small surface mount package.

Surface Mount Zener Diode

FEATURES ● Standard Zener Breakdown Voltage Range: 2.4V to 43V ● Steady State Power Rating of 500 mW ● Small Body Outline Dimensions: 3.70 mm x 1.60 mm ● Low Body Height: 1.05 mm ● Package Weight: 10.00 mg / unit ● ESD Rating of Class 3 ( > 16 KV ) per Human Body Model

Surface Mount Zener Diodes

Features ● Planar Die Construction ● 500mW Power Dissipation on Ceramic PCB ● General Purpose, Medium Current

SILICON PLANAR ZENER DIODES

Features • Ideally Suited for Automated Assembly Processes • Total power dissipation: max. 500 mW

500mW, 5 Tolerance SMD Zener Diode

FEATURES - Wide zener voltage range selection : 2.4V to 75V - Surface Mount Device Type - Moisture sensitivity level 1 - Pb free and RoHS compliant - Green compound (Halogen free) with suffix G on packing code and prefix G on date code - VZ Tolerance Selection of ±5 - Matte Tin(Sn) lead fin

Surface mount zener diode

FEATURES ● Planar die construction. ● 500mW power dissipation on ceramic PCB. ● General purpose, medium current. ● Ideally suited for automated assembly processes. APPLICATIONS ● Zener diode. ● Ultra-small surface mount package.

Surface mount zener diode

FEATURES ● Planar die construction. ● 500mW power dissipation on ceramic PCB. ● General purpose, medium current. ● Ideally suited for automated assembly processes. ● The Plastic Material Carries U/L Recognition 94V-0. APPLICATIONS ● Zener diode. ● Ultra-small surface mount package.

410mW SURFACE MOUNT ZENER DIODE

500mW SURFACE MOUNT ZENER DIODE Features ● Planar Die Construction ● 500mW Power Dissipation ● 2.0V – 51V Nominal Zener Voltage ● 5 Standard Vz Tolerance ● Designed for Surface Mount Application ● Plastic Material – UL Recognition Flammability Classification 94V-0

Surface mount Silicon Planar Zener Diodes Silizium-Planar-Zener-Dioden fur die Oberflahenmontage

Features Sharp Zener voltage breakdown Low leakage current Compliant to RoHS (exemp. 7a) REACH, Conflict Minerals 1) Typical Applications Voltage stabilization and regulators (For overvoltage protection see TVS diodes SMF series) Commercial /industrial grade Su

410mW Two Terminals SMD Zener Diodes

410mW Two Terminals SMD Zener Diodes Features • Planar Die Construction • 410mW Power Dissipation • Zener Voltage 2.4v to 51v • RoHS Compliance

SURFACE MOUNT ZENER DIODE

Features ● Planar Die Construction ● 500mW Power Dissipation on Ceramic PCB ● General Purpose, Medium Current ● Ideally Suited for Automated Assembly Processes

SURFACE MOUNT ZENER DIODE

Features • Planar Die Construction • 500mW Power Dissipation • General Purpose, Medium Current • Ideally Suited for Automated Assembly Processes • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) • Halogen and Antimony Free. “Green” Device (Notes 3 & 4) • Qualified to AEC-

410mW Two Terminals SMD Zener Diodes

Features • Planar Die Construction • 410mW Power Dissipation • Zener Voltage 2.4v to 51v • RoHS Compliance

200mW,Surface Mount Zener Diode

FEATURES - Wide zener voltage range selection : 2.4V to 75V - Surface Mount Device type - Moisture sensitivity level 1 - Pb free and RoHS compliant - Green compound (Halogen free) with suffix G on packing code and prefix G on date code - Matte Tin(Sn) lead finish with Nickel(Ni) underplate

200mW,Surface Mount Zener Diode

FEATURES - Wide zener voltage range selection : 2.4V to 75V - Surface Mount Device type - Moisture sensitivity level 1 - Pb free and RoHS compliant - Green compound (Halogen free) with suffix G on packing code and prefix G on date code - Matte Tin(Sn) lead finish with Nickel(Ni) underplate

250 mW Zener Diode 2.4 to 39 Volts

Features • Ultra-Small Leadless Surface Mount Package • Ideally Suited fou Automated Assembly Processes • Epoxy meets UL 94 V-0 flammability rating • Moisture Sensitivity Level 1 • Lead Free Finish/Rohs Compliant (PSuffix designates RoHS Compliant. See ordering information) • Halogen free av

SURFACE MOUNT ZENER DIODE

Features • Ultra-Small Leadless Surface Mount Package • Ideally Suited for Automated Assembly Processes • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) • Halogen and Antimony Free. “Green” Device (Note 3)

Ultra-Small Leadless Surface Mount Package Ideally Suited for Automated Assembly Processes

Features • Ultra-Small Leadless Surface Mount Package • Ideally Suited for Automated Assembly Processes • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) • Halogen and Antimony Free. “Green” Device (Note 3)

SURFACE MOUNT ZENER DIODE

Features • Ultra-Small Leadless Surface Mount Package • Ideally Suited for Automated Assembly Processes • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) • Halogen and Antimony Free. “Green” Device (Note 3)

200 mW Zener Diodes 2.4 to 39 Volts

Features • Planar Die Construction • 200mW Power Dissipation on Ceramic PCB • General Purpose Medium Current • Ideally Suited for Automated Assembly Processes • Epoxy meets UL 94 V-0 flammability rating • Moisture Sensitivity Level 1 • Lead Free Finish/RoHS Compliant(P Suffix designates

Surface mount zener diode

FEATURES ● Planar die construction. ● General purpose, medium current. ● Ideally suited for automated assembly processes. APPLICATIONS ● Zener diode. ● Ultra-small surface mount package.

200mW SURFACE MOUNT ZENER DIODE

Features ● Planar Die Construction ● 200mW Power Dissipation ● 2.0V – 51V Nominal Zener Voltage ● 5 Standard Vz Tolerance ● Designed for Surface Mount Application ● Plastic Material – UL Recognition Flammability Classification 94V-0

SURFACE MOUNT ZENER DIODE

Features • Planar Die Construction • Ultra-Small Surface Mount Package • Ideally suited for Automated Assembly Processes

Zener Diodes

■ Features ● Planar die construction ● 200mW power dissipation on ceramic PBC ● General purpose, medium current ● Ideally suited for automated assembly processes ● Available in lead free version

SOD-323 Plastic-Encapsulate Zener Diodes

Features Planar Die Construction General Purpose, Medium Current 200mW Power Dissipation On Ceramic PBC Ideally Suited for Automated Assembly Processes Available in Lead Free Version

SURFACE MOUNT ZENER DIODES

FEATURES Planar die construction 200mW power dissipation on ceramic PBC General purpose, medium current Ideally suited for automated assembly processes Available in lead free version

SURFACE MOUNT ZENER DIODE

Features • Planar Die Construction • Small Surface Mount Package • Ideally Suited for Automated Assembly Processes • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) • Halogen and Antimony Free. “Green” Device (Notes 3 & 4) • Qualified to AEC-Q101 Standards for High Reliabi

Surface mount zener diode

FEATURES ● Planar die construction. ● General purpose, medium current. ● Ideally suited for automated assembly processes. APPLICATIONS ● Zener diode. ● Ultra-small surface mount package.

200mW, 5 Tolerance SMD Zener Diode

FEATURES - Wide zener voltage range selection : 2.4V to 75V - Surface Mount Device Type - VZ Tolerance Selection of ±5 - Matte Tin(Sn) lead finish with Nickel(Ni) underplate - Moisture sensitivity level 1 - Pb free and RoHS compliant - Green compound (Halogen free) with suffix G on pack

Surface Mount Zener Diodes

Features ● Planar Die Construction ● Ultra-Small Surface Mount Package ● Ideally Suited for Automated Assembly Processes

Surface mount zener diode

FEATURES ● Planar die construction. ● General purpose, medium current. ● Ideally suited for automated assembly processes. APPLICATIONS ● Zener diode. ● Ultra-small surface mount package.

SURFACE MOUNT SILICON ZENER DIODES

Features: • Planar Die Construction • 200mW Power Dissipation • 2.4-51V Nominal Zener Voltage • Ideally Suited for Automated Assembly Processes • In compliance with EU RoHS 2002/95/EC directives • This is a Pb − Free Device • All SMC parts are traceable to the wafer lot • Additional testin

ZENER DIODE

FEATURES ● Planar die construction. ● General purpose, medium current. ● Ideally suited for automated assembly processes. APPLICATIONS ● Zener diode. ● Ultra-small surface mount package.

Plastic-Encapsulate Diodes

Plastic-Encapsulate Diodes FEATURES Planar die construction General purpose, Medium current Ideally suited for automated assembly processes Available in Lead free version

SURFACE MOUNT ZENER DIODE

Features • Planar Die Construction • Ultra-Small Surface Mount Package • Ideally suited for Automated Assembly Processes