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| 型号 | 功能描述 | 生产厂家 企业 | LOGO | 操作 |
|---|---|---|---|---|
BYWF29-200HE3SLASH45 | Ultrafast Rectifier FEATURES • Power pack • Glass passivated pellet chip junction • Ultrafast recovery time • Low switching losses, high efficiency • Low forward voltage drop • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package) • Solder dip 2 | VISHAYVishay Siliconix 威世威世科技公司 |   | |
BYWF29-200HE3SLASH45 | Ultrafast Rectifier • Power pack • Glass passivated pallet chip junction • Ultrafast recovery time • Low switching losses, high efficiency • Low forward voltage drop • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package) • Solder dip 275 °C max. 10 | VISHAYVishay Siliconix 威世威世科技公司 | | |
Ultrafast Rectifier FEATURES • Power pack • Glass passivated pellet chip junction • Ultrafast recovery time • Low switching losses, high efficiency • Low forward voltage drop • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package) • Solder dip 2 | VISHAYVishay Siliconix 威世威世科技公司 | | ||
Ultrafast Rectifier • Power pack • Glass passivated pallet chip junction • Ultrafast recovery time • Low switching losses, high efficiency • Low forward voltage drop • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package) • Solder dip 275 °C max. 10 | VISHAYVishay Siliconix 威世威世科技公司 | | ||
Ultrafast Rectifier FEATURES • Power pack • Glass passivated pellet chip junction • Ultrafast recovery time • Low switching losses, high efficiency • Low forward voltage drop • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package) • Solder dip 2 | VISHAYVishay Siliconix 威世威世科技公司 | | ||
Ultrafast Rectifier • Power pack • Glass passivated pallet chip junction • Ultrafast recovery time • Low switching losses, high efficiency • Low forward voltage drop • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package) • Solder dip 275 °C max. 10 | VISHAYVishay Siliconix 威世威世科技公司 | |
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
MOLEX/莫仕 |
2508+ |
/ |
309575 |
一级代理，原装现货 |
|||
PHI |
23+ |
10000 |
原厂授权一级代理,专业海外优势订货,价格优势、品种 |
||||
24+ |
N/A |
69000 |
一级代理-主营优势-实惠价格-不悔选择 |
||||
VIS |
24+ |
4470 |
|||||
VISHAY/威世 |
2407+ |
30098 |
全新原装!仓库现货,大胆开价! |
||||
Vishay |
24+ |
NA |
3000 |
进口原装正品优势供应 |
|||
PHI |
23+ |
SOD57 |
50000 |
全新原装正品现货,支持订货 |
|||
恩XP |
原厂封装 |
9800 |
原装进口公司现货假一赔百 |
||||
PH |
24+ |
原厂封装 |
2500 |
原装现货假一罚十 |
|||
恩XP |
2023+ |
TO-220 |
8800 |
正品渠道现货 终端可提供BOM表配单。 |
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BYWF29-200HE3SLASH45规格书下载地址
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DdatasheetPDF页码索引
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