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BZT52C价格
参考价格:¥0.1383
型号:BZT52C10 品牌:Taiwan Semi 备注:这里有BZT52C多少钱,2025年最近7天走势,今日出价,今日竞价,BZT52C批发/采购报价,BZT52C行情走势销售排行榜,BZT52C报价。型号 | 功能描述 | 生产厂家&企业 | LOGO | 操作 |
---|---|---|---|---|
BZT52C | SURFACE MOUNT SILICON ZENER DIODES SURFACE MOUNT SILICON ZENER DIODES | CDIL | ||
BZT52C | 500mW SOD-123 Surface Mount Zener Diodes FEATURES ● Standard Zener Breakdown Voltage Range: 2.4V to 43V ● Steady State Power Rating of 500 mW ● Small Body Outline Dimensions: 3.70 mm x 1.60 mm ● Low Body Height: 1.05 mm ● Package Weight: 10.00 mg / unit ● ESD Rating of Class 3 ( > 16 KV ) per Human Body Model | SECOSSeCoS Halbleitertechnologie GmbH 喜可士喜可士股份有限公司 | ||
BZT52C | ZENER DIODES 文件:285.51 Kbytes Page:3 Pages | HOTTECHGuangdong Hottech Co. Ltd. 合科泰深圳市合科泰电子有限公司 | ||
BZT52C | 0.5W Zener Diodes 文件:143.07 Kbytes Page:3 Pages | LUGUANG 鲁光电子 | ||
BZT52C | SILICON PLANAR ZENER DIODES 文件:230.1 Kbytes Page:3 Pages | DAYA 大亚电器集团 | ||
BZT52C | Surface Mount Zener Diodes 文件:685.47 Kbytes Page:4 Pages | SECELECTRONICS | ||
BZT52C | Plastic-Encapsulate Zener Diode 文件:539.27 Kbytes Page:4 Pages | DYELECDIYI Electronic Technology Co., Ltd. 迪一电子山东迪一电子科技有限公司 | ||
SURFACE MOUNT ZENER DIODE Features • Planar Die Construction • 500mW Power Dissipation • General Purpose, Medium Current • Ideally Suited for Automated Assembly Processes • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) • Halogen and Antimony Free. “Green” Device (Notes 3 & 4) • Qualified to AEC- | DIODES 美台半导体 | |||
SURFACE MOUNT ZENER DIODE Features • Planar Die Construction • 500mW Power Dissipation • General Purpose, Medium Current • Ideally Suited for Automated Assembly Processes • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) • Halogen and Antimony Free. “Green” Device (Notes 3 & 4) • Qualified to AEC- | DIODES 美台半导体 | |||
SURFACE MOUNT SILICON ZENER DIODES SURFACE MOUNT SILICON ZENER DIODES | CDIL | |||
Surface Mount Zener Diodes Features: * 500mw Power Dissipation * Ideal for Surface Mountted Application * Zener Breakdown Voltage Range 2.4V to 51V | WEITRON | |||
410mW SURFACE MOUNT ZENER DIODE 500mW SURFACE MOUNT ZENER DIODE Features ● Planar Die Construction ● 500mW Power Dissipation ● 2.0V – 51V Nominal Zener Voltage ● 5 Standard Vz Tolerance ● Designed for Surface Mount Application ● Plastic Material – UL Recognition Flammability Classification 94V-0 | WTEWon-Top Electronics 毅星電子毅星电子股份有限公司 | |||
Surface mount Silicon Planar Zener Diodes Silizium-Planar-Zener-Dioden fur die Oberflahenmontage Features Sharp Zener voltage breakdown Low leakage current Compliant to RoHS (exemp. 7a) REACH, Conflict Minerals 1) Typical Applications Voltage stabilization and regulators (For overvoltage protection see TVS diodes SMF series) Commercial /industrial grade Su | Diotec 德欧泰克 | |||
410mW Two Terminals SMD Zener Diodes 410mW Two Terminals SMD Zener Diodes Features • Planar Die Construction • 410mW Power Dissipation • Zener Voltage 2.4v to 51v • RoHS Compliance | TAITRON | |||
SILICON PLANAR ZENER DIODES Features • Ideally Suited for Automated Assembly Processes • Total power dissipation: max. 500 mW | SEMTECH_ELEC 先之科半导体 | |||
Surface Mount Zener Diodes Features ● Planar Die Construction ● 500mW Power Dissipation on Ceramic PCB ● General Purpose, Medium Current | KEXIN 科信电子 | |||
Surface Mount Zener Diode FEATURES ● Standard Zener Breakdown Voltage Range: 2.4V to 43V ● Steady State Power Rating of 500 mW ● Small Body Outline Dimensions: 3.70 mm x 1.60 mm ● Low Body Height: 1.05 mm ● Package Weight: 10.00 mg / unit ● ESD Rating of Class 3 ( > 16 KV ) per Human Body Model | SECOSSeCoS Halbleitertechnologie GmbH 喜可士喜可士股份有限公司 | |||
Surface mount zener diode FEATURES ● Planar die construction. ● 500mW power dissipation on ceramic PCB. ● General purpose, medium current. ● Ideally suited for automated assembly processes. APPLICATIONS ● Zener diode. ● Ultra-small surface mount package. | SY 顺烨电子 | |||
Surface mount zener diode FEATURES ● Planar die construction. ● 500mW power dissipation on ceramic PCB. ● General purpose, medium current. ● Ideally suited for automated assembly processes. ● The Plastic Material Carries U/L Recognition 94V-0. APPLICATIONS ● Zener diode. ● Ultra-small surface mount package. | BILIN 银河微电 | |||
410 mW Zener Diodes 2.4 to 39 Volts Features • Planar Die Construction • 500mW Power Dissipation on Ceramic PCB • General Purpose Medium Current • Ideally Suited for Automated Assembly Processes • Epoxy meets UL 94 V-0 flammability rating • Moisture Sensitivity Level 1 • Lead Free Finish/RoHS Compliant(P Suffix designates RoH | MCC 美微科 | |||
Surface mount Zener Diodes Features Sharp Zener voltage breakdown Low leakage current Compliant to RoHS (exemp. 7a) REACH, Conflict Minerals 1) Typical Applications Voltage stabilization and regulators (For overvoltage protection see TVS diodes SMF series) Commercial /industrial grade Su | Diotec 德欧泰克 | |||
Surface mount zener diode FEATURES ● Planar die construction. ● 500mW power dissipation on ceramic PCB. ● General purpose, medium current. ● Ideally suited for automated assembly processes. ● The Plastic Material Carries U/L Recognition 94V-0. APPLICATIONS ● Zener diode. ● Ultra-small surface mount package. | BILIN 银河微电 | |||
500mW, 5 Tolerance SMD Zener Diode FEATURES - Wide zener voltage range selection : 2.4V to 75V - Surface Mount Device Type - Moisture sensitivity level 1 - Pb free and RoHS compliant - Green compound (Halogen free) with suffix G on packing code and prefix G on date code - VZ Tolerance Selection of ±5 - Matte Tin(Sn) lead fin | TSC 台湾半导体 | |||
SURFACE MOUNT ZENER DIODE Features ● Planar Die Construction ● 500mW Power Dissipation on Ceramic PCB ● General Purpose, Medium Current ● Ideally Suited for Automated Assembly Processes | DIOTECH | |||
Small Signal Zener Diodes Features • Silicon planar power zener diodes • These diodes are also available in other case styles and other configurations including: the SOT-23 case with type designation BZX84 series, the dual zener diode common anode configuration in the SOT-23 case with type designation AZ23 series and the | VishayVishay Siliconix 威世科技威世科技半导体 | |||
SURFACE MOUNT ZENER DIODE Features • Planar Die Construction • 500mW Power Dissipation • General Purpose, Medium Current • Ideally Suited for Automated Assembly Processes • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) • Halogen and Antimony Free. “Green” Device (Notes 3 & 4) • Qualified to AEC- | DIODES 美台半导体 | |||
Small Signal Zener Diodes Features • Silicon planar power zener diodes • These diodes are also available in other case styles and other configurations including: the SOT-23 case with type designation BZX84 series, the dual zener diode common anode configuration in the SOT-23 case with type designation AZ23 series and the | VishayVishay Siliconix 威世科技威世科技半导体 | |||
500mW SURFACE MOUNT ZENER DIODE 500mW SURFACE MOUNT ZENER DIODE Features ● Planar Die Construction ● 500mW Power Dissipation ● 2.0V – 51V Nominal Zener Voltage ● 5 Standard Vz Tolerance ● Designed for Surface Mount Application ● Plastic Material – UL Recognition Flammability Classification 94V-0 | WTEWon-Top Electronics 毅星電子毅星电子股份有限公司 | |||
Small Signal Zener Diodes Features • Silicon planar power zener diodes • These diodes are also available in other case styles and other configurations including: the SOT-23 case with type designation BZX84 series, the dual zener diode common anode configuration in the SOT-23 case with type designation AZ23 series and the | VishayVishay Siliconix 威世科技威世科技半导体 | |||
500mW SOD-123 Surface Mount Zener Diodes FEATURES ● Standard Zener Breakdown Voltage Range: 2.4V to 43V ● Steady State Power Rating of 500 mW ● Small Body Outline Dimensions: 3.70 mm x 1.60 mm ● Low Body Height: 1.05 mm ● Package Weight: 10.00 mg / unit ● ESD Rating of Class 3 ( > 16 KV ) per Human Body Model | SECOSSeCoS Halbleitertechnologie GmbH 喜可士喜可士股份有限公司 | |||
Surface mount zener diode FEATURES ● Planar die construction. ● 500mW power dissipation on ceramic PCB. ● General purpose, medium current. ● Ideally suited for automated assembly processes. APPLICATIONS ● Zener diode. ● Ultra-small surface mount package. | CHENDA 辰达半导体 | |||
1/2 Watt ZEBER DIODES Planar Die Construction Features: * Planar Die Construction * 500mW Power Dissipation on Ceramic PCB * General Purpose Medium Current * Ideally Suited for Automated Assembly Process | FCI 戈采 | |||
Surface mount zener diode FEATURES ● Planar die construction. ● 500mW power dissipation on ceramic PCB. ● General purpose, medium current. ● Ideally suited for automated assembly processes. APPLICATIONS ● Zener diode. ● Ultra-small surface mount package. | DSK | |||
ZENER DIODE SOD-123 Plastic-Encapsulate Diode ZENER DIODE FEATURES • Planar Die Construction • 500mW Power Dissipation on Ceramic PCB • General Purpose Medium Current • Ideally Suited for Automated Assembly Processes • High temperature soldering : 260°C / 10 seconds at terminals • Pb free product | YEASHIN 亚昕科技 | |||
Small Signal Zener Diodes Features • Silicon planar power zener diodes • These diodes are also available in other case styles and other configurations including: the SOT-23 case with type designation BZX84 series, the dual zener diode common anode configuration in the SOT-23 case with type designation AZ23 series and the | VishayVishay Siliconix 威世科技威世科技半导体 | |||
Surface mount zener diode FEATURES ● Planar die construction. ● 500mW power dissipation on ceramic PCB. ● General purpose, medium current. ● Ideally suited for automated assembly processes. APPLICATIONS ● Zener diode. ● Ultra-small surface mount package. | CHENDA 辰达半导体 | |||
Small Signal Zener Diodes FEATURES • Silicon planar Zener diodes • The Zener voltages are graded according to the international E24 standard • AEC-Q101 qualified available • ESD capability according to AEC-Q101: Human body model > 8 kV Machine model > 800 V • Base P/N-E3 - RoHS-compliant, commercial | VishayVishay Siliconix 威世科技威世科技半导体 | |||
500mW SURFACE MOUNT ZENER DIODE Planar Die Construction 500mW Power Dissipation 2.0V – 51V Nominal Zener Voltage 5% Standard Vz Tolerance Designed for Surface Mount Application Plastic Material – UL Recognition Flammability Classification 94V-0 | WTEWon-Top Electronics 毅星電子毅星电子股份有限公司 | |||
SURFACE MOUNT ZENER DIODES FEATURES: Planar Die Construction 500mW Power Dissipation on Ceramic PCB General Purpose, Medium Current Ideally Suited for Automated Assembly Processes Available in Lead Free Version | SY 顺烨电子 | |||
SOD-123 Plastic-Encapsulate Zener Diodes Features Planar Die Construction 350mW Power Dissipation on Ceramic PCB General Purpose, Medium Current Ideally Suited for Automated Assembly Processes Available in Lead Free Version | UNSEMI 优恩半导体 | |||
ZENER DIODE 500mW, ZENER VOLTAGE 2.0V TO 75V DESCRIPTION The BZT52C2V0~BZT52C75 are available in SOD-123 Package. FEATURES Total power dissipation: Max. 500mW. Wide zener reverse voltage range 2.0V to 75V. Small plastic package suitable for surface mounted design. Tolerance approximately±5% Available in SOD-123 Package | AITSEMI 创瑞科技 | |||
500m Watt Zener Voltage Regulators | Features | o Low Zener Impedance. « Power Dissipation of 500mW « High Stability and High Reliability « Halogen free and RoHS compliant o SOD123 surface mount package | | TECHPUBLIC 台舟电子 | |||
ZENER DIODE ZENER DIODE FEATURES: ● Planar Die Construction ● 350mW Power Dissipation on Ceramic PCB ● General Purpose, Medium Current ● Ideally Suited for Automated Assembly Processes ● Available in Lead Free Version | JIANGSU 长电科技 | |||
SURFACE MOUNT ZENER DIODE Features • Planar Die Construction • 500mW Power Dissipation • General Purpose, Medium Current • Ideally Suited for Automated Assembly Processes • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) • Halogen and Antimony Free. “Green” Device (Notes 3 & 4) • Qualified to AEC- | DIODES 美台半导体 | |||
iMOTION™ Modular Application Design Kit Eval-M1-CM610N3 is an evaluation board formotor drive applications based on a 3-phase IPM. Combined in a kit with one of the available MADK control board options, it demonstrates Infineon's IPM technology formotor drives. The kit demonstrates Infineon’s IPM technology formotor drives. Main feat | Infineon 英飞凌 | |||
iMOTION™ Modular Application Design Kit Eval-M3-CM615PN is an evaluation board for motor drive applications with single phase PFC integrated 3 phase IPM. Combined in a kit with one of the available MADK control board options, it demonstrates Infineon’s motion control IC and IPM technology for motor drives with single phase PFC. Main | Infineon 英飞凌 | |||
410mW Two Terminals SMD Zener Diodes Features • Planar Die Construction • 410mW Power Dissipation • Zener Voltage 2.4v to 51v • RoHS Compliance | TAITRON | |||
200mW,Surface Mount Zener Diode FEATURES - Wide zener voltage range selection : 2.4V to 75V - Surface Mount Device type - Moisture sensitivity level 1 - Pb free and RoHS compliant - Green compound (Halogen free) with suffix G on packing code and prefix G on date code - Matte Tin(Sn) lead finish with Nickel(Ni) underplate | TSC 台湾半导体 | |||
200mW,Surface Mount Zener Diode FEATURES - Wide zener voltage range selection : 2.4V to 75V - Surface Mount Device type - Moisture sensitivity level 1 - Pb free and RoHS compliant - Green compound (Halogen free) with suffix G on packing code and prefix G on date code - Matte Tin(Sn) lead finish with Nickel(Ni) underplate | TSC 台湾半导体 | |||
SURFACE MOUNT ZENER DIODE Features • Ultra-Small Leadless Surface Mount Package • Ideally Suited for Automated Assembly Processes • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) • Halogen and Antimony Free. “Green” Device (Note 3) | DIODES 美台半导体 | |||
250 mW Zener Diode 2.4 to 39 Volts Features • Ultra-Small Leadless Surface Mount Package • Ideally Suited fou Automated Assembly Processes • Epoxy meets UL 94 V-0 flammability rating • Moisture Sensitivity Level 1 • Lead Free Finish/Rohs Compliant (PSuffix designates RoHS Compliant. See ordering information) • Halogen free av | MCC 美微科 | |||
Ultra-Small Leadless Surface Mount Package Ideally Suited for Automated Assembly Processes Features • Ultra-Small Leadless Surface Mount Package • Ideally Suited for Automated Assembly Processes • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) • Halogen and Antimony Free. “Green” Device (Note 3) | DIODES 美台半导体 | |||
SURFACE MOUNT ZENER DIODE Features • Ultra-Small Leadless Surface Mount Package • Ideally Suited for Automated Assembly Processes • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) • Halogen and Antimony Free. “Green” Device (Note 3) | DIODES 美台半导体 | |||
SURFACE MOUNT ZENER DIODE Features • Planar Die Construction • Small Surface Mount Package • Ideally Suited for Automated Assembly Processes • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) • Halogen and Antimony Free. “Green” Device (Notes 3 & 4) • Qualified to AEC-Q101 Standards for High Reliabi | DIODES 美台半导体 | |||
200 mW Zener Diodes 2.4 to 39 Volts Features • Planar Die Construction • 200mW Power Dissipation on Ceramic PCB • General Purpose Medium Current • Ideally Suited for Automated Assembly Processes • Epoxy meets UL 94 V-0 flammability rating • Moisture Sensitivity Level 1 • Lead Free Finish/RoHS Compliant(P Suffix designates | MCC 美微科 | |||
Surface Mount Zener Diodes Features ● Planar Die Construction ● Ultra-Small Surface Mount Package ● Ideally Suited for Automated Assembly Processes | KEXIN 科信电子 | |||
200mW, 5 Tolerance SMD Zener Diode FEATURES - Wide zener voltage range selection : 2.4V to 75V - Surface Mount Device Type - VZ Tolerance Selection of ±5 - Matte Tin(Sn) lead finish with Nickel(Ni) underplate - Moisture sensitivity level 1 - Pb free and RoHS compliant - Green compound (Halogen free) with suffix G on pack | TSC 台湾半导体 | |||
Surface mount zener diode FEATURES ● Planar die construction. ● General purpose, medium current. ● Ideally suited for automated assembly processes. APPLICATIONS ● Zener diode. ● Ultra-small surface mount package. | SY 顺烨电子 | |||
Surface mount zener diode FEATURES ● Planar die construction. ● General purpose, medium current. ● Ideally suited for automated assembly processes. APPLICATIONS ● Zener diode. ● Ultra-small surface mount package. | BILIN 银河微电 | |||
SURFACE MOUNT SILICON ZENER DIODES Features: • Planar Die Construction • 200mW Power Dissipation • 2.4-51V Nominal Zener Voltage • Ideally Suited for Automated Assembly Processes • In compliance with EU RoHS 2002/95/EC directives • This is a Pb − Free Device • All SMC parts are traceable to the wafer lot • Additional testin | SMCSangdest Microelectronic (Nanjing) Co., Ltd 烧结金属 |
BZT52C产品属性
- 类型
描述
- 型号
BZT52C
- 制造商
DAYA
- 制造商全称
DAYA
- 功能描述
SILICON PLANAR ZENER DIODES
IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
---|---|---|---|---|---|---|---|
Vishay(威世) |
24+ |
标准封装 |
13048 |
原厂直销,大量现货库存,交期快。价格优,支持账期 |
|||
DIODES |
24+ |
SOD523 |
9524 |
原厂直供,支持账期,免费供样,技术支持 |
|||
PANJIT |
2016+ |
SOD323 |
5740 |
只做原装,假一罚十,公司可开17%增值税发票! |
|||
RAMTRON |
23+ |
SOIC8 |
12000 |
全新原装假一赔十 |
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DIODES |
24+ |
SOD523 |
80000 |
只做自己库存 全新原装进口正品假一赔百 可开13%增 |
|||
DIODES |
24+ |
SOD123 |
20000 |
全新原厂原装,进口正品现货,正规渠道可含税!! |
|||
CJ |
15+ |
SOD323 |
0 |
原装现货价格有优势量大可以发货 |
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DIODES/美台 |
25+ |
SOD123 |
54648 |
百分百原装现货 实单必成 欢迎询价 |
|||
DIODES/美台 |
22+ |
SOD123 |
100000 |
代理渠道/只做原装/可含税 |
|||
VISHAY |
24+/25+ |
SOD-123(PMDU) |
15000 |
原装正品现货库存价优 |
BZT52C芯片相关品牌
BZT52C规格书下载地址
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- BZT5264
- BZT5263
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DdatasheetPDF页码索引
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